Docstoc

cad it consultants (asia) pte ltd

Document Sample
cad it consultants (asia) pte ltd Powered By Docstoc
					1 ASEAN PLM (Product Life Cycle Management) Symposium/ th 5 ASEAN ANSYS Conference, 31 Mar & 1 Apr 2005, Singapore Adaptation – Strategies For Success & Survival Dear Sir/Mdm CAD-IT warmly invites you to join us in this ASEAN event. Our theme for the event is Adaptation – Strategies for Success and Survival. It is a proven fact that by leveraging on innovative technologies such as PLM solutions, many successful companies experiment often and early in today’s complex product development and manufacturing processes and are able to manage changes cost-effectively. Without such ability, success - not to mention survival is but a remote possibility in the jungle of global competition. At this event, distinguished guests from many leading organizations in diverse industries will share their experience regarding the impact of PLM in their organizations. Participants will have an excellent opportunity to network and learn how leading companies have succeeded from the successful deployment of PLM technologies. Key Highlights: • Guest Of Honor Address - Mr. S. Iswaran (Managing Director, Strategic Development, Temasek Holdings and Deputy Speaker of Parliament and MP for West Coast GRC) • Launching of CUPID – Creative Unit For Product Innovation And Development at Singapore Polytechnic • IP Management and Singapore’s Experience- Prof. Hang Chang Chieh (Director, Centre for Management of Science & Technology, National University of Singapore and Chairman of IP Academy) • PLM Showcases & Paper Contributions – 58 presentations by many successful customers in this region from diverse disciplines broadly grouped into 2 tracks – Electronics and General. Companies include ANSYS, ASM, Brilliant, Delphi, IHPC, Infineon, Hi-P, HP, Panasonic, Philips, NUS, NTU, ST Microelectronics, SIMTech, Texas Instruments, University of Malaya and Universiti Teknologi, Petronas. • Technological Updates - ANSYS Version 9.0 offering unparalleled usability, modularity and extensibility in an Integrated Product Development Environment, featuring tight integration of core technologies and Multiphysics solutions within the ANSYS Workbench. Enhancements abound, in advanced meshing, data interoperability, improved hybrid modeling, high-frequency Electromagnetics, Structural, Thermal and CFD ( CFX 5.7, ICEM CFD), advanced nonlinear mechanics, enhanced engineering data management capability, Design Modeler, optimization through DFSS Robust Design and parallel computing performance. • Pre and Post Conference Training – ANSYS V9.0, ANSYS First Time User, Finite Element Analysis In Electronic Packaging and CFX Basic, CFX Advanced Features Workshops/Courses are available before and after the conference. Each conference participant is entitled to ANSYS V 9.0 Workshop, daily Teas and Luncheon (for Conference/Symposium), a Gift Set comprising a high quality Computer Bag, Swiss Army Knife, CD Pouch, Conference proceedings (electronic format) and Training materials worth A Total Value of U$ 450 ! As seats are limited, please ensure your attendance is confirmed by faxing us your completed registration form NOW to Fax : 65-6454 3766 or register online via CAD-IT Website. Do feel free to contact Ms Lydia Chua (DID: 65-64505288, email: lydia.chua@cadit.com.sg) or Ms Janice Koh (DID : 65-64505213, email : janice.koh@cadit.com.sg) if you have any queries. We look forward to seeing you soon. Yours sincerely

st

Florence Tan Chief Operating Officer CAD-IT Consultants (Asia) Pte Ltd

159 Sin Ming Road #03-05 Amtech Building Singapore 575625 Tel : (65) 6454 3700 Fax : (65) 6454 3766 Email : sales@cadit.com.sg http://www.cadit.com.sg

CAD-IT Consultants (Asia) Pte Ltd

1st ASEAN PLM SYMPOSIUM / 5th ASEAN ANSYS CONFERENCE
Day 1 (Thur, 31 Mar 2005)
8.00 am
1

