Attention: Tan Teck Chun Institute of Microelectronics
Tel: (65) 6770 5409 11, Science Park Road
Fax: (65) 6774 5747 Science Park II
Email: firstname.lastname@example.org Singapore 117685
12th Electronics Packaging Research Consortium (EPRC 12)
Membership Reply Slip
• Please indicate your interest in our consortium by completing this reply slip and faxing it to us by 17 Sept 2012.
• Upon receiving your reply slip and confirmation of no. of members for the projects, we will send you a draft legal
agreement for review. All reviews to be completed by 14 Nov 2012(proposed).
• Your participation in this consortium will only be confirmed upon the signing of the legal agreement.
• It is scheduled to sign an agreement with the member companies on 21 Nov 2012 (proposed).
We agree to participate in the this consortium under the name of______________________
(Registered Company Name). Our level of participation is (please tick the relevant box) : -
Core Member - Associate Member -
Project Title Membership Fee (S$) Membership Fee (S$)
Cu Pillar Interconnect and CPI on Advanced Cu
Low K Chip
Embedded Cooling Solution for 3D Stack Chip $80,000/= $60,000/=
Development of Power Module for Device
Temperature over 220°C
Thin Wafer Handling for 3D Packaging $80,000/= $60,000/=
3D-Embedded WLP $80,000/= $60,000/=
Our participation is conditioned on our review, acceptance, and signature of the member legal
agreement. Our only obligation to this project, if any, will be the terms and conditions contained in
the member agreement which we sign.
Signed by for and on behalf of,
Company : Email :
Signature : Tel :
Name : Fax :
Title : Date :
• Information of these project are described in the proposals dated 15 Aug 2012
• Payment terms are shown below:
• 50% upon signing; 50% (9 months into project)
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