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   Microcontrollers
   Tools & Software
   Computer-on-Module
   Industrial Computing

EBVchips gains momentum
in the embedded marketplace
    the future need
    it is generated
    smart energy solutions.


    e       e
                              e   e


ds drive.



                25th International Trade Fair
                for Electronic Components,
                Systems and Applications
                Messe München
                November 13–16, 2012

Dear Readers,
                                     Once again this issue of ECE mag-
                                     azine highlights some of the major
                                     trends in the embedded market-
                                     place. The first one - becoming a
                                     solution provider - isn’t really new,
                                     but reached new levels. Two years
                                     ago EBV created the so called
                                     EBVchips program in which the
                                     distributor started to develop spe-
                                     cialised semiconductor products
                                     for customers. These new products
                                     are closing the gap between appli-
                                     cation specific standard products
                                     (ASSPs) and application specific
                                     integrated circuits (ASICs). ASICs
                                     are or would be often the optimal
                                     solution for certain applications
of one user but are not economical due to the inherent high develop-
ment and NRE cost. It needs extremely high volume to justify their
use. In addition – once developed – they are not flexible enough, to be
adapted to new requirements. ASSPs are very similar o ASICs but not
limited to one user they serve a certain application for multiple users.

According to Wikipedia is an ASSP an integrated circuit that implements
a specific function that appeals to a wide market. As opposed to ASICs
that combine a collection of functions and designed by or for one cus-
tomer, ASSPs are available as off-the-shelf components and are used
in all industries, from automotive to communications. Examples of
ASSPs are integrated circuits that perform video and/or audio encoding
and/or decoding. EBVchip products are comparable to ASSPs but are
virtually free of development and NRE cost for the user – this is taken
over by the distributor. Therefore he has to decide whether the
product to develop has a suitable market potential to create additional
revenue for both the manufacturer und the distributor. If this is the
case a triple win situation is created: more revenue for the manufacturer
and distributor and a optimized device for the user. In the meantime
this advantage is well accepted in the embedded market place – there
are over 20 projects in the pipeline and the results of some of them
will be presented at electronica 2012 in Munich. In our cover story the
first two products in the EBVchip program are described and I m
curious about what we will see at electronica.

Further major trends are energy saving, interconnection via the
internet, and even energy harvesting. It is becoming increasingly
clear that energy saving is a holistic occupation – it cannot be done in
isolation. However, implementing such a holistic approach requires
that product designers, architects and IT professionals have at their
disposal a technique for interconnecting e.g. all types of things within
buildings – and beyond to the wider internet. This not only allows re-
mote devices and central computers to control the operation of indi-
vidual elements, it also permits feedback and monitoring that enables
more sophisticated control strategies. Smart energy technology already
exists to cost-effectively embed great intelligence in individual products
and appliances. You ll find examples for these trends in his issue, too.


Yours sincerely
Wolfgang Patelay

                                    3                         June 2012

Viewpoint                                                3
                                                                 Cover Story:
Cover Story
                                                                 EBVchips gains momentum
EBVchips gains momentum
in the embedded marketplace                              6
                                                                 in the embedded marketplace                                 PAGE 6
                                                                                                       The idea behind EBVchips as
Microcontrollers                                                                                       a distributor not only selling
                                                                                                       suppliers’ products but also
Wireless-enabled MCUs – joining the                                                                    designing specific semicon-
dots to reveal the energy-saving future                  9                                             ductor products based on the
Highly integrated single-chip solution                                                                 requirements of its customers
for healthcare applications                             12                                             was born in 2010, and is
                                                                                                       now well accepted in the
Driving costs out of your                                                                              embedded industry. Antonio
motor control inverter                                  14                                             Fernandez, Director Technical
                                                                                                       Marketing, EBV, explains the
Tools & Software                                                                                       reasons for this new service
                                                                                                       and gives an overview of the
Lifecycle collaboration unlimited
                                                                                                       current situation and the
by proprietary tool bridges                             17
                                                                                                       future roadmap.
Design kit enables making the most
of self-powered sensors                                 20
                                                                 Highly integrated single-chip solution
Avoid enemies and make friends
with embedded open source software                      22       for healthcare applications                                PAGE 12
Verification of FPGA software:                                   This article describes a single-chip solution featuring what is cur-
a simulating issue                                      24       rently the highest level of integration in the medical IC field, spe-
                                                                 cially designed for applications in sports activities and healthcare
Product News                                        26-28        and consumer medical devices.

                                                                 Driving costs out of your
                                                                 motor control inverter                                     PAGE 14
                                                                 The RX62T microcontroller family from Renesas fully addresses
                                                                 inverter design challenges such as software complexity, re-use of
                                                                 existing software modules, BOM costs, noise immunity and elec-
                                                                 tro-magnetic compatibility. It allows to reduce the development
                                                                 cycle and shorten the motors calibration phase.

                                                                 Design kit enables making the most
                                                                 of self-powered sensors                                    PAGE 20
                                                                                                     Self-powered sensors for appli-
                                                                                                     cations such as building
                                                                                                     automation are tipped for
                                                                                                     impressive growth in the com-
                                                                                                     ing years. Now is the right time
                                                                                                     for developers to begin work
                                                                                                     with platforms such as Arrow’s
                                                                                                     TheDrop Wireless Kit, to gain a
                                   Cover Photo                                                       head start in this important
                                   EBV                                                               emerging market

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June 2012                                                    4

EBVchips gains momentum
in the embedded marketplace
By Wolfgang Patelay

          The idea behind EBVchips as
           a distributor not only selling
suppliers’ products but also designing
      specific semiconductor products
     based on the requirements of its
  customers was born in 2010, and is
 now well accepted in the embedded
         industry. Antonio Fernandez,
   Director Technical Marketing, EBV,
           explains the reasons for this
   new service and gives an overview
           of the current situation and
                    the future roadmap.

  According to Fernandez the idea of EBVchips         plication or a new product has to be designed        that can be fed into the grid. The idea of Gen-
was born because many of EBV's customers               from scratch, the NRE cost is from 150,000           esis was born because the big players in the in-
needed specialised products and the standard           euros up to 4 million euros. Fernandez states:       verter industry use patented technologies in
products on offer did not perfectly meet their         “EBVchips realises a triple win situation. Our       the power unit, but there is also a market with
requirements. So the distributor started targeted      customer, the later user, gets the product which     numerous smaller inverter manufacturers, who
discussions with customers and divided the             fits perfectly in his application and the supplier   do not use patented topologies. It was precisely
market into different vertical segments e.g.           and we have the opportunity to increase our          these companies, who rely on standard topolo-
Automotive, General Lighting, RFID, Renew-             revenues. All three parties win.” The distributor    gies, who constantly struggled in the past to
able Energies and Consumer and so on. For              pays the NRE cost and takes over the risk.           keep up with the big companies, because it
customers in these segments EBV started to             Therefore Fernandez feels certain that this is a     was extremely difficult for them to meet the
design specific chips in the EBVchips program          risk-free situation for the customer as well as      requirements of the market in terms of effi-
– if an idea could be realised and had sufficient      the manufacturer. But to make a profit it is         ciency and also achieve a very high level of re-
market potential. The chips are then produced          necessary for the distributor to increase the        liability at the same time.
by the individual suppliers and the distributor        revenues to a sufficient degree by producing a
has exclusive global sales rights for a certain        certain volume of EBVchips, which starts at          The Genesis products now enable these com-
period of time usually three to five years. After      20,000 to 30,000 but can go up to 1 million          panies to compete much better with the larger
this period the product can be sold via addi-          pieces. Many EBV customers also realized the         companies, with only minimal changes to the
tional sales channels, too.                            advantage of risk-free EBVchip design and            software being required in order to integrate
                                                       contacted the distributor to find a solution for     Genesis into an existing solution. Since, in de-
The design flow in EBVchips starts with the            their special requirements.                          veloping Genesis, EBV Elektronik had a solu-
product idea or special requirements of the                                                                 tion with high efficiency and utmost reliability
customer, who discusses it for feasibility with        In January 2010, EBV presented the EBVchips          in its sights from the outset, Genesis employs
the vertical market segment managers of the            concept and, even before electronica 2010, var-      a standard boost topology with a bridge con-
distributor. If the product is feasible the vertical   ious customers had already received the first        figuration. For the casing, EBV and Vishay
market segment managers create the specifica-          EBVchip working product, Genesis. EBV started        consciously opted for a well-proven technology
tions which are then taken to the suited manu-         shipping Genesis in quantities to customers in       in the form of the ECONO2 (Econopack 2).
facturer. If the product can be produced the           Q1 2011. The Genesis chip is an IGBT module,         Although cheaper casings than ECONO2 are
design process starts. Although three parties          co-developed with and produced by Vishay             available, which are also used in some of the
are involved in the project - supplier, distributor    for use in photovoltaic systems in private           latest generation of inverters, there is another
and user - only one takes the risk of NRE              homes. This IGBT module is used as the power         important element that has to be factored
costs – the distributor. Depending on whether          unit in the inverters for converting the DC          into the equation, namely that the Econo2 cas-
an existing product can be tailored to the ap-         voltage generated by solar cells into AC voltage     ing permits an exceptionally high level of reli-

    June 2012                                                                  6
                                                                                                                                  COVER STORY