REGISTRATION Welcome Address Mr Timothy Kwan. (Business Manager, CAD-IT) Opening Address Mr. Terence Chan (CEO, CAD-IT) Guest Of Honor Address : Adaptation - Strategies for Success & Survival Mr. S. Iswaran (Managing Director, Strategic Development, Temasek Holdings and Deputy Speaker of Parliament and MP for West Coast GRC) The Power of Innovation Ms. Lily Chen (Applications Consultant, CAD-IT) CUPID – Creative Unit For Product Innovation & Development Mr Terence Chan (CEO, CAD-IT) Launching of CUPID - Signing of MOC Mr. Ong Eng Chan (Director, School of MM Engrg, Singapore Polytechnic,) & Mr. Terence Chan (CEO, CAD-IT) Keynote Address : Ansys' Vision and Strategy For Success Through Collaborative Engineering Mr. Brad Konno (Vice President, Japan Operations and CFX Asia Pacific Operations, ANSYS, Inc.) TEA BREAK IP Management and Singapore’s Experience Prof. Hang Chang Chieh (Director, Centre for Management of Science & Technology, NUS/ Chairman of IP Academy) Computational Science & Engineering in Singapore For Greater Competitiveness Dr. Loh Wah Sing. (Director, Business Development, Institute of High Performance Computing for A*Star) Successful Applications of ANSYS in Design for Reliability of IC Packages Dr. Tee Tong Yan ( CAE Team Leader, ST Microelectronics Singapore ) LUNCH Hewlett Packard – Maintaining Global Competitiveness in Product Development ASM - Empowering Innovation with CAE Mr. Narasimalu Srikanth (Technical Manager, ASM Technology Singapore) Up-front CAE in Product Development Mr. Leong Chee Seng (Manager , Mechanical Design, Delphi Automotive Systems ) Role of Simulation Tools and the Challenges Faced by Local Metal Forming And Plastic Molding Industries Dr. John Yong Ming Shyan (Group Manager, SIMTech) PLM - Bringing Research and Industry Together Dr. Lu Wen Feng (Senior Scientist/Program Head, SIMTech) TEA BREAK TO CONTINUE WITH 2 PARALLEL TRACKS GENERAL TRACK MICROELECTRONICS TRACK Goldfire Innovator In Research Mr. Chow Siew Loong (Senior Research Engr, SIMTech) ANSYS 9.0 Key Enhancements Mr Wang Wenping (Technical Manager, CAD- IT) ANSYS Workbench : Next Generation Productivity Tool Mr Wang Wenping (Technical Manager, CAD-IT) CFX5 - The Best-In-Class CFD Solution Mr. Brad Konno (Vice President, ANSYS, Inc.) Absolute and Relative Fatigue Life Prediction of Leadfree BGA Packages Mr. Ng Hun Shen (ST Microelectronics, Singapore) Solder Joint Fatigue Modeling with Field Life Prediction of FCBGA Package Mr. Goh Kim Yong (STMicroelectronics, Singapore) END OF CONFERENCE CFX5 - The Best-In-Class CFD Solution Mr. Brad Konno (Vice President, ANSYS, Inc.) CFD Analysis of Subway Ventilation Mr. Zhang Baili (IHPC) Design and Analysis of Automotive System Dr. Kang Jian (Applications Consultant, CAD-IT) Goldfire Innovator In Research Mr. Chow Siew Loong (Senior Research Engineer, SIMTech) ANSYS 9.0 Key Enhancements Mr Wang Wenping (Technical Manager, CAD-IT) ANSYS Workbench : Next Generation Productivity Tool Mr Wang Wenping (Technical Manager, CAD-IT) END OF CONFERENCE

8.30 am 8.35am 8.55am

9.15am 9.35 am 9.50 am 10.00 am 10.30 am 11.00 am 11.30 am 12.00 am 12.30 pm 1.30 pm 1.50 pm 2.10 pm 2.40 pm 3.00 pm 3.20 pm

