Docstoc

PowerPoint Presentation - TeleSoft Partners

Document Sample
PowerPoint Presentation - TeleSoft Partners Powered By Docstoc
					Company Overview
   Dec., 2004
                                Matrix Semiconductor:
                       Commercializing 3-D Integrated Circuits

§ Technology: Breakthrough Technology
   v First high-volume approach to building ICs in three dimensions
   v Producing ultra-dense, low-cost chips


§ Products: Combining new value with backward compatibility
   v Lowest price points for high density, field programmable memory
   v 100 year archival storage
   v Compatible with existing memory card formats


§ Markets: Large, High Growth Consumer Applications
   v Pre-recorded content for a wide array of portable electronics
   v Consumable blank media for personal data storage (pictures, music, video, etc.)


§ Partnerships: Coming to Market with Established Leaders
   v Fabless manufacturing via TSMC, Amkor, Source Electronics
   v Market entry via leadership brands
                                                                                       2
                                    Matrix Company Profile

            Management Team                          Investors
Dennis Segers       CEO & President
Matt Crowley        VP Product Development
Geoff Ribar         CFO
Siva Sivaram        COO
Dan Steere          VP Sales & Marketing
Liza Toth           VP Intellectual Property


     Board of Directors
Arjun Gupta            Atiq Raza
Bruce Dunlevie         Mark Evans
Dr. Mike Farmwald     Prof. Tom Lee
Bill Ruehle            Dennis Segers
Tom Goodrich

                                                                 3
                             Aren’t All ICs 3-D?


                     Typical Memory IC



              Memory Cell
              Array
                                                      Support
                                                      Circuits




Strip away the multiple layers of interconnect & all ICs are 2-D.
Strip away the multiple layers of interconnect & all ICs are 2-D.

All active circuits are confined to the surface of the silicon wafer.
All active circuits are confined to the surface of the silicon wafer.
                                                                        4
                           Why Build 3-D Chips?


        Building Cells Above the Silicon Surface


                Polysilicon
              Memory Cell
             Array
                                                     Support
                                                     Circuits




Using techniques from LCD manufacturing, Matrix builds active circuits
 Using techniques from LCD manufacturing, Matrix builds active circuits
above the Si surface in layers of deposited Polysilicon.
 above the Si surface in layers of deposited Polysilicon.
                                                                          5
                                Why Build 3-D Chips?


             Building Cells Above the Silicon Surface




                                                               Support
                                                               Circuits




The benefit of using deposited Polysilicon is that you can easily add more layers.
 The benefit of using deposited Polysilicon is that you can easily add more layers.

  Instead of having all of the memory cells spread out on a single 2-D plane…
                                                                                  6
                               Why Build 3-D Chips?


3-D Cell Array




                                                                      Support
                                                                      Circuits




         …we can divide up the cells into multiple, smaller layers.

 We have now moved the cell arrays above the silicon surface and can move
 We have now moved the cell arrays above the silicon surface and can move
 much of the support circuitry under the array.
 much of the support circuitry under the array.
                                                                                 7
                 A Matrix 3-D Memory IC

               3-D Cell Arrays




               Support Circuits

3-D Construction Enables Higher Density at Low Cost
3-D Construction Enables Higher Density at Low Cost
                                                      8
Matrix 3-D Memory




            Industry’s Highest
             Industry’s Highest
              Density Memory
              Density Memory
                Technology
                Technology


           Smallest Die Sizes for
           Smallest Die Sizes for
            High Capacity Data
            High Capacity Data
                 Storage
                  Storage



                                    9
       Matrix 3-D Memory




• Standard CMOS Process
  Techniques
• No New Materials
• No New Equipment




                           10
                                     Matrix 3-D Memory

§ High-Density Nonvolatile Memory (NVM)
    v Lowest cost per bit available
    v Currently shipping 128Mb – 512Mb

§ Field-Programmable

§ Archival Life > 100 years

§ Compatible with Existing Standards
    v Fits in millions of existing slots
    v Specs optimized for use in
      standard digital devices



          Ideal Feature Set for Mass Market Digital Memory
           Ideal Feature Set for Mass Market Digital Memory
                                                              11
                                   Initial Target Markets

§ Pre-recorded Content Distribution
    v   Game cartridges and cards
    v   Kid’s Video
    v   Record albums
    v   Software applications and updates




§ Consumable Blank Media
    v Consumable memory cards for digital cameras, MP3 players, PDAs, cell phones, etc.




                                                                                      12
                    Portable Games & Video Entertainment

§ With Mask ROM, programming is done during wafer construction:
    v Requires long forecasts and large minimum commitments
    v Revenue hit from both over- and under-supply


§ Matrix offers:
    v Lower cost memory
    v Higher density for
      advanced
      functionality
    v Ability to program
      close to sale to
      optimize sales mix
    v Reduced inventory
      costs and risks


                                                                  13
           Content for a Growing Base of Wireless Devices

§ PDA, cell phone & gaming markets are growing rapidly. Expansion slots
  are becoming standard.




                        Source: IDC, Semico, Garmin, Magellan



§ Selling content for these applications – games, maps, dictionaries,
  music, software, etc. – viewed as strategic revenue opportunity by CE
  suppliers.                                                              14
                                Consumable Blank Media

§ Digital applications need a consumable media option
   v Currently, Digital Camera = PC peripheral
   v Mass market penetration requires an easy, affordable media alternative
§ Matrix 3-D Memory enables media that is convenient, affordable, and
  secure
   v Bought like film or CDs in multi-packs at checkout,
    extra capacity is always available
   v Provides an automatic high-quality archive, protecting against
     accidental erasure, hard drive crashed, viruses, etc.




 Consumables sell in the billions of units (~3B 35mm rolls of film per year)
 Consumables sell in the billions of units (~3B 35mm rolls of film per year)
                                                                               15
                                    Market Opportunity

§ Nonvolatile data storage growing at 37% CAGR over next 5 years
    v Reaches $16 Billion by 2007




                                                              Semico




          With its cost and density advantages, Matrix 3-D Memory
          With its cost and density advantages, Matrix 3-D Memory
              can address a significant share of these markets
               can address a significant share of these markets        16
                          Highly-Focused Business Model

§ Hands-on Development with Fabless Manufacturing
   v Local Process R&D through partnership with Cypress Semiconductor
   v Production wafer fabrication at TSMC
   v Production test & packaging at Amkor
   v Content programming services through Source Electronics


§ Benefit from $Billions Invested in Silicon and IC Development
   v Partner with the fabless leaders gaining access to their infrastructure, resources, and
     experience
   v Ramp quickly to high volume and scale with the rest of the industry


§ Come to Market Under the Most-Recognized Consumer Brands
   v Matrix will be a memory company, not a consumer products company


§ Focus on Technology and Product Development
   v Limit overhead by outsourcing all functions that are not core-competency
   v Matrix retains ownership of all intellectual property                                     17
                     Business Model




§ Gross Margin       30-40%

§ R&D                10-12%

§ SG&A                8-10%

§ Operating Income   15-20%




                                      18
                                      Current Status

§ Our core technology is proven
    v   Reliable
    v   Archival
    v   Manufacturable
    v   Supported by over 85 US patents issued and >125 pending


§ 2nd Generation product started production in July 2004
    v Over 2 Million units shipped into retail applications
    v Quality proven at some of the best electronic companies in the world
    v Strong and growing customer list and backlog


§ We plan on achieve profitability during the second half of 2005




                                                                             19

				
DOCUMENT INFO
Shared By:
Categories:
Tags:
Stats:
views:1
posted:7/15/2013
language:Latin
pages:19