Docstoc

Advanced VLSI Design - Washington State University

Document Sample
Advanced VLSI Design - Washington State University Powered By Docstoc
					      EE 587
 SoC Design & Test

      Partha Pande
     School of EECS
Washington State University
  pande@eecs.wsu.edu




                              1
Final Exam Review




                    2
            System Level Design Issues

•   SoC Interconnection Architectures
     – Drawback of bus-based systems in terms of timing, power
       and other relevant parameters
•   Role of parallelism
•   Problem with long wires
     – Buffer Insertion
     – Problems with classical buffer insertion
     – How to deal with that
•   Multi-processor SoC (MP-SoC) platform design




                                                                 3
                      Signal Integrity

•   Crosstalk Avoidance
     – Comparative study of different CAC schemes
     – How to cascade multiple CAC blocks for a wide bus so that
        there is no crosstalk between two sub blocks
•   Except coding what are the different methods of reducing
    coupling
•   Effect of inductance on buffer insertion
•   Effect of inductance on propagation delay
•   Electromigration
•   L di/dt noise
•   Decoupling capacitance
•   IR drop in power lines


                                                                   4
                Clock & Power Routing

•   How to control IR drop and L di/dt noise
•   What is the advantage of interleaved power & ground routing
•   Different ways of reducing power in clocking
•   Different clock routing mechanisms
•   Advantages Tapered H-tree
•   Configuration of gated clock




                                                                  5
                        SoC Testing

•   What are the principal challenges in SoC testing
•   Design of scan flip-flop
•   How can you modify a pass transistor-based latch to make it
    scanable
•   JTAG instructions
•   LFSR pattern generation
•   Given a polynomial you need to derive the LFSR configuration
•   How you can modify a BILBO for different modes of operations




                                                                   6
                         IDDQ Testing

•   What is bridging fault and how you can detect it
•   Applicability of IDDQ test in SoCs, what is the challenge?
•   How to switch off static current dissipating components for IDDQ
    testing. You need to explain with the help of proper circuit level
    design details
•   Relation between JTAG and IDDQ testing




                                                                     7
Iddq Testing in SoC




                      8
             Methods of Reducing Power

•   Architectural Decisions – has the highest impact (parallelism,
    pipelining, low activity designs, lower frequency operation )
•   Circuit Techniques – gated clocks, low glitch circuits, reduce
    capacitances, reduce activity
•   Recent developments – Vdd scaling, VT adjustments
•   Software – low power instructions, algorithms
•   CAD tools to implement low-power techniques




                                                                     9
                 Circuit Design Styles

•   Nonclocked Logic
     – CMOS, Pseudo-NMOS, Differential Cascade Voltage Switch
       (DCVS), Pass-Transistor
•   Clocked Logic
     – Domino, Differential Current Switch Logic (DCSL)




                                                            10
                  Circuit Design Styles

•   Advantages of DCSL gates
•   Principle of skewed CMOS
•   Dependence of short circuit current & leakage current on the
    skew ratio
•   Role of Vdd and Vt scaling
•   Principle of MTCMOS
•   Difference between logic and memory circuits in terms of Vdd
    and Vt scaling




                                                                   11
                                 MTCMOS




• In active mode, low-VT MOSFET’s achieve high speed.
• In standby mode when St'by signal is high, high-VT MOSFET’s in series to
normal logic circuits cut off leakage current.




                                                                             12
                       Issues in MTCMOS


• Virtual ground not actual ground (lose some noise margin)
• Can increase width of sleep transistor to reduce voltage at virtual ground but
it will also increase subthreshold leakage and area of sleep transistor




                                                                             13
                Variable Threshold-CMOS




• Threshold voltage of both devices are increased by adjusting the body-bias
voltage in order to reduce subthreshold leakage current in standby mode
• Requires twin-tub technology so that substrates of individual devices can be
adjusted




                                                                               14
                 Low Swing Interconnects

•   Dynamically Enabled Drivers
•   Low Swing Bus
•   Different level converter circuits




                                           15
            Dynamic Power Management

•   Dynamically reconfigures an electronic system to provide the
    requested services and performance levels with a minimum
    number of active components or a minimum load on such
    components
•   Selectively turns off or reduce the performance of idle or
    partially unexploited components




                                                                   16
                     DPM Techniques

•   Predictive Technique
•   Static Technique
•   Adaptive Technique
•   Clock gating
•   Supply shut down




                                      17
              Low Power SRAM Design

•   Banked Organization
•   Divided Word Line
•   Pulsed Word line
•   Bit Line Isolation
•   Suppressing leakage in SRAM




                                      18
                        Power & BIST

•   Modern design and package technologies make external testing
    increasingly difficult, and BIST has emerged as a promising
    solution to the VLSI testing problem
•   BIST is a DFT methodology aimed at detecting faulty
    components in a system by incorporating test logic on chip.
•   In BIST, an LFSR generates test pattern
•   LFSR-generated tests tend to take longer to reach acceptable
    levels of fault coverage, which increases the total energy
    consumption
•   Test vectors applied at nominal operating frequency will have a
    higher average power dissipation than normal mode. This is
    because in normal mode, successive functional input vectors
    applied to a given circuit have significant correlation; the
    consecutive vectors of an LFSR generated test sequence have
    a lower correlation.

                                                                  19
                     Final Exam

•   6-7 questions
•   Wire Engineering, SoC Design & Test, Low Power Design
      – These broad topics will be equally represented
•   Try to answer as much as you can
•   I will be testing you on whatever I have taught
•   Class Notes are very important




                                                            20

				
DOCUMENT INFO
Shared By:
Categories:
Tags:
Stats:
views:0
posted:4/27/2014
language:English
pages:20