                                                   blocking interval recovery time of SiC diodes       tions for low pressure systems (diesel) or for
                                                   is zero, so that the additional snubbing required   measuring oil pressure. Based on this technol-
                                                   can be significantly less than with conventional    ogy, Sensata manufactures 75 million pressure
                                                   solutions.                                          sensors per year for the automotive industry
                                                                                                       that work from underpressure up to 80bar.
                                                   The FRED silicon diodes act in turn as a boost
                                                   bypass in the case of high input voltages, so       The sensor basis element comprises ceramic
                                                   that the module is provided with an effective       substrate with about 3mm thickness and a
                                                   means of protection also against reverse polar-     thin, flexible ceramic membrane with thickness
                                                   ity of the solar panels. As such, Genesis is        of about 0.6 to 1.2mm. The ceramic membrane
                                                   equipped for use in boost stages, which imple-      is attached to the ceramic substrate at a highly
                                                   ment the concept of ‘maximum power point            defined distance using a glass bonding process.
                                                   tracking’ of the photovoltaic modules with a        Regarding the assembly. sensors with different
                                                   downstream single-phase bridge for DC/AC            pressure ranges distinguish through mem-
                                                   conversion. The new module thus constitutes,        branes with different thickness as well as
                                                   as it were, an upgrade of existing solutions. It    through electronic calibration. On both ceramic
                                                   is an additional item in the product range,         parts there is a thin gold layer that is connected
                                                   which is not available in this form from other      to the electronics via contact leads. Both gold
                                                   manufacturers. Fernandez states: “Although          layers form a capacitor with its capacity chang-
 Antonio Fernandez: "We are working                comparable modules do exist with silicon car-       ing as a function of pressure put onto the
 currently on more than 20 new EBVchips            bide in the boost stage, there is no equivalent     membrane. The capacitor capacity is in the
 projects for various market segments."            module prior to the market launch of Genesis        15pF range.
                                                   that also contains a SiC diode in the bridge
ability. Since end customers base their calcula-   circuits. Our first Genesis product is very pow-    Using a proprietary charging/decharging
tions of the amortisation period for their pho-    erful but expensive. Some of our customers          process, Sensata evaluates the change of ca-
tovoltaic systems on a functional period of        want to have more reasonably priced power           pacity relatively to a reference capacitor to
over ten and often over 15 years, and sometimes    products, and we will fulfil this need by intro-    generate an output voltage between 0 and 5V.
even over 20 years, it is unacceptable for them    ducing new Genesis products in different            This process has been proven over many gen-
to have to exchange the inverter after only five   topologies to reduce costs.” According to him       erations, with systematic improvement of the
or six years.                                      this is easy achievable because it is only neces-   electronics, the calibration and the temperature
                                                   sary to change an existing design without           stability during recent decades while the basis
Genesis is a complete power unit integrated        heavy investments in NRE:                           process has always stayed untouched. Each
into one module for single-phase inverters in                                                          single sensor is calibrated at room temperature.
photovoltaic applications. With its ratings of     The second EBVchip product was created be-          As part of the production process the sensors
600V /50A (in continuous operation) for a          cause many industrial customers have inquired       are validated at 23°C and 135°C. Also in the
conversion frequency of 4 to 30 kHz, it is tar-    again and again the over 120 FAEs of the dis-       upper and lower pressure range a calibration
geted at applications in the residential sector,   tributor for cost-efficient but very precise and    is conducted. All these measures are purely
which mostly have a power rating of between        high quality pressure sensors. Therefore the        analog without using digital electronics. In
2.5 and 6 kVA. Even in the choice of semicon-      internal search for a solution started. With        manufacturing as well as in the field this
ductor devices integrated into the module,         Sensata, the best-suited partner to accomplish      process has proven to be extremely stable.
EBV had, from the very outset, an extremely        the Titan project was found. Since 1985 this        Within a core range the sensor elements show
high-quality end product in mind. Thus for         company has manufactured pressure sensors           rather linear characteristics. Only at the lower
instance, the trench IGBTs, with their low col-    based on its ceramic technology. In an auto-        and upper end of the scale are there larger
lector-to-emitter saturation voltage of just       mobile these sensors are used in many different     non-linearities.
1.65V, constitute the best compromise between      places, with a pressure sensor for the air con-
conduction and switching losses, whilst the        ditioning compressor loop in a car being the        For the sensors to be used in industrial appli-
silicon carbide diodes ensure particularly low     first application. Enhanced versions of this ce-    cations, they need a 4/20mA output. On the
switching losses and, at the same time, excep-     ramic-based pressure sensor meanwhile are           initiative of EBV Elektronik, Titan pressure
tionally good EMC performance, since the           present in automatic gear boxes, fuel applica-      sensors equipped with an industrial output in-
                                                                                                       terface were created. The distributor together
                                                                                                       with Sensata defined a back-end electronic
                                                                                                       circuit for converting the 0/5V signal into a
                                                                                                       4/20mA output current. EBV was responsible
                                                                                                       for the entire definition of the industrial inter-
                                                                                                       face. As a result the sensors can also be used in
                                                                                                       process automation systems and other appli-
                                                                                                       cations. In this case the complete 4/20mA sen-
                                                                                                       sor solutions are those Titan products that are
                                                                                                       marketed by EBV as part of its EBVchips ac-
                                                                                                       tivities. Currently those EBVchips pressure
                                                                                                       sensors are available in brass versions for the
                                                                                                       three pressure ranges 0 – 10bar, 0 – 20bar and
                                                                                                       0 – 35bar. Also available are variants in stainless
 The Genesis IGBT module was the first product in the EBVchips program.                                steel for the 0 – 45bar range. If required, and

                                                                          7                                                                  June 2012

                                                                                                    for example there are important applications
                                                                                                    in hydraulic systems, pneumatics, lifts, liquids
                                                                                                    and gases. Some of the most important pump
                                                                                                    and compressor applications are industrial
                                                                                                    cleaning systems, car washing systems, water-
                                                                                                    based high-pressure cleaners, water and auxil-
                                                                                                    iary pumps as well as pneumatic systems. The
                                                                                                    HVAC and fridges and freezers sector not only
                                                                                                    includes industrial freezing technology but
                                                                                                    also building automation, heat pumps as well
                                                                                                    as fridges and freezers for food and retail. Fer-
                                                                                                    nandez states: “At the moment the various
                                                                                                    Titan versions are priced in the range of 20 to
                                                                                                    50 euros, but like the Genesis products future
                                                                                                    versions can be redesigned and lower priced.”
                                                                                                    This will open more market opportunities.
 The highly reliable Titan ceramic sensors are based on automotive technology but are now suited
 with 4/20mA output for industrial and further applications.                                        According to Fernandez, the Titan example
                                                                                                    clearly shows one way of creating new
the appropriate volume is needed, both com-       sensors can handle voltages up to 39VDC           EBVchips – by using an existing product and
panies are able to produce other variants         without damage. Vibrations up to 10g with a       modifying it to fit in new applications. This
equipped with different connectors, different     frequency of 25Hz to 2,000Hz do not harm          is the easiest way to get new products, but
mechanical connection or packaging. At present    the pressure sensors. Shocks of up to 100g are    the program is really universal – depending
the pressure sensors are classified according     sustained coming from various directions at       on technology and volume nearly every pos-
IP65, IP67 and IP6K9 (all with cable). Because    6Hz (half sinus). In all cases the UL and RoHS    sible product can be realized. Fernandez says:
the sensor is powered via the signal line, the    compliant CE certified sensors make their         “We deliberately did not limit the term
Titan sensors use only two connection lines       measurement result reliably available after a     EBVchips only to silicon. Among EBVchips
according to SAE specifications, having the       response time of <10ms via the cost-efficient     are hybrids, modules or encoders or in this
relevant length for usage in harsh industrial     but IP6K9 protection rated Delphi-Packard         case industrial sensors in a screw mounting
environments where EMC is an issue. The in-       connector on the output. As sealing material      housing.” But the EBVchips concept is not
dustrial pressure sensors are immune to elec-     for the internal O-ring neoprene, hydrated ni-    limited to existing products. Depending on
trical interference of up to 30V/m.               trite rubber (HNBR) and fluorosilicone are        the volume new designs are feasible which
                                                  used. The bursting pressure corresponds to        are close to full custom developments. He
Across the whole temperature range of -20°C       the five-fold measurement pressure.               mentions that EBV is working currently on
to +100°C the measurement error is less than                                                        more than 20 new EBV-Chips projects in var-
2%. At 25°C the measurement error across the      Using a hexagonal screw terminal (1/8“ male,      ious market segments, and some of the up-
entire temperature range is only 0.75% – this     ¼“ female) the pressure sensors are not only      coming new products will be presented at
applies for more than 10 million specified        suited for industrial process automation ap-      electronica 2012 in November in Munich.
pressure measuring cycles. Therefore the sen-     plications but also for applications like pumps   Fernandez concludes: “These new products
sors are among the most accurate parts on the     and compressors as well as HVAC (heating,         will highlight the trends to ongoing higher
market. The reverse polarity protected operat-    ventilation, and air conditioning) plus fridges   integration, use of multiple dies, lower power
ing voltage can be 6 to 30VDC. Also the           and freezers. In the area of process automation   consumption and higher performance.” 

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  June 2012                                                              8

Wireless-enabled MCUs – joining the
dots to reveal the energy-saving future
By Colin Faulkner, NXP Semiconductors

             With energy prices soaring
              and a new climate change
                protocol on the horizon,
                 albeit belatedly, there is
               a continuing drive to save
            energy in our everyday lives.

                                                                                                                      Figure 1. NXP JN5148 low-
                                                                                                                      power wireless microcontroller

  Changes in building construction techniques     or commercial building; while at best, heating      grated control has been the sheer cost of inter-
and new technologies such as low-energy light-     in office spaces is often controlled on a floor-    connection. It is possible to wire up control
ing are two of the highest-profile ways of cut-    by-floor basis. This not only provides uneven       signals to individual lamps, but the cost of in-
ting energy consumption. But even more prom-       distribution of comfort, it is also wasteful of     stallation is prohibitive. Even for a new build,
ising is the concept of moving towards a more      energy. Deploying a thermostat in each indi-        the return on investment in extra cabling is
intelligent, holistic approach to the problem.     vidual work area would be more efficient.           tenuous. Powerline communications might at
Interconnecting devices as diverse as lights,                                                          first sight seem a promising solution, but the
thermostats and white goods as part of a smart     More co-ordinated control would also allow          fact is that many of the elements that need
building automation system would allow the         more intelligence in the control strategy itself;   connecting do not require a power cable: a
most effective possible use of expensive re-       for instance, lighting in a particular area can     thermostat is a prime example.
sources. Until now, realising such a vision has    be designed with a number of scenarios or
been – at best – challenging from a technical      scenes in mind. Lowering the lighting in a          The solution to the installation problem is
standpoint, and practically impossible from        living area while the occupants watch TV –          wireless communication. Today, low-cost elec-
the point of view of cost. However, new net-       which can cut energy consumption by anything        tronic components from manufacturers such
working standards such as NXP JenNet-IP, in        between 10 and 30 percent – or providing is-        as NXP allow the construction of individually
parallel with developments in internet tech-       lands of illumination for reading are both          addressable sensors, lamps and heating ele-
nology and continuing advances in semicon-         strategies that not only contribute to user com-    ments. In particular, wireless-enabled micro-
ductor devices, now make this type of building     fort and utility, but also allow best use of        controllers – the chips that provide the core
automation an affordable reality.                  energy resources. Increased sophistication –        intelligence in such products – are reaching
                                                   for instance using two-way communication so         the dollar price point. This represents an ac-
It has long been clear that increases in sensing   that the control system can harvest information     ceptable increment in bill of materials even in
capabilities and improvements in the inter-        about individual appliance on/off cycles and        the context of high volume cost-sensitive items
connections between the various islands of         energy usage to build a bigger picture about        like advanced light bulbs, which cost in the re-
automation within a building hold out great        the energy performance of the whole installation    gion of $15 to build. However, it looks even
potential for advances in energy performance.      – could enable even greater efficiency.             better value when viewed as an investment in
A distributed sensing and control strategy                                                             reducing the lifetime cost of ownership and
would, for instance, include presence detection    Many of the elements required to implement          energy consumption of electrical appliances,
sensors – such a system could easily be used to    such energy saving strategies are already in        and of the smart building as a whole. A device
switch off heat and lights in unused areas         place. For example, dimmable CFL and solid-         such as NXP JN5148 is typical of this new gen-
within a building. Similarly, conventional sys-    state LED lamps can already be controlled           eration of components. It offers 32-bit RISC
tems commonly have a single thermostat mon-        electronically. The main challenge in realising     processing, a fully compliant 2.4-GHz IEEE
itoring the temperature throughout a house         the ideal scenario of highly granular yet inte-     802.15.4 wireless transceiver, sufficient pro-

                                                                          9                                                                June 2012

                                                                                                           solved? As it turns out, more is required than
                                                                                                           these elements: in particular, there is a need
                                                                                                           for a bridge between consumers now-intuitive
                                                                                                           use of the internet, and the intelligent control
                                                                                                           of objects and appliances that will allow energy
                                                                                                           efficiency. This is where NXP JenNet-IP
                                                                                                           technology comes in.

                                                                                                           The JenNet-IP network layer software is a
                                                                                                           standards-based wireless sensor network that
                                                                                                           offers full IPv6 connectivity to all nodes in a
                                                                                                           network. To do this it builds on two underlying
                                                                                                           standards: the well-established IEEE 802.15.4
                                                                                                           specification that provides a radio and MAC
                                                                                                           (Media Access Control) platform and functions
                                                                                                           in the worldwide 2.4-GHz ISM radio band;
 Figure 2. System architecture of the GreenChip smart lighting solution
                                                                                                           and the 6LoWPAN (IPv6 over Low-power
                                                                                                           Wireless Personal Area Network) link-layer
                                                                                                           mapping system defined by the IETF (Internet
                                                                                                           Engineering Task Force) that provides encap-
                                                                                                           sulation and header compression mechanisms
                                                                                                           to allow IPv6 packets to travel via an
                                                                                                           IEEEv802.15.4 link.

