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					                  Pixel Testbeam July 2003




               Daniel Dobos
               University Dortmund
               13.08.03 – E4 ATLAS-/Si-Meeting




Daniel Dobos     University Dortmund   Pixel Testbeam July 2003   13.08.03   1
 Testbeam setup




  testbeam setup moved some meters upstream to the NA45 area since may testbeam
  new pixel telescope (Genova telescope) inserted for high intensity runs in may testbeam and is now used together with
  the Bonn Telescope for particle tracking
  diode in the Genova Telescope generates additional trigger signal to the scintillator and Bonn Telescope trigger and
  increases particle scattering
  testing of modules requires cooling them in the testbeam box – testing single chips uncooled at room temperature
  new nitrogen flooded anti frost box prevents condensation on the turning mechanics of the testbeam box

Daniel Dobos          University Dortmund                    Pixel Testbeam July 2003                 13.08.03     1
 Cooling of the modules
  new copper plates for modules made
  each module plate is cooled directly with
  chiller liquid running through a copper
  tube
  tried use Lauda RC20 and Julabo FP50
  with 2 modules each but Lauda chiller is
  to weak – FP50 used for all 4 modules
  better cooling of the nitrogen with
  conducting it through a first heat
  exchanger placed directly in the tank of
  RC20 and through a second heat
  exchanger in a paper box isolated with
  polyurethane foam and cooled with the
  F32 chiller
  new routing of the nitrogen flow:
  nitrogen is blown directly to each module
  and is helping to cool the modules
  carbon-carbon plates are glued on the
  FE's side of each module for better heat
  conduction with additional use of Dow
  Corning 340 silicone heat sink
  compound
  moving of the box and turning of the
  box can be remote controlled from CR
  DCS is monitoring the temperatures of
  the copper plate in two points, the
  carbon-carbon plate & the module NTC
  for each module and the air temp. and
  humidity of the box additionally
  modules can be tested at about -6°C,
  needs improvement to reach ATLAS
  conditions about -10°C
Daniel Dobos         University Dortmund      Pixel Testbeam July 2003   13.08.03   1
 Data flow and power supply

   each module is connected with a type0 cable with the PP0
   replacement card
   same regulator board used as in Systemtest in Wuppertal in
   June to power the modules – same problem: VDDA & VDD
   are oscillating if the cables to the power supplies are to
   short or the regulator of the power supplies work to fast =>
   high noise
   first used modularity two (one power supply for two
   regulator channels) but because of the above mentioned
   problems changed later to modularity one
   new PP0 replacement card is used to read out the four
   modules with a TPCC for each module and can handle up to
   seven modules
   DAQ has to handle now 5 TPLLs (one for each module and
   one for the Genova Telescope) and the BlueBoard Interface
   for the Bonn Telescope => problem of scalability, DAQ very
   unstable since last testbeam: doesn't recognises trigger
   events, hangs during and during stopping runs, hangs when
   modules are to noisy, sometimes doesn't read out the
   Genova Telescope => we're losing much time restarting the
   DAQ, sometimes after every run => needs improvement
   DCS is working stable – still some little bugs in the DCS
   software – no problems with controlling the ISEG since new
   iseg.dll is used
   documentation is still a problem – more easy problems
   could be solved by shifters without an expert – but is
   getting better (DCS and DAQ documentation started) –
   maybe a website with all important information like
   schematics of used components and user guides should be
   set up

Daniel Dobos          University Dortmund                     Pixel Testbeam July 2003   13.08.03   1
 new testbeam setup in NA45 area




Daniel Dobos   University Dortmund   Pixel Testbeam July 2003   13.08.03   1
 modules mounted in the testbeam box




Daniel Dobos   University Dortmund   Pixel Testbeam July 2003   13.08.03   1
 PP0 replacement card




Daniel Dobos   University Dortmund   Pixel Testbeam July 2003   13.08.03   1
  measurements taken

   first week: irradiated modules Ge18 (Tesla) and Bn12 (CiS) at -6/-7°C
             0 deg: all chips at 600 V, for chip D scan in voltage: 700, 600, 550, 500, 450, 400,
           350, 300, 250, 200
         10 deg: for chips 1, 6, B, C, scan in voltage: 700, 600, 550, 500, 450, 400, 350, 300,
       250, 200
         20 deg: for chips 1, 6, B, C, scan in voltage: 700, 600, 550, 500, 400, 450, 350, 300,
       250, 200
         30 deg: for chip 1 scan in voltage: 700, 600, 550, 500, 400, 350, 300, 250, 200
             for chips 6, B, scan in voltage: 600, 550, 500, 450, 400, 350, 300, 250, 200
             for chip C, scan in voltage:     600, 500, 400, 300
             Irradiated modules:
             second week: irradiated modules Bn12, Ge18 and Ge14 at -6/-7°C
             Chip C and chip D: 0 deg: 600 Volt
                   5 deg: 600 V
                   10 deg: 600 V
                   15 deg: 600 V
                   20 deg: 600 V
           30 deg: Voltage scan (300, 400, 500, 600, 700)
             Corner between 4 chips (C32D): Angular scan and Voltage scan
             Chip 9: 30 deg, Voltage scan
             Single chips: FEI2_SCC5, FEI2_SCC2, FEI2_IZM_2D at room temperature
                   angular scan with beam centered on each chip (0 deg, 10 deg, 20 deg, 30 deg)
                   high event run 700k at 0 deg for time walk



Daniel Dobos      University Dortmund              Pixel Testbeam July 2003           13.08.03   1
 to be analysed...




Daniel Dobos   University Dortmund   Pixel Testbeam July 2003   13.08.03   1

				
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posted:4/14/2013
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