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					UPW

H2SO4, O3

UPW

APM 0.25:1:5

UPW

HPM 0.25:1:5

UPW

C/C

Piranha

OFR

SC-1

H/C QDR SC-2 Particle deposit heavily

H/C QDR

Particle / ml

Critical metal in ppt

TOC in ppb

Non critical ion in ppt

Rinse

Rinse

Rinse

Interpretation

Organics introduced afterwards are dangerous

DHF 100:1

UPW
Megasonic

UPW

IPA

DHF

OFR

FR

IPA dryer

Under etching

Lift off

Rinse

Rinse

Rinse

ITRS - Mixing Calculations CalcSheet
UPW Contaminant Particle / ml >= critical particle size Critical metal in ppt Non critical ion in ppt TOC in ppb UPW Contaminant Particle / ml >= critical particle size Roadmap 0.2 HCl 37% HCl 37% Dilution used Roadmap Basis 5 : 1 (POC) (POU) 0.2 10 50 4.7 1 1000 1000 91.8 50 10000 10000 954.5 1 TBD HF 49% HF 49% Roadmap Basis (POC) (POU) 10 10 5 1.4 Dilution used 10 : 1 1.1 545% Delta HCl 37% Basis 2364% 9182% 1909% 136% Delta HF 49% 50 1000 10000 5 Dilution used 50 : 1 0.7 10.9 148.5 1.0 Dilution used Delta Importance (Critical impurity/ step) Comment FEP, Laszlo 347% Yes, if pH of bath is lower than 2.5 1089% No, metal remains in solution 297% No, metal remains in solution 104% Medum, UPW rinse follows Delta comment Martin

YE WECC - Process Chemicals

Roadmap / Basis

Yes, if pH of bath is lower than 2.5 No, metal remains in solution No, metal remains in solution found impact from TOC out of H2O2 in SC2 step

Roadmap 100 : 1 10 0.3 Yes, if pH of bath is lower than 2.5, but fact Yes, if pH of bath is lower than 2.5 and higher sticking tha wafers are hydrofobic is related with coefficients on hydrophobic surfaces UPW not with HF Fe OK; Cu and other noble metals could be an issue; CaF2 do not precipitate on wafer!! Cu, Ni, 248% calcium fluoride may form precipitate/particles, but do Pt are issue (X-contamination). Reduced by not precipitate adding HCl Chloride, might even prevent metal deposition (critical Low Cl accelarates deposition!! (IMEC Ivo 109% concentration) Teerlink) 104% Yes could be an issue, if final step BOE is not diluted with water 40%/ NH4F / 15% HF Yes, if pH of bath is lower than 2.5 and higher sticking pH of BOE ussually > 4. However, due to coefficients on hydrophobic surfaces, NH4F influences salt effect on electrostatic double layer the electrostatic layer particle deposition can be enhanced CaF2 do not precipitate on wafer!! Cu, Ni, Pt are issue (X-contamination), but might Fe OK; Cu and other noble metals could be an issue; be relaxed by presence of ammonia. Cu is calcium fluoride may form precipitate/particles complexed and will be less critical than in HF Chloride, might even prevent metal deposition (critical Low Cl accelarates deposition!! (IMEC Ivo concentration) Teerlink) many yeasr surfactants were added. No Yes could be an issue, if final step real issue 149% Delta

Critical metal in ppt Non critical ion in ppt TOC in ppb Contaminant Particle / ml >= critical particle size

1 50 1

150 500 TBD

150 500 5000

14.5 90.9

1455% 182%

150 500 5

2.5 54.5 1.0

455.5 45545%

Critical metal in ppt

Non critical ion in ppt TOC in ppb H2O2 30% Roadmap Roadmap / Basis (POC) UPW Contaminant Particle / ml >= critical particle size Critical metal in ppt Non critical ion in ppt TOC in ppb (small organic acids more an issue -- chemical bonding may not release during furnace step, and would then leave defect) Resin by-products 0.2 1 50 1000 150 500 H2O2 30% Basis (POU) 1000 150 500 Dilution used in Fab 5 : 1 166.8 83417% 25.8 125.0 2583% 250% Delta H2O2 30% Basis 1000 150 500 Dilution used in Fab 50 : 1 19.8 3.9 58.8

9902%

Particle will be removed in SC1 (HPM), but could be critical in SPM/SC2 (APM), if pH < 2.5 Most critical in SC1, rinse follows but not always can 392% remove Al, Cr, Fe (trivalent metals) & Ca; No issue for SC2 SC1 could be issue, no issues for SC2. Shelf life may 118% be impacted e.g. by iodine 108%

See no issue in SPM. Critical in SC2 agree agree with shelf life, but few possibilities of being present (KI for etching Au) SC1 no issue, but in SC2 seen to be an issue. SC1 no issue, but in SC2 seen to be an issue.