                                                                                                           IEEEv802.15.4 itself specifies the modulation
                                                                                                           technique, how devices manage contention
                                                                                                           for the radio channel, how the wireless network
                                                                                                           is set up and initialized, how devices join a
                                                                                                           network, and the basic packet format. However,
                                                                                                           it only tells the designer how to handle inter-
                                                                                                           actions between a pair of devices within radio
                                                                                                           range of each other. JenNet-IP builds a multi-
                                                                                                           hop tree network on top of this link layer.
 Figure 3. The JenNet stack                                                                                This allows two nodes that are not directly
                                                                                                           connected with each other to communicate
cessing power to execute the required commu-          Just as important as advances in hardware are        via a number of intermediate nodes – in a
nication protocols, and smart power manage-           communications protocol developments that            similar way that an email message transmitted
ment facilities to cut energy consumption lo-         enable the interconnection of the individual         via the internet will travel through a number
cally in the ancillary electronics.                   elements in the network. Here, the advent of         of mail servers in its journey from sender to
                                                      IPv6 (Internet Protocol version 6, the successor     destination. This not only provides the ex-
To support smart lighting applications, NXP           to IPv4) looks set to have a major impact, en-       tended coverage required in a smart building
backs the device itself with the GreenChip ref-       abling an internet of things (IoT) in which          network, it also brings benefits such as self-
erence design. GreenChip brings together all          physical objects or devices can have their own       healing, which are valuable in IoT networks.
the hardware and software required for a smart        unique internet protocol (IP) address. This          JenNet-IP also incorporates familiar AES se-
lighting solution, in a form factor that fits in      will enable them to be seamlessly integrated         curity features.
the body of an LED or CFL lamp, and at a cost         into an information network based on familiar
and power consumption required for a mass-            internet principles – and to interact with any       Finally, the 6LoWPAN layer essentially provides
market product. It integrates the JN5148 wireless     other device that uses nternet protocol.             a means of translating between IPv6 packets
microcontroller, TEA1721 power supply devices,                                                             and IEEEv802.15.4 packets, by compressing
and LED or CFL drivers (SSL210x or UBA202x,           IPv6 offers approximately 5 x 1028 addresses         IPv6 headers and turning the payload into a
respectively). The antenna is printed on the          for every person on the planet, making it pos-       number of fragments suitable for transferring
PCB. Additional wireless software or hardware         sible for any device in the world to be given a      in a 15.4 link-layer packet. The aim of JenNet-
development for end products can be under-            unique IP address. It represents a basic trans-      IP is to provide a lightweight application sup-
taken using the comprehensive JenNet-IP-EK040         port mechanism with which to architect com-          port layer that offers a simple and efficient
evaluation kit available in July 2012. This enables   plex control systems and to communicate with         means of communication for applications on
designers to add wireless connectivity to any         individual network nodes in a cost-effective         both wireless nodes in the smart building net-
products in development and to develop and            manner, while also allowing the IoT to be con-       work, and on platforms such as tablets, smart-
test custom product application software. The         trolled from familiar consumer devices such          phones or personal computers.
same approach can be taken for any kind of            as smartphones or desktop computers.
powered device, including appliances, air con-                                                             Devices in JenNet assume one of three types
ditioning and heating units. Battery-powered          So with low-cost wireless hardware and, in IP,       of function: PAN coordinator; router; or end
devices such as thermostats or occupancy sensors      an effectively universal communications pro-         device. Each network has one co-ordinator,
just need the batteries, the appropriate sensor       tocol, is the problem of building a cost-effective   which is responsible for setting up the network.
and the wireless microcontroller.                     and all-encompassing in-building network             Router devices provide multi-hop capabilities:

  June 2012                                                                  10

they hold routing tables allowing packets to be          remotely. Alternatively, gateway mode offers a
inspected and re-transmitted. Finally, end de-           bridge between the low-power wireless network
vices simply act as sources or sinks of data,            and the home area network (HAN) or building
without routing capabilities. A device can join          wide network – in the form of an Ethernet or
the network by finding a suitable parent node            802.11 WiFi interface. The HAN in turn will
(either a router or the co-ordinator). This child        generally provide access to the wider internet
node address is entered into the routing table           via an ADSL router, cable modem or leased
of the parent node, and a registration message           connection.
is sent up the line to the PAN coordinator, no-
tifying routers on the way. Thus a tree is built,        It is becoming increasingly clear that energy
and at the root, the PAN coordinator’s routing           saving is a holistic occupation – it cannot be
table contains an entry for every device in the          done in isolation. However, implementing
network. This approach enables the use of a              such a holistic approach requires that product
very simple routing algorithm. An additional             designers, architects and IT professionals have
multicast facility within JenNet allows multiple         at their disposal a technique for interconnecting
nodes to be addressed with a single instruction          all types of things within buildings – and be-
– useful when, for example, controlling a multi-         yond to the wider internet. This not only
bulb light fitting, or turning on or off all the         allows remote devices and central computers
lights in a room together. Network connectivity          to control the operation of individual elements,
is maintained by monitoring traffic between              it also permits feedback and monitoring that
nodes and their parents; in the absence of real          enables more sophisticated control strategies.
traffic, the JenNet management layer generates
a ping to check the link.                                Smart energy technology, including JenNet-IP
                                                         and ZigBee, already exists to cost-effectively
Operating above the JenNet-IP layer in the               embed great intelligence in individual products
network stack architecture is an easy-to-use             and appliances. Suppliers of such technology –
lightweight MIB-based API (application pro-              for example NXP – today provide a complete
gramming interface) support layer. This is               portfolio of products that enable optimal design
used to define behaviours of common devices;             at the node. In parallel to these developments,
for example, in a lighting system, lamp on/off,          the internet, and the protocols that enable it,
dim up/down, colour, or monitoring power                 has become ubiquitous. Consumers are com-
usage. Designers can also flexibly add their             fortable using it, and network administrators
own categories of device and functionality.              have well-established techniques for managing
The JenNet network can function either in                it. Lightweight wireless networking technologies
standalone (gateway-less) mode, designed for             like JenNet-IP allow designers to join the dots
applications that do not require a connection            of these many trends in the quest for greater
to the wider internet – for instance, a heating,         energy efficiency. The end result is that for the
ventilating and air conditioning (HVAC) in-              first time, one of the most important aspirations
stallation that does not need to be controlled           in energy policy can become a reality. 

                               Product News
 MSC: RX220 MCUs enable cost-effective                  consumption can be achieved in systems with
  entry into the 32-bit world                            alternating processing and standby phases.
MSC now offers 11 MCUs in the RX220                      News ID 15687
Group of 32-bit microcontrollers from Re-
nesas featuring processing performance of                  Evatronix: display processor based on
up to 50 DMIPS at 32 MHz and a reduced                      latest ARM security technology
power consumption of less than half that of              Evatronix has released the first member of its
the earlier RX200 Series of MCUs. In partic-             PANTA high performance display controller
ular, in intermittent operation, the new RX220           core family. Developed using ARM technology
Group sets new standards. When the CPU is                the PANTA DP20 is targeted specifically at
operating and the peripheral functions are               high-end mobile/portable products, like smart-
halted, the power consumption of the new                 phones and tablet PCs, with ultra-low power
RX220 MCUs is only 0.2 mA/MHz. When                      consumption that does not sacrifice processing
operating in software standby mode, in which             performance. The PANTA DP20 off-loads the
the contents of the on-chip RAM and registers            general purpose central processing units from
are maintained but other functions are halted,           power-consuming video processing tasks, like
the operating current is reduced to an ultra-            composition of up to 3 graphics or video
low level of 2 µA. In combination with the               layers, YUV to RGB conversion, alpha-blending
performance of 1.56 DMIPS/MHz, which is                  and gamma correction.
unusually high for mid-range MCUs, a sig-                News ID 15552
nificant reduction of the overall system power

                                                    11                                        June 2012

Highly integrated single-chip solution
for healthcare applications
By Carsten Steiner, Rutronik

                    This article describes a
             single-chip solution featuring
              what is currently the highest
                     level of integration in
                       the medical IC field,
                     specially designed for
            applications in sports activities
                        and healthcare and
                consumer medical devices.

                                                                                                                        Figure 1. Block diagram –
                                                                                                                        Infineon MD8710

  Medical devices are on the move: blood sugar,    mobile device to healthcare platforms such as       prises about 12 integrated QFP component
blood pressure and heart monitors are increas-      GoogleHealth ( and            devices and a further 30 to 50 discrete compo-
ingly being used away from their normal loca-       make it available to designated personnel, such     nents. That not only means development lead
tions at hospitals and doctors’ surgeries, in pa-   as their doctor or fitness trainer.                 times are long, it also entails great effort and
tients’ homes. And fitness fans are also increas-                                                       expense in achieving a compact design. Con-
ingly monitoring their physical condition them-     In order to establish global standards for such     structing the device with identical functionality
selves, with equipment traditionally reserved       a Personal Healthcare Ecosystem, as it has          using the MD8710 reduces the number of
for use by medical specialists. This is made        been named, the Continua Health Alliance            QFP components to between three and five
possible by more compact and cost-effective         ( was created. The         and cuts the number of discrete components
devices, featuring highly integrated design. This   Alliance already counts more than 200 leading       to about 15 to 30 – at lower cost, because the
trend presents developers with new challenges       companies among its members, and the first          market price of the MD8710 is less than half
however: the devices have to be portable and        set of standards has been drawn up. For all rel-    that of the ICs otherwise needed. The platform
user-friendly, and new methods of transferring      evant applications distributor Rutronik, work-      concept underlying the chip offers further sav-
and storing the sensitive data obtained need to     ing with Infineon, has now exclusively devel-       ings. Thanks to flexible chip configuration,
be found. At the same time, the development         oped a single-chip solution featuring what is       multiple devices can be implemented on one
of new technologies and expanding function-         currently the highest level of integration in       platform. The easy interchangeability of sensors
ality means that equipment needs to incorporate     the medical IC field. The chip is designed es-      and minimal software customization required
ever more components. These demands can             pecially for sports activity and healthcare and     means devices can be used in a wide variety of
now be met with just one chip.                      consumer medical devices. Potential applica-        applications. This saves on expensive develop-
                                                    tions range from simple heart-rate indicators       ment time and significantly cuts the time to
When using medical devices in the home, the         in the gym, bike-mounted computer readouts          market for new devices.
data recorded must be transferred from the          or speed and step monitoring on blood sugar
measuring device concerned to a local collec-       and blood pressure monitors, through to blood       The central component unit of the MD8710 is
tion point where it can be stored. To enable        oxygen measurement and insulin pumps.               a powerful ARM Cortex R4 processor, com-
users to retrieve, view and make an initial                                                             bined with a comprehensive memory protec-
evaluation of their data from their home PC         The single-chip medical device MD8710 con-          tion unit, an interrupt controller, a DMA con-
or from a mobile device such as a BlackBerry        forms to Continua standards, enabling terminal      troller and a watchdog timer. The analog front
or iPhone, the devices need to be equipped          devices to be very easily integrated into a stan-   end of the module allows for applications en-
with a simple, open interface. Many already         dard Personal Healthcare Ecosystem. It also         tailing high analog signal processing demands.
provide USB ports, and some also feature            dramatically reduces the number of compo-           It features two independent 16-bit ADCs and
Bluetooth, Zigbee or WiFi interfaces. This en-      nents required. For example, a conventional         two 16-bit DACs. The DAC channels can be
ables users to transmit data from their PC or       portable blood sugar monitor at present com-        fed with data from an integrated wavetable, so

    June 2012                                                             12

                                                                                                          different light wavelengths: the first is in the
                                                                                                          infrared range at 940 nm, as that is the location
                                                                                                          of maximum absorption of the oxygen-satu-
                                                                                                          rated hemoglobin (HbO2). The second wave-
                                                                                                          length is at 660 nm, where the non-oxygen-
                                                                                                          saturated hemoglobin (Hb) absorbs the most
                                                                                                          light. The oxygen saturation of the blood is
                                                                                                          determined from the ratio between the two
                                                                                                          measured values.