3.50 pm 4.10 pm 4.30 pm 4.50 pm

5.10 pm

5.40 pm 6.00pm

Day 2 (Fri, 1 Apr 2005)
Time 8.00am 8.30am GENERAL TRACK REGISTRATION Getting It Right First Time With Moldflow Ms. Lily Chen (Applications Consultant, CAD-IT) The Impact of Using Moldflow in China Ms. Lily Li (Applications Engineer, CAD-IT) Getting It Right First Time With Anycasting Mr. Guan Wenhao, (R & D Manager, CAD-IT) A New Engineering Curve For Casting Technology. Mr. Guan Wenhao, (R & D Manager, CAD-IT) on behalf of Brilliant Manufacturing) TEA BREAK Study of Unsteady Cyclic Gas Flow Through Expansion/Resonance Chamber Mr. Wan Kok How (Panasonic Refrigeration Devices Singapore) Optimization of Side Keypad in Grassy Key Using Analytical Technique Mr. Jason Loh (Motorola Malaysia) Determinations of Drag and Lift using ANSYS CFD Flotran Simulation Mr. Chen Jiun Horng (Universiti Teknologi, Petronas) Brake Squeal Analysis Using ANSYS Mr. Cai Chao (IHPC) Collaborative PDM Bridges Islands Of Data – Smarteam Implementation In ABB Xiamen Mr. Guan Wenhao (R & D Manager, CAD-IT) LUNCH CFD Simulation in the Architectural Strategy for the Ventilation of Public Podium Spaces in a Local Commercial Building Dr. Alex Lee (IHPC) Fire modeling in a Steckler room with CFX 5 Mr. George Xu, (IHPC) MICROELECTRONICS TRACK REGISTRATION FEA Study of Flip Chip Interconnect Using PressureResistance Model Mr. Alfred Yeo (Infineon Technologies Asia Pacific) Viscoplastic Energy Dissipation Mechanisms in Al Based PRMMCs Mr. Narasimalu Srikanth (NUS) Simulations Using ANSYS for Ultra Fine Pitch Wire Bonding Mr. Ma Koon Shiong (NTU) Overview and Applications of Drop Impact Modeling Techniques Dr. Tee Tong Yan (ST Microelectronics Singapore) TEA BREAK 3D Simulation of Thermoset Flow in IC Packaging Mr Wang Wenping (Technical Manager, CAD-IT)

9.00am 9.30am

10.00 am 10.30am 11.00am

11.30am

Critical Analysis of Plastic Encapsulation Process of Wire Bonded IC Devices Mr. Narasimalu Srikanth (ASM Technology, Singapore) 150 Microns Bump Pad Pitch Development for Flip Chip BGA Packages Mr. Alvin Soria (Texas Instruments Philippines) Life Prediction Model of Lead-free BGA Packages under Drop Impact Dr. Luan Jing-en (STMicroelectronics, Singapore) Thermal Simulation and Transient CFD Analysis of Stacked Die QFN Package Mr. Ng Cheong Chiang (University of Malaya) LUNCH Computer Based Material & Assembly Process for Stacked Die QFN Package Qualification Mr. Azhar Aripin (ON Semiconductor Senawang) Effect of Initial Intermetallics Uniformity on High Temperature Reliability of Gold Wire Bonding Dr. Zhang Xueren (STMicroelectronics, Singapore)
A Case Study On Aluminum Nitride Substrate Of CATV Modules Using SEM/EDX Analysis And FEA Approach.

11.50am

12.10pm 12.30pm 1.00pm 2.00pm

2.20pm

2.40pm

Applying CFD Simulation to Analyze the Urban Heat Island Effect in Singapore. Ms. R. Priyadarsini (NUS) Bore Deformation Study by Percentage of Force Distribution of Threaded Connection. Mr. Chong San Haw (Panasonic Refrigeration Devices Singapore) TEA BREAK Modeling the Internal Flow of a Scaled-Up Diesel Injector Using ANSYS Flotran Mr. Chen Jiun Horng (Universiti Teknologi, Petronas) 2-D/3D Modeling of Micro-grippers Using ANSYS for Manipulation of Micro-parts Mr Nah Siew Kuan (Nanyang Technological University, Singapore) Simulation of Cold Forging by ANSYS/LS-DYNA Dr. Ding Yong Xiang (Simtech) Estimation of Magnetic Forces of a CD Disc Clamper using Ansys Mr. Subramanian N.R. (Philips Optical Storage, Singapore) END OF CONFERENCE

Ms. Eufrocina L. Aranda (Philips Philippines)

3.00pm

Collaborative PDM bridges islands of data – Smarteam Implementation in ABB XiaMen Mr Guan Wenhao. (R & D Manager, CAD-IT) TEA BREAK Investigations of Electromigration and Stress Migration Physics of Failures Using FEA Dr. Gan Zhenghao (NTU) Drop Impact Simulation using Implicit Input-G Method Dr. Luan Jing-en (STMicroelectronics, Singapore) Warpage Analysis and Thermo-Mechanical Stress Modeling of QFN Molded Strip Mr. Ng Cheong Chiang (University of Malaya) Calibration and Characterization of Impact Pulses using Simplified Dynamic Model Mr. Ng Hun Shen (ST Microelectronics Singapore) END OF CONFERENCE