1

TBD

5

1.7

167%

5

1.1

TBD NH4OH UPW 29% Roadmap Roadmap / Basis (POC) 0.2 1000 1 50 1 150 NH4OH Dilution used NH4OH Dilution used Delta 29% in Fab 29% in Fab Basis 5 : 1 Basis 80 : 1 (POU) 1000 166.8 83417% 1000 12.5 150 500 5 H2SO4 98% Basis (POU) 1000 150 500 5 25.8 125.0 1.7 Dilution used in Fab 1 : 1 1000 150 500 3 100% 100% 100% 550% 2583% 250% 167% Delta 150 500 5 H2SO4 98% Basis 1000 150 500 5 2.8 55.6 1.0 Dilution used in Fab 1: : 10 1000 150 500 5 only if not followed by SC1 or HF, residual sulfate on surface may create particles again. Fe-Nitrate-Sulfate complex could be an issue; calcium 100% sulfate may form precipitate/particles 100% Not critical No, will be oxidized and removed, but will depend on 996% organic type 100% Delta

Contaminant Particle / ml >= critical particle size Critical metal in ppt Non critical ion in ppt TOC in ppb

Contaminant Particle / ml >= critical particle size Critical metal in ppt Non critical ion in ppt TOC in ppb

500 TBD H2SO4 H2SO4 98% Roadmap Roadmap / Basis (POC) 1000 150 500 0.5 1000 150 500 TBD

6272% No, particle will be removed Most critical in SC1, rinse follows but not always can 284% remove Al, Cr, Fe (trivalent metals) & Ca, Cu is complexed and will be less critical than in HF 111% Issue 105% Unknown Delta

agree agree bath&Iodine yes. Rest no agree

remark nothing to do with particles in H2SO4. Non-issue never ssen issue agree agree

Rev 3 + May 6, 2005 dbf29fbf-0a0c-4958-948d-e7c9414502d8.xls, MixingCalc (2) 11/27/2009

Page 3 of 6

ITRS - Mixing Calculations CalcSheet
UPW Contaminant Particle / ml >= critical particle size UPW Contaminant Particle / ml >= critical particle size UPW 0.05 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1 1.5 2 HCl36% Dilution used 5 10 H2O2 30% : 1 1.8 Dilution used in Fab 5 1000 Mixt 20:1 0.5 0.6 0.7 0.8 0.9 1.0 1.0 1.1 1.2 1.4 1.9 2.4 : 1 166.8 83417% 917% Delta H2O2 30% Basis 1000 Delta HCl36% Basis 10 Dilution used 20 : 1 0.7 Dilution used in Fab 20 : 1 Delta

YE WECC - Process Chemicals
Importance (Critical impurity/ step)

Roadmap / Basis POE 0.2

333% Yes, if pH of bath is lower than 2.5 Delta

Roadmap / Basis POE 0.2

47.8 23905% Yes, if pH of bath is lower than 2.5

3 2.5
Part in #/ml (Mixture 20:1)

2
1.5 1

0.5 0 0 0.5 1 1.5 Part in #/ml (UPW) 2 2.5

Rev 5 + June 6, 2006 dbf29fbf-0a0c-4958-948d-e7c9414502d8.xls, MixingCalc 11/27/2009

Page 4 of 6

ITRS TWG FEP SurfPrep FEP SurfPrep FEP SurfPrep YE/WECC YE/WECC YE/WECC Ratio

Year Critical particle diameter in nm Counts per wafer Counts per wafer (converted to 50 nm) Critical particle diameter in nm Counts per liter UPW Counts per liter UPW (converted to 50 nm) Counts per wafer (converted to 50 nm) / Counts per liter UPW (converted to 50 nm)

2005 40.1 94.2 48.6 40 200 102.4 0.47

2006 35.7 59.3 21.6 35 200 68.6 0.31

2007 31.8 75.2 19.3 33 200 57.5 0.34

2008 28.4 94.8 17.4 29 200 39.0 0.45

2009 25.3 59.7 7.7 25 200 25.0 0.31

2010 22.5 75.2 6.9 23 200 19.5 0.35

2011 20.1 94.8 6.2 20 200 12.8 0.48

2012 17.9 135.3 6.2 18 200 9.3 0.67

2013 15.9 170.4 Log law 5.5 16 200 Log law 6.6 0.84

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