                                                                                                          Because of the constant absorption rate of the
                                                                                                          tissue, there is a high DC signal component. The
                                                                                                          AC signal component is caused by the pulsating
                                                                                                          blood. The exact AC and DC components re-
                                                                                                          spectively depend heavily on the light intensity
                                                                                                          and the tissue absorption. Owing to the variable
                                                                                                          blood flow through the tissue, there may be dra-
                                                                                                          matic fluctuation of the AC component, which
                                                                                                          may be between 0.01% and 10% of the DC com-
                                                                                                          ponent. Maximum DC compensation is essential
                                                                                                          in order to determine the relative hemoglobin
 Figure 2. Typical medical network (Personal Healthcare Ecosystem)                                        content. In the first step, the pulse oximetry
                                                                                                          signal is a current signal through the photodiode
no additional DSPs are needed. Two config-          a LiIo or LiPo battery. For security purposes         (measurement of the light absorption). For fur-
urable OPs per ADC provide an analog pre-           (such as battery authentication), there is an         ther processing, a transimpedance amplifier con-
processing facility, such as transimpedance         integrated interface for an externally con-           verts this into the required voltage signal. This is
amplifiers for current inputs. Providing further    nectable Infineon ORIGA chip. The MD8710              followed by the aforementioned DC compensa-
system integration, the MD8710 features a 12-       also features a display controller which supports     tion, by way of an additional OP stage. In the dis-
bit ADC with four external auxiliary multiplex      Matrix LDCs. Audio functionality is provided          crete configuration this is shown in figure 3.
inputs and a temperature sensor. The facility       by a class-D output stage. As a result, the
for synchronous sampling of the ADCs also           MD8710 provides all the key functionality for         Applying the measurement technique to the
permits complex measurements, such as im-           portable, battery-powered devices in the Per-         MD8710, almost all discrete components be-
pedance spectroscopy for blood analysis. For        sonal Healthcare Ecosystem.                           come superfluous. The chip is able to handle
data exchange, there is a USB 2.0 port and an                                                             all the essential pulse oximetry functions. The
on-chip Bluetooth module, as well as I2C, SPI       The example provided by the pulse oximetry            dynamism of the absorption is in the range be-
and UART interfaces. The power management           application case illustrates the difference be-       tween 50 and 20,000 values (14 to 15 bits). For
unit (PMU) generates all the required voltages      tween discrete and integrated design. Pulse           detailed analysis only a limited range is required
and at the same time monitors all internal          oximetry is a method for measuring the oxygen         however. As the delta-sigma converters of the
supplies using just a few external components.      saturation of the blood. A pulse oximeter             MD8710 are specified with 16-bit resolution,
It can handle a variety of power-saving and         measures the light absorption when the skin           error-free conversion is guaranteed and pulse
wake-up scenarios, and manages charging of          on the finger is scanned. This is done with two       oximetry can be carried out without problem.
                                                                                                          A noise analysis confirms this result. The block
                                                                                                          diagram then looks as shown in figure 4.

                                                                                                          As in the case of pulse oximetry, virtually any
                                                                                                          application in the sports activity and healthcare
                                                                                                          or consumer medical sphere can be imple-
                                                                                                          mented by the integrated solution offered by
                                                                                                          the MD8710, and the devices can be integrated
                                                                                                          seamlessly into a Personal Healthcare Ecosys-
                                                                                                          tem. The cost saving on components usually
                                                                                                          also justifies the redesign of existing discrete
 Figure 3. Discrete configuration of pulse           Figure 4. Integrated pulse oximetry with the         solutions. And new market opportunities are
 oximetry                                            MD8710                                               opened up to the device. 

                                                         Product News
  Infineon combines MCU and LIN-based relay driver in                            motive body applications. The new devices are specifically designed to
   thumbnail-sized chip                                                           fit to a wide range of LIN-slave motor control applications where a
Infineon Technologies introduced the second generation of its embedded            small package form factor and a minimum number of external compo-
power devices. The new TLE983x SoC product family integrates a pow-               nents are essential, including: window lifts, wipers, sun roofs, power
erful 8-bit microcontroller with a LIN transceiver and related peripherals        seats and fan/blower control.
on a single chip to address the needs of space and cost sensitive auto-           News ID 15708

                                                                             13                                                                  June 2012

Driving costs out of your
motor control inverter
By Vincent Mignard, Renesas

                   The RX62T microcontroller
                     family from Renesas fully
                    addresses inverter design
                 challenges such as software
                complexity, re-use of existing
                      software modules, BOM
                   costs, noise immunity and
                electro-magnetic compatibili-
                    ty. It allows to reduce the
                development cycle and short-
                    en the motors calibration

 A major design requirement in the next gen-        tuning of any motors and/or the algorithm            on the reset pin. Each input port is protected
eration of inverter is to reduce software com-       proportional integral (PI) coefficients (either      with ESD diodes and resistors. Such mecha-
plexity and the number of PCB design itera-          for current, speed or position). To make the         nisms provide high confidence to the MCU
tions, and to reduce the overall BOM and the         transfer from simulation tools like Simulink         users and guarantee no PCB field return. The
PCB size. Renesas has designed the RX62T mi-         or Scilab, the MCU embeds a 32-bit floating          number of PCB iterations is strongly reduced
crocontroller family specifically to address         point unit single-precision which considerably       which enables development cost reduction. Fi-
these issues. The on-chip floating point unit,       reduces the risks of scaling errors and makes        nally, the RX62T guarantees fastest prototyping
op-amplifiers, comparators, 12-bit A/D con-          the code easy to read and optimize.                  phases and more reliable PCB designs.
verters and the memory protection unit make
the RX62T MCU the most integrated device             The RX62T MCU family operates at 5V which            The MCU integrates dedicated hardware mod-
on the market. Furthermore, a complete in-           is a fundamental advantage when trying to            ules to guarantee fail-safe software and hardware
verter reference kit is available including source   ensure high noise immunity. The 12-bit ana-          designs. The watch dog is independent using
code, PC GUI for fast calibration, schematics,       log/digital converters also operate at up to 5V,     his own on-chip oscillator of 125 kHz. All the
Gerber files and bill of material.                   which enables high resolution and accuracy           sensitive registers are write-protected to prevent
                                                     for any current feedback mechanisms. That is         any software malfunction. The A/D converter
Each inverter has its own specific technical re-     why the overall control of the motor speed,          embeds a self-diagnosis function to enable fast
quirements regarding power range, efficiency,        torque or position is highly efficient. Each pin     plausibility tests, so no additional external re-
dynamics, software complexity, safety class,         of the RX62T in the 100-pin package was              sistors are needed. The general PWM timer
noise immunity, etc. Nowadays, the gap be-           tested by the company Langer EMV using               (GPT) integrates a function to compare clock
tween the models designed on PC simulation           burst test techniques. The goal is to test the ro-   sources which guarantee time slot monitoring
software and the real practical inverter designs     bustness of each pin against current and volt-       in hardware.
is large. To reduce the gap, Renesas developed       ages bursts. The results are: All the I/O pins
a complete ecosystem around the RX62T MCU            remain insensitive to negative and positive          In order to prevent any power stage damage,
family. First of all, an easy-to-use motor control   bursts up to 500V.                                   the POE (port output enable) module is able to
kit based on RX62T is available to drive any 3-                                                           switch off in hardware all PWM signals in case
phase motors using either discrete transistors       According to the existing tests results on the       of failure detected. Furthermore, the device in-
or compact power stage. The algorithm suite          market, the RX62T port pins are by far the           tegrates a memory protection unit with eight
provided is a field-oriented control (FOC)           most robust. It demonstrates that the MCU            different memory protection regions. Each region
using sensorless or sensored feedback methods.       family is perfectly suitable for noisy environ-      has a programmable set of permission attributes:
As each motor requires its own calibration,          ments like industrial drives and motor control       read, write and execute. An exception is generated
the motor control reference platform includes        applications where inductive loads are switched.     when access does not comply. The memory
a specific tuning procedure. It enables fast         Renesas implemented a specific noise canceller       protection set up is done in supervisor mode.

    June 2012                                                               14

                                                                                                        checks, A/D checks. By driving two 3-phase
                                                                                                        motors at the same time, the CPU load remains
                                                                                                        below 75% with a fast control loop. describes
                                                                                                        the on-chip modules of the RX62T MCU fam-
                                                                                                        ily designed to address inverter requirements.
                                                                                                        By driving two 3-phase motors at the same
                                                                                                        time, the CPU load remains below 75% with a
                                                                                                        fast control loop.

                                                                                                        To address the inverter technical requirements,
                                                                                                        Renesas developed a full range of royalty-free
                                                                                                        algorithms. The vector control algorithms use
                                                                                                        the powerful 32-bit FPU. This avoids lengthy
                                                                                                        load/store operations and enables compact
                                                                                                        coding (e.g. the flux estimator is coded in 5
                                                                                                        lines). Competing architecture needs to go
                                                                                                        through the extra step of loading operand val-
                                                                                                        ues into the general registers first and then
                                                                                                        moving them into the dedicated floating point
 Figure 1: RX62T memory protection unit block diagram                                                   registers. The results of the floating point unit
                                                                                                        are subsequently moved to the dedicated reg-
The MPU is the perfect firewall to separate          Finally, as a part of the RX62T ecosystem,         ister and back to the general registers to be
safety related software (Class B and C) and non-     VDE-certified self-test MCU routines are avail-    then stored into memory. FPU operations can
safety related software (Class A). It prevents any   able for Class B safety compliance (e.g.           be executed taking operands both from regis-
Class A software routines from executing Class       IEC60730-1). The source code is easy to inte-      ters, both from memory to memory and one
B code unintentionally. Such hardware mecha-         grate in any existing software in order to add     from memory and one from register. Operation
nisms release CPU load and reduce the code           the following tests: CPU checks, RAM March         results can go either into register or directly
size used for classical safety related software.     tests, flash checks (using on-chip CRC), clock     into memory.

                                                                                                        For the inverter algorithm it basically strongly
 Modules                            Benefits for your inverter
                                                                                                        reduces the CPU bandwidth. Furthermore, the
 165DMIPS CPU                       Powerful 32-bit MCU able to drive two 3-phase motors
                                                                                                        code size using FPU is half as large compared
                                    simultaneously                                                      to fixed point implementation for motor con-
 Floating Point Unit                FPU removes limitations due to scaling or saturation. It improves   trol application. Finally, the source code uses
 (FPU)                              accuracy for motor position/speed and the motor efficiency. The     the real system units: hertz, volts, amperes. It
                                    code development is easier & maintenance faster. The FPU reduces    allows the user to spend more time on the al-
                                    the CPU load and the code size                                      gorithm optimization rather than the scaling
                                                                                                        and float to integer translation.
 Up to 256 KB High speed flash      No time wasted and fast reaction, ensure high system dynamics
                                    during load variation.                                              The RX62T motor control reference kit is de-
 Up to 16KB RAM                     Large amount of RAM to enable FFT                                   livered with a vector control algorithm inte-
                                                                                                        grating safety mechanisms to control the max-
 Up to 32K data flash               Spare external E²PROM to store system parameters & calibration
                                                                                                        imum current, to compensate the bus voltage.
                                                                                                        Several options are offered: three shunts sen-
 Memory Protection Unit             Hardware firewall enables highest safety for Class B & C            sorless, sensored with Hall encoders, either
 (MPU)                              software. It frees up CPU load and reduces code size.               for speed or position control. The kit includes
 CRC on-chip                        Fast checksum calculation for Flash test and for communication      a low-voltage power stage based on Renesas
                                    protocols.                                                          MOSFETS.
 12-bit A/D converters              Fast A/D with three sample/hold circuit enabling single and
 (2 modules)                        three shunts sensorless implementation.                             The calibration procedure is made easy thanks
 Programmable Gain Amplifier        Reduce BOM costs and PCB size by 40mm x 20mm for three              to a test point and a detaied tuning procedure
 (3 x PGA)                          shunts amplification stage.                                         for the PI coefficients using the PC user interface.
                                                                                                        More than sixty motors have been tested on
                                                                                                        such platforms up to now. Furthermore, the kit
 Comparators                        Easy implementation of power stage fault detection. No external
                                                                                                        is supplied with an evaluation license for the
 (3 modules)                        IC needed, PCB area saved.
                                                                                                        Renesas RX C/C++ compiler. This will give the
 CAN, SCI, I²C, LIN, RSPI           Large communication possibility to enable any system to com         user full functionality for sixty days from first
                                    municate with RX62T                                                 installation. Once expired, the license will reduce
 Flexible Power module              Selectable 5V or 3V power supply to enable better signal/noise      to a limitation of 128KB linked object size. The
                                    ratio                                                               support of Eclipse is also available [8]. Fehler:
 From 48 up to 112-pin              RX63T is offering down to 48-pin Package to address compact         Referenz nicht gefunden presents the list of al-
                                    inverter.                                                           gorithms available for the RX62T to drive dif-
                                                                                                        ferent motors types: permanent magnet AC
 Key hardware features targeting inverter requirements                                                  (PMAC) and AC induction motors (ACIM).