3.30pm 4.00pm

4.30pm

5.00pm

5.30pm

6.00pm

REGISTRATION 1 ASEAN PLM SYMPOSIUM/ 5 ASEAN ANSYS CONFERENCE 31 Mar & 1 Apr 2005, Singapore
Code S1 W1 Title of Event Symposium & Conference (2-Day) Dates 31 Mar & 1 Apr 05 2 or 9 Apr 05 Early Bird Discount On or Before 21 Mar 05 After 21 Mar 05 Category 1 (per pax) U$ 300 U$ 400 Category 2 (per pax) U$ 400 U$ 500 Students (per pax) U$ 120 U$ 200
st th

+

ANSYS V 9.0 Workshop (1-DAY)

a

Note :
a) b) d) e) Each conference participant is entitled to : ANSYS V 9.0 Workshop, daily Teas & Luncheon (for Conference/Symposium), a Gift Set comprising a high quality Computer Bag, Swiss Army Knife, CD Pouch, Conference proceedings (electronic format) and Training materials worth A Total Value of U$ 450 ! Category 1 - Valid for customers with current maintenance agreements with CAD-IT. Category 2 - Valid for customers without maintenance agreements with CAD-IT. Fill and fax your completed registration form to Fax No: (65) 64543766 OR register online via CAD-IT Website.

Pre and Post ANSYS Workshops
Code W2 W3 W4 W5 Title of Workshop ANSYS 1st Time User Course (5-Day) Finite Element Analysis In Electronic Packaging Course (3-Day) CFX Basic Workshop (3-Day) CFX Advanced Features Workshop (2-Day) Dates 21, 22, 23, 24, 26 Mar 05 28, 29, 30 Mar 05 4, 5, 6 Apr 05 7, 8 Apr 05 Category 1 (per participant) US $ 1,250 US $ 1,200 US $ 1,000 US $ 700 Category 2 (per participant) US $ 1,550 US $ 1,500 US $ 1,300 US $ 1,000

*

CAD-IT reserves the right to revise schedule/venue of workshop depending on registration capacity.

Venue
Symposium/Conference : Goodwood Park Hotel, The Tudor Ballroom, 22 Scotts Road Singapore 228221 Workshops : CAD-IT Office, 159 Sin Ming Road, #03-05 Amtech Building, Singapore 575625

Name of Participant/s 1. __________________________________ email : ____________________________ 2. __________________________________ email : ____________________________ 3. __________________________________ email : ____________________________ Dietary preference : N - No preference

Designation

Tick one

Symposium/Conference

Indicate Preference W1__ W2__ W3__ W4__ W5__

Workshops

_______________
DID : __________________

General __ Micro __ Meals __

_______________
DID : __________________

General __ Micro __ Meals __ General __ Micro __ Meals __

W1__ W2__ W3__ W4__ W5__

_______________
DID : __________________ V - Vegetarian

W1__ W2__ W3__ W4__ W5__

M - Muslim

O - Others , pls specify.

*Meals are applicable only to Symposium/Conference. Company : ______________________________________________________ Tel : ________________________ Fax : ___________________ Address : __________________________________________________________________________________________________________________________

Hotel Reservation
Please arrange accommodation for me at The Goodwood Park Hotel. Deluxe Room - Single, (Including breakfast for 1 person.) SIN $ 203.96 nett Number of Room(s) : _______ Deluxe Room – Twin Sharing, (Including breakfast for 2 persons) SIN $221.45 nett. Number of Room(s) : _______ * All accommodation costs will be borne by overseas participants.

Method of Payment
Attached is my Cheque No.: ___________________________ Total Amt : __________________________ Bank : _______________________ Note : a) All prices are subjected to 5% GST charge. b) Currency exchange rates will be based on the date of invoicing. c) Cheques are to be crossed and made payable to CAD-IT Consultants (Asia) Pte Ltd and must reach CAD-IT (Mailing Address: 159 Sin Ming Road, #03-05 Amtech Building, Singapore 575625) before 25 Mar 2005. For any queries, please contact : Ms Janice Koh (DID : 65-64505213, email : janice.koh@cadit.com.sg) , Ms Lydia Chua (DID : 65-64505288, email : lydia.chua@cadit.com OR call our MAIN Line at 65-64543700.


				
DOCUMENT INFO
Shared By:
Stats:
views:220
posted:12/17/2009
language:English
pages:4
Description: cad it consultants (asia) pte ltd