                                                                            15                                                                 June 2012

                                                                                                      Several PWM modulation schemes are possi-
                                                                                                      ble, offering the flexibility relating to accurate
                                                                                                      control, and higher efficiency (up to 30%).
                                                                                                      Based on Renesas calculations, thanks to the
                                                                                                      use of the vector control algorithm running
                                                                                                      on RX62T, the heat sink size can be reduced
                                                                                                      by 10%, and some components of the power
                                                                                                      supply reduced by 15%. As the maximum
                                                                                                      current is properly managed, no components
                                                                                                      need to be over-dimensioned.

                                                                                                      The biggest impact of using the RX62T MCU
                                                                                                      is the reduction of external components in
                                                                                                      the inverter design. The current amplification
                                                                                                      is made on-chip by the three PGAs, the fault
 Figure 2. RX62T motor control reference kit                                                          detection is managed by the comparators and
                                                                                                      the POE. Figure 3 shows an amplification
                                                                                                      stage using an external op-amp. The 3-shunts
                                                                                                      amplification stage uses: 1 quad operational
                                                                                                      amplifier, 18 resistors, 6 capacitors, and the
                                                                                                      PCB area used is 40mm x 20mm. By using the
                                                                                                      internal programmable gain amplifiers, the
                                                                                                      bill of material is reduced to 6 resistors and 3
                                                                                                      capacitors. The PCB area used is eight times
                                                                                                      smaller (10mm x 10mm). The BOM cost re-
                                                                                                      duction is estimated at around €0.5 to €1.0
                                                                                                      due to the integration of low voltage detection,
                                                                                                      power-on reset circuit, op-amp, comparators,
                                                                                                      clock monitoring, A/D converter self-tests and
                                                                                                      the reduction of the total PCB area.

                                                                                                      The RX62T microcontroller family fully ad-
                                                                                                      dresses inverter design challenges such as
                                                                                                      the software complexity, the re-use of existing
                                                                                                      software modules, the BOM costs, the noise
                                                                                                      immunity requirements and electro-magnet-
                                                                                                      ic compatibility (EMC) constraints. The de-
                                                                                                      velopment cycle can be reduced and the mo-
                                                                                                      tors calibration phase made shorter. Finally,
                                                                                                      the VDE-certified self-test MCU routines
                                                                                                      additionally enable a cost reduction of €10K
                                                                                                      for the design of a Class B inverter. Finally,
                                                                                                      the latest released RX63T MCU is the low-
                                                                                                      pin-count version for single motor and in-
                                                                                                      verter control offering down to 32KB flash
 Figure 3. Three shunts amplification stage using external op-amp                                     in a 48-pin package. 

                                                        Product News
 Rutronik is Microchip’s global partner             ST: STM32 F0 microcontrollers target             Atlantik: ARM Cortex-M0 microcontroller
Microchip and Rutronik Elektronische Bauele-          budget applications                               in a tiny QFN33 package
mente have enhanced their existing franchise       STMicroelectronics has begun volume production     Atlantik Elektronik presents the brand new
agreement into the Greater China region            of its 32-bit STM32 F0 microcontroller series      ARM Cortex-M0 MINI51 family of Nuvo-
(China, Taiwan and Hong Kong). Rutronik            launched in February 2012 to bridge the gap to     ton, currently consists of the smallest (tiny
now supplies its customers with the entire         high-end features in 8- and 16-bit applications.   QFN33 package) and cheapest available
Microchip product portfolio all over the globe     With a dedicated Discovery Kit also available,     32-bit ARM Cortex-M0 microcontrollers.
to outsourced manufacturing locations or ex-       and leveraging the extensive STM32 development     These NuMicro ARM Cortex-M0 MINI51
ternal assembly companies. As previously of-       ecosystem, engineers now have everything they      microcontrollers are perfectly suited for
fered in Europe, Rutronik now provides de-         need to use ST’s new microcontrollers featuring    applications and innovative new designs
sign-in support on site and customized logistics   the ARM Cortex-M0 processor in cost-sensitive      in the field of professional industrial data
solutions also in the new franchise regions.       consumer and industrial products.                  communications.
News ID 15588                                      News ID 15580                                      News ID 15629

  June 2012                                                              16
                                                                                                                      TOOLS & SOFTWARE

Lifecycle collaboration unlimited
by proprietary tool bridges
By Renate Stuecka and John Wiegand, IBM Rational

                  This article introduces
             Open Services for Lifecycle
            Collaboration (OSLC), which
                uses concepts that have
              proven themselves on the
           internet to integrate tools at
              the resource level, and to
          enable common structures to

                                                                                                                      Resources in an application
                                                                                                                      lifecycle management scenario
                                                                                                                      and how they are linked to
                                                                                                                      each other.

  Teams and organizations concerned with         can be vulnerable to everyday disturbances —        supporting globally dispersed users and re-
software delivery know that they can be much      changes like upgrades of the underlying oper-       sources. Reliable - working well over a wide
more effective when the tools that they are       ating system or API revisions from the vendors.     range of connectivity profiles. Extensible - an
working with can be used in combination.          Additionally, individual tools tend to each         open-ended set of resources with extensible
They want traceability across resources and       have their own vocabularies, providing alternate    representations and protocols/services for op-
accountability across processes, without the      names and descriptions for comparable con-          erating on them. Simple - easy and flexible for
burden of some manual overhead. However,          cepts (or sometimes: different tools all using      tool and content authors to learn and use, not
the tools landscape itself, having emerged or-    the same term with subtly different meaning).       depending on close cooperation or continuous
ganically from point tools aimed at solving       Even when tools can share data they may be          coordination between vendors. Equitable -
specific narrow needs in the software delivery    unable to share meaning, and a single logical       equally available to all participants, from indi-
lifecycle, can present challenges for these       asset can be scattered over multiple tools, re-     vidual projects to large vendors, open-source,
organizations.                                    quiring even more custom bridges, translation       in-house or commercial development, with
                                                  and synchronization.                                no barriers to participation.
Typically, we find that an organization starts
with a range of tools from multiple vendors,      An ideal solution would provide a uniform ar-       This is exactly the approach that has been cho-
often complemented with internally-developed      chitecture and set of protocols that allow re-      sen for OSLC (Open Services for Lifecycle
custom tools. Next the request for traceability   sources from loosely coupled tools to be inte-      Collaboration). In this vendor-independent
emerges, to be able to navigate between the re-   grated in a consistent way. However, if any sin-    approach to collaboration and integration, life-
sources across the lifecycle like requirements,   gle vendor were to invent such architecture, it     cycle resources are transformed into “hyper-
tasks, source code, and test cases. However,      would just create a bigger black box to which       data” to which mechanisms well known from
rather than uniformly connected resources,        other vendors would need to build bridges. If       the internet can be applied. Each lifecycle re-
they often find integrations through specific     instead existing open standard technologies         source is assigned a universal address – no
bridges between each pair of tools – brittle      were leveraged, the value of the resulting inte-    matter whether it is a requirement, a test case,
connections based on unique tool-to-tool APIs.    grated world would outweigh the incremental         a defect, or anything else. The web mechanism
Moreover, their data is often buried inside the   cost of participation. The internet has precisely   for defining a global address is a Uniform Re-
tools. When one tool needs to access the data     these characteristics – in fact, we can pattern     source Locator (URL). Like URLs as web page
of another tool, a bridge is required, imple-     loosely coupled integration architecture after      addresses, we are using URLs to provide an
mented through a vendor-specified API often       the internet. In addition to supporting inter-      address for each of our resources. Once a re-
tied to a specific platform or language. And      net-style integration, an ideal solution would      source is URL-addressable, it can be referenced
when a tool needs to record additional infor-     have the following architectural characteristics    from any web page, tool, or other lifecycle
mation, yet another bridge is required. This      of the internet. Scalable - supporting unlimited    resource. Availability of an addressing scheme
tightly coupled network of custom bridges         numbers of users and resources. Distributed -       for each resource does not imply any further

                                                                        17                                                                 June 2012

information about what is inside the resource     ance is required to enable deeper collaboration       as well as new tools. One of the OSLC design
– the content is still unknown. Resources are     – for example, for a tool to modify a resource        points is to choose integration mechanisms
not restricted to a fixed set of pre-defined      that it has not created. This is important to         that can enhance existing resources, analogous
types. For example, a requirement could be        allow tools that share common resources to            to the way that web services can be used to
represented by a text document describing the     record additional information in existing re-         wrap existing services regardless of implemen-
requirement, an image showing the requirement,    sources and to establish references to other re-      tation. IBM arrived at this internet-inspired
or an XML document, defining the attributes       sources or provide other tool-specific infor-         approach to lifecycle collaboration from our
of the requirement. A tool that tracks, for ex-   mation. For example, a product manager work-          experiences with our own customers challenges
ample, the relationship between a test case and   ing in a traditional requirements management          and from our extensive work on the Jazz plat-
a requirement does not need to understand         tool might document some requirements as              form. We are sharing our thinking with the
the requirement content; it only needs to know    use cases. A system designer working in a             community - describing the approach that
of its existence and location. When its users     UML modelling tool might then augment                 has emerged from our efforts as well as our ex-
want to see the contents of the requirement, it   them, without the necessity for tight depend-         periences in resource design. To begin with,
functions like a browser, getting the resource    encies on tool versions or a formal cutover           we outlined some typical lifecycle resources
and handing it to an appropriate tool.            and conversion from requirements phase to             and their relationships, and suggested a few
                                                  design phase, as it is often required with tradi-     sample resource descriptions. Now we are ap-
Although this flexibility can be really useful,   tional pair-wise tool integrations.                   plying this approach to our new product de-
situations may evolve where we can do more                                                              velopment to enable business analysts, devel-
with the resources when we know some details      The service interface to work with shared re-         opers, and testing organizations to collaborate
about the format of the resource. Therefore,      sources in OSLC architecture is again following       across a set of tools. Our collaborative ALM
in an OSLC environment, lifecycle resources       the internet mechanisms: RESTful web services         initiative is using this approach to integration.
are defined in XML and use common elements.       have been adopted as programming model.               The need for integration of tools increases
Now, the resource transitions from being a        For example, the system designer, armed with          with the growing variety of tools used during
black-box to being semi-transparent; any tool     his UML tool, might observe the need for new          the lifecycle. The traditional approach of a
can examine the common elements of these          requirements to be documented as use cases.           tight pair-wise integration between two tools
resources. For example, a tool could view the     He would like to create those requirements            works fine as long as it is only just these two
description of any lifecycle resource (assuming   and have them participating in the require-           tools that are used in a project. When multiple
a common description element was defined).        ments management tool approval process.               tools are used, this approach quickly comes to
In addition to the common elements, a tool        With a RESTful architecture, that tool might          its limits and any update can turn into an un-
can augment the resource with additional          only need to know the URL to which new re-            wanted adventure. The one for all approach,
elements to record tool-specific information.     quirements are posted to trigger this. The            one single tool with one single database for
                                                  UML tool need not be coded to or adopt the            each and every task in the lifecycle, is ques-
This internet-like approach allows tools to       requirements management system language               tionable as well, because it ignores the presence
share resources without becoming tightly cou-     or platform-specific API, enabling much looser        of grown existing tool environments with valu-
pled. Tools only need to agree on common          coupling between the two tools. Additional            able artefacts stored in there.
elements; they can change the format, content     services can be built on this base, offering the
or meaning of their own private elements as       possibility for common query and reporting,           OSLC shows a third way, which is to circumvent
required for performing their specific set of     traceability analysis, and process support across     the disadvantages of the two different ap-
tasks. The architecture can even accommodate      the artefacts.                                        proaches: by the use of concepts that have
lack of complete agreement on the common                                                                proven themselves on the internet, the tools
elements: the nature of XML allows a tool to      Each of these three steps enables improved in-        can be integrated at the resource level, and
quietly ignore elements it has no use for or      tegration possibilities. Individual tools may         common structures are emerging. These ensure
does not understand. This internet character-     choose to provide additional and valuable cus-        the basic compatibility needed, but also allow
istic is sometimes called graceful degradation,   tom steps of integration. The scope of Open           for extensions to accommodate specific devel-
in contrast to the typical tool behaviour of      Services for Lifecycle Collaboration is pur-          opment tasks. Expenses for the tight integration
catastrophic failure when faced with less-than-   posefully limited to provide some basic building      of tools are no longer required, neither on the
total compliance.                                 blocks that can benefit software delivery or-         vendor side for implementation and mainte-
                                                  ganizations and tool vendors alike, not to re-        nance or on the user side for continuous oper-
Common elements enable tools to create            place or constrain the entire universe of lifecycle   ation. Investments are protected because exist-
resources and to view and translate them into     tool integrations. Each of the techniques out-        ing tools can be integrated into a scalable and
a local format, but more resource design guid-    lined already can be applied to existing tools        flexible environment. 

                                                       Product News
 Rohde & Schwarz presents high-end               signed for testing video and audio interfaces           ETAS will be acquiring embedded system
  platform for testing audio/ video interfaces    that offers a wide variety of functions. The             security technologies and solutions
The new R&S VTC video test center is the          all-in-one solution provides realtime pro-            ETAS will be acquiring ESCRYPT, a system
ideal platform for use in R & D and com-          tocol and media content analysis and can              house specializing in embedded system security
plements the existing R&S VTS compact             be modified at any time to meet the re-               technologies and solutions. ESCRYPT’s solutions
video tester and R&S VTE video tester.            quirements of specific test environments.             are deployed in the automobile sector and in a
The comprehensive product family now              It can also be upgraded to comply with                variety of other industries, such as medical and
covers all applications in the consumer           new standards, which is what makes it such            automation technology, chip and information
electronics value-added chain. The R&S            a flexible solution.                                  technology, and mechanical engineering.
VTC is an entirely modular platform de-           News ID 15582                                         News ID 15546

    June 2012                                                            18
                                                                                                      TOOLS & SOFTWARE

  Lauterbach: TRACE32 PowerTools support            Agilent: two-channel oscilloscopes with
   Infineon’s AURIX TC27x family                      bandwidths from 50 MHz to 150 MHz
Lauterbach supports the new AURIX TC27x            Agilent Technologies introduced the 1000B
family with its TRACE32 Debugger. The new          Series oscilloscopes. The four new two-channel
AURIX TC27x family is the platform of Infi-        models, with bandwidths from 50 MHz to
neon’s next generation MCU family to meet          150 MHz, offer powerful capabilities at an at-
the requirements of the latest automotive pow-     tractive price for engineers, technicians and
ertrain and safety applications. It consists of    educators. All models in the 1000B Series are
up to three TriCore s to handle the application    equipped with a sharp color LCD display that
load in AMP, SMP or lockstep mode. The first       is easy to read even from wide angles. With up
AURIX device is the TC27x with 200MHz              to 16 kpts of memory per channel, the 1000B
triple core and 4MB eFlash.                        Series provides up to six times more memory
News ID 15601                                      than other scopes in its class.
                                                   News ID 15681
 iSYSTEM: collect trace information on
  MCUs without trace port                            Digia: handheld 3D imaging system for
iSYSTEM supports with its development and             medical applications
debugger software winIDEA (since version           An innovative handheld 3D imaging system
9.12.7) the so called Slow Run Mode. Slow          for use in medical applications has been devel-
Run allows the capture of the complete program     oped with the support of Digia, Qt Commercial.
execution and data trace – although the MCU        The Eykona Wound Measurement System, cre-
does not provide a debug trace port. When          ated by Eykona Technologies, provides clinicians
customers select a MCU, the price per unit is      with an objective and repeatable measure of
an important decision criterion. To save costs     the volume of wounds, allowing comparison
many manufacturers do not include an on-           and monitoring of the healing process. Qt
chip debug trace port on low-priced MCUs.          Commercial assisted Eykona in significantly
News ID 15544                                      reducing the project completion time.
                                                   News ID 15568
  IntervalZero: RTX software transforms
   Windows into a RTOS                               LDRA automates interface between tool
IntervalZero, whose RTX software transforms           suite and Atmel’s AVR Studio
Microsoft Windows into a real-time operating       LDRA has automated the interface between
system, is broadening the scope of its solution    the LDRA tool suite and Atmel’s AVR Studio.
through a vertically integrated RTX RTOS           This interface ensures that aerospace applica-
Platform. With a separate RTOS, there are ad-      tions developed using Atmel’s AVR ATmega128
ditional costs for redundant hardware in a         are certifiable to DO-178C Level A. Automating
second device to handle the real-time needs,       the interface provides an efficient way for de-
or for an extra IPC for the HMI. Integration is    velopers to more easily complete elements of
more complex because of separate development       DO-178C qualification that otherwise demand
teams, duplicate development environments,         a highly skilled and labor-intensive process.
and multiple code bases. The use of real-time      News ID 15674
hardware increases the time to market because
of the need to build custom hardware.                PLS: UDE 3.3 test and debug solution
News ID 15639                                         supports AURIX 32-bit multi-core MCUs
                                                   PLS presents the first optimized test and debug
  TI: true software-based, power-optimiza-        solution, the Universal Debug Engine (UDE)
   tion teaching tool for MSP430 MCUs              3.3, for the new multi-core architecture of the
Texas Instruments announced the ULP Advisor        32-bit microcontroller family AURIX from In-
software code analysis tool, teaching developers   fineon. The UDE 3.3 allows management and
how to create the most energy-efficient, ultra-    control of the various TriCore-CPUs within
low-power applications with TI’s MSP430 mi-        one user interface. This is supported by a flex-
crocontrollers. Created by MSP430 micro-           ible multicore program loader that enables
controller experts, the ULP Advisor tool is the    the loading of program code and data as well
first, true software-based, power-optimization     as symbol information separately for each
teaching tool for microcontrollers that brings     core. Management of the cores is carried out
together decades of MSP430 microcontroller         by a multicore run control manager, which
and ultra-low-power development experience.        offers a definition of core groups.
News ID 15638                                      News ID 15590

       Mjust information about each news is — on
           ore                                available
               have to type in the “News ID”.

                                                                         19                                      June 2012

Design kit enables making the most
of self-powered sensors
By Alfredo Ferlito, and Cesare Antognoli, Arrow Electronics

                     Self-powered sensors for
                applications such as building
                       automation are tipped
                for impressive growth in the
                    coming years. Now is the
                 right time for developers to
                  begin work with platforms
                    such as Arrow’s TheDrop
                        Wireless Kit, to gain a
                 head start in this important
                            emerging market
                                                                                                                         Figure 1. Key features of
                                                                                                                         TheDrop energy harvesting
                                                                                                                         wireless sensor boards
                                                                                                                         (solar board SBN shown)

  Self-powered wireless sensors provide the ul-    services such as HVAC controls and room light-      self-powered applications to flourish. Ultra
timate freedom to collect information from al-      ing to be adjusted automatically for optimum        low-power CMOS chip processes, advanced
most any location for monitoring and control        comfort and energy efficiency. The market for       power-management modes, energy-friendly
purposes. The sensors harvest ambient energy        smart building systems is also growing, at close    wireless standards such as the 2.4GHz IEEE
such as solar, thermal or kinetic energy, which     to 29% per year in Europe according to IDC,         802.15.4 radio, and low data-rate protocols
provides freedom from any need of batteries or      which predicts total revenues of $10.2 billion      such as ZigBee and others are some of the
power cabling leading to benefits such as low       from the sector in 2015. It seems clear that the    technologies that now enable small wireless
ownership costs, flexibility and environmental      market for self-powered wireless sensors is new,    systems to transmit valuable data over a mean-
friendliness. They are an important part of a       emerging, and potentially very large.               ingful range within an energy budget of only
total market for energy harvesting systems that                                                         a few millijoules (mJ). This is a realistic quantity
ABI Research has predicted will grow to more        Small solar panels and Peltier cells are among      of energy for a small number of solar cells, or
than $400 million by 2016. Numerous applica-        the most suitable energy harvesting mecha-          a Peltier element, to harvest within an accept-
tions can benefit from the advantages of self-      nisms for use in wireless networking applica-       able time period; the harvested energy is accu-
powered wireless sensors. Eliminating the battery   tions. The solar panel is a familiar technology,    mulated by charging an electrolytic capacitor,
gives extra freedom to create new form factors.     and has been used for many years to assist the      and the capacitor is then discharged to drive
The sensors can be installed quickly and easily,    batteries of small devices such as calculators      the wireless subsystem. One proviso is that
with no wiring required, and can also be repo-      and watches. The Peltier element is a thermo-       the energy must be discharged at a rate fast
sitioned at any time in the future if necessary.    electric device that converts heat energy into      enough to satisfy the power requirement of
Units can operate autonomously, reliably, with      electrical energy by exploiting the movement        the electronic system.
zero maintenance for long periods. They can         of charge carriers across a temperature gradient.
also be placed unobtrusively in inaccessible lo-    Other harvestable forms of energy include ki-       The combination of energy harvesting, stor-
cations if needed; an application reported re-      netic energy that can be collected from vibra-      age, and wireless subsystem is particularly
cently positions wireless self-powered sensors      tions or mechanical actions such as winding a       suited to applications in which small packets
on aircraft components to monitor condition         mechanism or pushing a switch.                      of data are transmitted at infrequent intervals.
and performance for safety purposes. The dom-                                                           Sensing environmental factors such as tem-
inant application in the near future, however, is   The quantity of energy harvested from such          perature or light is ideal, as these tend to
expected to be in smart buildings such as homes,    ambient effects is very small. Although typical     change slowly and accurate, high-speed re-
offices and factories.                              efficiency of devices such as solar cells has in-   sponse is not usually critical. The intervals
                                                    creased significantly in recent years, it is the    between data packets can be determined to
In smart buildings, large numbers of sensors        effect of these improvements combined with          allow plenty of time for the harvesting sub-
monitor variables such as temperature and           dramatic reductions in the energy consumed          system to accumulate sufficient energy to
lighting levels in multiple locations, enabling     by electronic components that has enabled           complete the radio transmission.

    June 2012                                                             20
                                                                                                                           TOOLS & SOFTWARE

                                                                                                           The host microcontroller for both types of en-
                                                                                                           ergy harvesting board is the Atmel
                                                                                                           ATxmega128A3, selected for its low power
                                                                                                           consumption, low supply voltage (1.6V to
                                                                                                           3.6V), 8-bit AVR CPU and 128KB self-pro-
                                                                                                           gramming Flash program memory. The Atmel
                                                                                                           ATxmega family also supports the international
                                                                                                           KnX networking standard used in home and
                                                                                                           building controls, which can help developers
                                                                                                           ensure interoperability with other building au-
                                                                                                           tomation subsystems where needed.

                                                                                                           TheDrop firmware is based on a proven wire-
                                                                                                           less UART example from the Atmel RZ600
                                                                                                           kit. The firmware has been ported to the
                                                                                                           Atmel AT32UC3B0256 microcontroller on
                                                                                                           the USB board, and also to the ATxmega128A3
                                                                                                           on the SBN and PBN energy harvesting
                                                                                                           boards. To meet the highly specific needs of
Figure 2. Setting up and running the system using the PC-based console provided                            TheDrop kit, enabling temperature and light-
                                                                                                           sensor measurements using harvested energy
To help engineers build and test energy har-       helps to ensure optimal efficiency by eliminat-         only, the source code has been modified to
vesting wireless sensor nodes quickly and cost     ing energy losses that can otherwise be caused          read the values of the NTC sensor and Osram
effectively, Arrow Electronics has created The-    by poor matching between the solar panel                SFH5711 and send data to the air as fast as
Drop Radio Kit, an energy harvesting evaluation    output and DC/DC converter input. Support               possible. After the transmission the
platform featuring low-energy devices from         for burst-mode operation at light loads is an-          ATxmega128A3 turns off automatically to
suppliers such as Atmel and Linear Technology.     other power-saving feature of the LTC3105.              preserve the stored energy. The modified
The kit comprises two energy harvesting radio      The quiescent current is reduced to just 24µA           firmware for each board can be tested on
boards, giving engineers the opportunity to        in this mode.                                           RZ600 and XMEGA-A1 EXPAIN kits with
evaluate solar or thermal energy harvesting                                                                very few changes. The code is downloaded to
technology. A third board in the kit is a USB-     The PBN energy harvesting board for use with            the board, and debugged, via the JTAG-MKII
powered receiver unit that connects to a PC        the Peltier cell included as part of the kit, is sim-   mini connector shown in figure 1.
acting as the controller and instrument panel      ilar to the SBN. The DC/DC converter used is
for the network. Figure 1 shows the solar energy   the LTC3109, which is more suited to the output         Figure 2 shows a selection of user-interface
harvesting and wireless subsystem board (SBN),     characteristics of the Peltier cell. The LTC3109        images showing how TheDrop Radio Kit is
highlighting key components and connections.       operates from an input as low as ±30mV and,             setup and used. After setting up and testing
The solar panel supplied with the kit connects     thanks to its proprietary auto-polarity architec-       the harvesting boards, the USB board is simply
directly to the energy input port. An NTC tem-     ture, is able to begin harvesting energy even           plugged into the computer and activated by
perature sensor and Osram SFH5711 ambient          when a temperature difference of less than              following simple instructions and selecting
light sensor are mounted on the board, and         ±1°C is present across the Peltier cell. With as-       the correct virtual COM port. Clicking START
the 2.4GHz antenna included in the kit connects    sociated external components including energy           then initiates communication with the sensor
to the radio subsystem built around the Atmel      storage, the LTC3109 provides a complete power-         boards, and the measured temperature and
AT86RF320 IEEE 802.15.4 low-power trans-           management solution for wireless sensing and            light levels are displayed on screen in centi-
ceiver. The AT86RF320 operates from a supply       data acquisition. Extremely low quiescent current       grade and Lux.
voltage as low as 1.8V and provides 3dBm of        and high efficiency maximises the harvested
RF output power.                                   energy available for the application.                   Given the global imperatives to manage re-
                                                                                                           sources, reduce energy consumption and save
The power conversion network connected to          The SBN and PBN boards store harvested en-              costs wherever possible, self-powered wireless
the energy input is a critically important part    ergy in a 680µF electrolytic capacitor, which           sensors can be used to overcome challenges
of the board. In the SBN, the major DC/DC          can be seen at the bottom of the SBN board              under each of these headings. Although the
converter is the Linear Technology LTC3105.        shown in figure 1. The system is able to store          key enabling technologies, energy harvesting
This device is optimised for use with a single     and retrieve energy efficiently using this ap-          and ultra low-power electronic design, are
photovoltaic cell, and has a low startup voltage   proach, and can accumulate enough energy to             not new, system integration to create an effec-
of 250mA and minimum input voltage of              complete the transmission of a single data              tive self-powered solution demands a new
225mV. Importantly, the LTC3105 implements         packet. To provide extra flexibility for developers,    combination of skills and knowledge. Devel-
maximum power-point tracking (MPPT),               TheDrop energy harvesting boards also provide           opers seeking a strong position in important
which continually adjusts the converter input      convenient connections for adding a superca-            markets for self-powered equipment need to
characteristic to maintain optimal power trans-    pacitor. This can increase the system energy            begin solving the challenges now, with the
fer as the solar panel output changes with         storage and discharge capabilities to support           help of an evaluation platform such as
time, temperature and solar intensity. This        extra functions or longer data transmissions.           TheDrop Wireless Kit. 

                                                                           21                                                                 June 2012

Avoid enemies and make friends
with embedded open source software
By Mahshad Koohgoli, Protecode

                       Open source software
                       invariably comes with
                associated license and other
                    obligations that must be
                       respected. This article
                describes a structured open
                   source software adoption
                process (OSSAP) that allows
                        organizations to take
                  advantage of open source
                     software in a controlled
                      and managed fashion.

 Marc Andreessen, cofounder of Netscape             ket, lower development cost, better security,      these obligations has repercussions that are
and the key investor in Linked-In recently an-       peer-reviewed quality, variety, zero licensing     similar to those due to shortcomings in product
nounced that “Software is eating the world”.         cost and multiple sources from mostly rep-         quality. Embedded devices such as consumer
There are more instances of embedded software        utable suppliers are some of the reasons where     products are distributed in volume, and any
in the world today than any other type of soft-      open source has become the software of choice      impairment in quality, or in meeting licensing
ware combined. It is the heart of transport,         for over 40% of embedded projects.                 obligations, can be very costly in the field.
safety, health, food, agriculture, defense, enter-
tainment and therefore virtually every sector        Better known examples of open source software      Project-level or organizational policies usually
of industry that one way or other touches our        targeted for embedded applications include         frame the acceptable terms and obligations.
everyday lives.                                      Android, embedded Linux and other open             Although some may find it difficult to admit,
                                                     source real time operating systems (RTOSes),       today resourceful developers do not write code
Complexity of software design within the em-         Qt User Interface (UI) used in phones and          from scratch. They know where to get code
bedded space has increased exponentially. In a       PDAs and refrigerators and industrial control      and enhance it with their own creativity. It is
way it has mirrored and followed the way gate        systems, and roughly 100,000 other projects        unreasonable and impractical to expect devel-
complexity in integrated devices has doubled         that cover everything from communications          opers to be aware of, and manage, code obliga-
every 18 months in the last forty years. The         stacks, web browsing, user interfaces, remote      tions as they create software under tight sched-
growth in code complexity has overlapped the         management, embedded databases, audio and          ules. Increasingly, organizations are deploying
change in business dynamics of our intercon-         video codecs and even virtual machines (as in      practices that allow managed adoption of open
nected global market. Demands for shortening         Java Virtual Machine). More than 40% of the        source in projects, shortening development
product development times, increasing func-          RTOS solutions for embedded environment            intervals and reducing development costs.
tionality in products and reducing development       are open source, and apart from Android they
costs have led to an increase in outsourcing,        include the heavyweights from vendors such         A survey of more than hundred technology
contracting, and code reuse. Open source soft-       as MontaVista, QNX and Mentor.                     organizations, from large multinationals to
ware, the ultimate manifestation of code reuse,                                                         small technology firms of less than 50 people
has become a key enabler of today’s competitive      However, the advantages of open source soft-       has indentified the best practices used in em-
embedded market.                                     ware can only be realized if its adoption is       bedded industry for leveraging and managing
                                                     managed. Open source software invariably           open source software. Establishing license poli-
From the first GNU in 1983 to invasion of the        comes with obligations that are represented in     cies, adopting package pre-approval processes,
whole IT stack by 2011, open source has pene-        their associated licenses, copyrights, security    creating a baseline of the existing inventory
trated every facet of software development.          vulnerability notices and export control classi-   of software, regular software analysis in real-
Such desirable attributes as faster time to mar-     fications. Failure to understand and respect       time and at build-time, before the final product

    June 2012                                                              22
                                                                                                                         TOOLS & SOFTWARE

is shipped to the market, are some of the            3. Existing portfolio assessment- this necessary    from established organizational policies that
steps deployed by the embedded industry.             step involves auditing the existing portfolio       are detected and remedied at this stage would
The following eight-step blueprint of the open       and establishing a baseline of what already ex-     reduce the time and cost of remedial actions
source software adoption process (OSSAP) is          ists in the organization. Establishing a baseline   further down the road. Any practical imple-
based on a survey of current organizational          is best done with an automated tool, ideally        mentation of this step requires an automated
practices. Increasingly organizations are view-      linked to the digitally-captured software li-       auditing tool linked to the software library
ing third party software license management          censing policy and, if the organization has         system, licensing policies of step 1, and pre-
as part of their software quality development        implemented package pre-approval process            approved package database of step 2. Any de-
process, and are evolving their existing quality     of step 2, also linked to the database of pre-      viations from organization policies should be
checklists to include all or part of the following   approved packages.                                  automatically flagged to the person checking
blueprint.                                                                                               the content into the library or other appropri-
                                                     4. Incoming third-party software assessment-        ate licensing authority in the organization.
1. Establishing a software licensing policy-         this necessary step involves a software licensing   Scanning reports should be examined, and
this necessary step involves creating a central      audit, of any package that is brought into the      the offending content should either be re-
definition of an IP and license compliance           organization. In this context, third party soft-    moved, sent for package pre-approval, or
policy acceptable to the organization. The or-       ware could be the content delivered by the          tagged appropriately for further investigation
ganization in this context can be a product          outsourcers or the contractors to the company.      and attention.
group, a project group, or the whole company.        It could also be any software that is brought
The policy addresses questions such as what          in for evaluation, purchased from a vendor,         7. Real-time assessment by automated devel-
license terms are acceptable, or alternatively       or an open source package, even if the organi-      oper assistants- this optional step is highly
what terms are objectionable, what vendors           zation has implemented the package pre-ap-          valuable in that it ensures licensing compliance
are approved, and what software products or          proval process of step 2. Similar to the audit      right at the developer workstation. This pro-
packages are authorized for use. The policy          carried out in step 3 for establishing a baseline   cedure is only possible, and feasible, if done
also defines the procedure for pre-approval          of what is already in the organization, this        automatically and carried out in the back-
of packages, for auditing software at different      step ensures there is a full knowledge of and       ground without disrupting development and
stages of development, and what to do once a         compliance with the licensing policy of step 1.     distracting developers. During the course of
policy violation is detected. Capturing the li-      The audit is based carried out using the same       development, a (resourceful) developer may
censing policy digitally allows linking the          automated tools used in the previous step,          access content from a web site, download a
policy with automated license management             again linked to the captured licensing policy       whole package from an open source forge, or
tools used in other steps of an open source          and pre-approved package databases. As part         bring in content already accessed from a stor-
software adoption policy. Typically the business     of this process, the pre-approved package           age medium (such as a USB stick). An auto-
manager, a licensing or legal counsel, and a         database may be updated.                            mated tool called a developer assistant inte-
representative of the development agency de-                                                             grated within the developer workstation detects
termine the software licensing policy and the        5. Regular software assessment- this stage, al-     new software files and analyses them in the
mandated workflow for the detection of policy        though popular, could be by-passed if auto-         background. Linked into the captured organi-
violations in the code base.                         mated library check-in or real-time preventive      zational licensing policy (step 1) and a database
                                                     assessment steps as described in steps 6 and 7      of pre-approved packages (step 2), it can in-
2. Software package pre-approval - this op-          are practised. Regular software audits are best     stantly alert the developer to any potential vi-
tional step defines and implements the proce-        carried out at pre-determined intervals, e.g.       olations and allow him/her to either remedy
dures that determine approved software pack-         weekly or monthly. Longer intervals increase        the problem or enter a comment and continue,
ages in an organization. Package pre-approval        the audit time (as more “new” software needs        if the organization policy allows that. Option-
is required in many organizations with tight         to be assessed). Also, the cost of replacing any    ally, a log can be created and reviewed by a
third party software policies. It ensures only a     offending content that is discovered during         project manager for future reference and
limited, and well understood and tightly con-        the audit becomes higher as development is          assurance.
trolled, set of packages of specific release ver-    rolled back. An automated tool, again linked
sions are used in products. Software package         to the licensing policies and pre-approved          8. Pre-shipment software assessment- this
pre-approval process involves the following          package database, is invaluable here. Intelligent   necessary step ensures there is a full under-
steps: (a) Requests- where a developer can re-       tools can detect the “new” software compared        standing of the content and obligations as-
quest a specific package to be authorized. The       to the software that was previously analyzed.       sociated with the product before it is released
request contains as much information about           The scanning process can be carried out very        to the market. Normally this step becomes
the package as possible such as its name, au-        quickly since the content-delta between the         part of the release check-list within an exist-
thors, license, pointers to where additional in-     scans is typically small. As mentioned earlier,     ing quality product development or gate
formation can be found or package could be           most organizations that choose to deploy au-        process. Again, automated tools, linked to
obtained. Also the request should specify the        tomated open source management tools carry          the final build process, can simplify the task
way the package is going to be used in the           out regular software audits.                        ad provide an accurate list of software pack-
product. (b) Logging- where a request database                                                           ages and components used in the shippable
tracks requests and their approval status. (c)       6. Real-time library check-in assessment- this      product. A final license list, together with
Investigation- where the examiners can exam-         optional step ensures that any content com-         an actionable list of all license obligations
ine a request, and examination usually requires      mitted to the organization’s source control         depending on the way the packages are used,
an audit of the requested package (manual or         management system is well understood from           completes the release checklist. Any license
automated scanning). (d) Approval (or rejec-         a licensing obligations viewpoint. Library          incompatibility, or specific items that restrict
tion) of the request. Once a software package        check-in assessment provides a near-real-time       marketing or distribution in certain market
is approved, the package approval is logged          visibility of the content that could find its       regions (e.g. encryption content) should be
and its status is available to the organization.     way into company products. Any deviation            clearly highlighted at this stage. 

                                                                           23                                                                 June 2012

Verification of FPGA software:
a simulating issue
By Matthew Noonan and Sean Parkinson, Resource Engineering Projects

                          The verification of
                     FPGA-based firmware,
                when used in safety and/or
                mission-critical applications,
                      presents a number of
                      challenges - including
                  confirming that your test
                           benches are able
                              to catch errors.

                                                    Figure 1. The DO-254 lifecycle places considerable emphasis on the verification and validation
                                                    processes. Moreover, the methods/tools used to verify the design (as a concept and when
                                                    implemented/synthesised) must themselves be subject to qualification.

 One of the main reasons for using a field        Similarly, most EDA tools have either fallen in        tion, which has much in common with DO-
programmable gate array (FPGA) within an           price during recent years or – more commonly           254. Indeed, DO-254 frequently references
embedded system is performance. Whereas            – the vendors are bolting on a host of no-cost         DO-178B, particularly regarding the use of
micros are good for implementing complex           additional features. Lastly, reliability - or rather   development tools.
sequential algorithms on small to medium           determinism - can almost be taken as a given
volumes of data, FPGAs are ideal for perform-      since the functions you are designing are ulti-        Requirements capture can be done using one,
ing relatively simple algorithms quickly in par-   mately implemented in physical hardware (i.e.          more or all of the following. Plain language
allel on large volumes of data. They are there-    logic gates and registers). Note: we say almost        that incorporates the kind of unequivocal con-
fore good for time-critical applications, and      be taken as a given, as functionality may be           structs, such as If Then and Else, found in C
this is why they are being increasingly employed   compromised through effects such as single             and C++. Schematic diagrams - to illustrate
in safety- and mission-critical applications       event upsets and latch-ups (SEUs and SELs re-          functional blocks and their connectivity. State
within the aerospace and defence sectors. Other    spectively). This is always a consideration for        machines - to reflect the transitions from func-
FPGA benefits include a potentially smaller        high integrity digital systems, and fail-safes         tion to function and to identify illegal states
PCB footprint, due to lower component counts,      must be designed into the overall system               or lock-up scenarios. And sequence diagrams -
and the flexibility of being able to implement     against this.                                          to show the intended order in which certain
anything from a simple logic circuit through                                                              functions should execute (in software design,
to a custom processor.                             An FPGA development flow has much in com-              this would mainly define scheduling or the in-
                                                   mon with traditional embedded software de-             ternal order of software functions). This
Also, FPGAs typically facilitate a short time to   velopment. Where differences exist they tend           method would be used to capture not only the
market - because of how the firmware can be        to relate to the verification and validation ac-       top-level functional requirements but also to
prototyped and debugged - plus modern              tivities required for aerospace and military ap-       incorporate the performance, environmental
devices can be reprogrammed in the field.          plications. The DO-254 standard (Design As-            and safety requirements (as a hardware item/de-
This latter aspect can afford greater end-         surance Guidance For Airborne Electronic               vice and as a contributory component within
product longevity through firmware                 Hardware), for example, governs the processes          a system). Also, in parallel, a test bench must
patches/upgrades, which in turn acts as a long-    for developing complex hardware (such as               be defined (to test your final design against its
term cost reduction measure, since board           FPGAs and CPLDs). And for convenience, we              requirements), and in addition, a plan must
replacement can be avoided (or in the worst        shall adhere to its terminology where possible         be created with regard to how to verify that
case postponed). The (per gate) cost of FPGAs      but draw analogies (where relevant) to software        your test bench will do its job properly. Con-
has fallen significantly during recent years;      development activities. We shall also make ref-        ceptual Design is arguably the first real step
making them a very attractive alternative to       erence to DO-178B, Software Considerations             towards ideal world hardware (at the virtual
ASIC spins and their associated NRE costs.         in Airborne Systems and Equipment Certifica-           component level). Working in one of two

    June 2012                                                              24
                                                                                                                       TOOLS & SOFTWARE

                                                                                                       version meets the functional, timing and
                                                                                                       performance/speed requirements expressed
                                                                                                       during requirements capture.

                                                                                                       Also, whilst simulation is used to verify that
                                                                                                       the expected outputs occur for the anticipated
                                                                                                       input conditions, we also need to look for the
                                                                                                       unexpected. This is typically managed through
                                                                                                       code coverage techniques, where the use of
                                                                                                       particular statistics (e.g. branches taken,
                                                                                                       Boolean combinations exercised and statements
                                                                                                       exercised) is employed to ensure that all sce-
                                                                                                       narios have been considered to satisfy the test-
                                                                                                       ing requirements defined by the standards.
                                                                                                       For the higher level integrity projects this can
                                                                                                       be up to and including modified condition/de-
 Figure 2. The logic function Output = (Input 1 AND Input 2) OR Input 3 is described in VHDL           cision coverage (MC/DC), which defines a set
 to produce the circuit shown (effectively a graphical representation of the gate-level net list).     of rules ensuring that each decision tries every
                                                                                                       possible outcome, each condition in a decision
hardware description languages (HDLs) -            to model both the Conceptual and Detailed           takes on every possible outcome, each entry
VHDL (popular in Europe and standardised           Designs before proceeding any further. Mod-         and exit point is invoked, and each condition
by IEEE 1076-1993) or Verilog (more prevalent      elling gives you confidence that complex control    in a decision is shown to independently affect
in the US) – the behaviour and interaction of      systems will function as expected (given ideal      the outcome of the decision.
major functional blocks is described at the        world conditions/inputs) before going on to
register transfer level (RTL). For example, if     the costly verification activities required by      Production Transition is, in DO-254 words,
an FPGA needs to interface with a processor        DO-254 (and DO-178B). In other words, mod-          the establishing of a baseline that includes all
then it will need to contain a functional block    elling is effectively your first will-the-design-   design and manufacturing data needed to sup-
for processors comms. The same applies to in-      work sanity check.                                  port the consistent replication of the hardware.
terfacing with buses (PCI, CAN etc). Note:                                                             This is analogous to software release planning
this design phase is analogous to the architec-    Implementation takes the RTL description            but is in fact much more of an onerous task in
ture phase (in UML for instance) when de-          (within the HDL) and synthesises it to the          hardware.
signing a software-based application. Concep-      gate-level net list needed to program a target
tual design also describes the connectivity of     FPGA. However, it is necessary (indeed man-         Resource Engineering Projects (REP) has, in
the functional blocks (analogous to the placing    dated under DO-254) to verify the gate-level        addition to undertaking a variety of software
and routing of components on a PCB). The           net list implementation of the design through       and traditional embedded systems designs,
conceptual design of the FPGA also feeds into      simulation, which is where the test bench           worked on a number of firmware (FPGA) de-
the test bench (typically written in the same      comes into play. It provides the necessary          signs during recent years. For example, the
HDL as the FPGA design). Detailed Design           stimuli (inputs, control signals, resets and        company is an active partner on the electric
drops down to describe the contents of each        clocks) to verify that the RTL and gate-level       drive system of WheelTug which, when installed
block, again using the VHDL or Verilog to de-      implementations are effectively just different      in the nose landing gear of an aircraft, will en-
scribe the RTL. The test bench is similarly re-    views of the same design (i.e. the synthesis        able it to manoeuvre on the ground without
fined. For complex FPGA designs, it is advisable   was successful), and that the gate-level net list   using its main engines and without assistance

from airport tug vehicles. The drive system          ment. One additional task that comes from             whilst not a requirement is highly recommended,
will use electric motor technology that requires     employing this process on safety-critical projects    as the earlier you can find errors the lower the
very precise pulse-width modulation (PWM)            is that the test bench must, itself, be verified to   cost of fixing them. On the standards front
control. Critical timing can be in the order of      show that it is capable of finding errors. Note:      there are core common principles between DO-
a few nanoseconds and the only way to guar-          this requirement falls under the tool qualifica-      178B and DO-254. Both standards are published
antee the speed and determinism is through           tion aspects of the high level standards such as      by RTCA Inc. (which covers the Americas, Aus-
using an FPGA; the WheelTug project will re-         DO-254 and DO-178B. The process for test              tralia and Asia) and EUROCAE (which covers
quire certification to DO-178B. On this project,     bench validation is the same as the verification      Europe and designates DO-178B as ED-12B
the requirements capture was performed in            of the implemented design, in that other test         and DO-254 as ED-80).
TeleLogic DOORS, using a mixture of free             benches are written (again in VHDL) that will
text and diagrams, and the conceptual and de-        insert faults into the original test bench, to        Unfortunately there is currently no hard and
tailed design phases were done in ARTiSAN            produce results that confirm that the original        fast guidance on whether firmware should be
Studio (describing the RTL connectivity in           test bench meets its requirements.                    treated as hardware (DO-254) or software
VHDL). The design was then modelled in                                                                     (DO-178B). However, the similarities in the
MatLab, to verify that the requirements were         Whilst software and firmware design flows are         demands for the level of verification needed
met (in terms of expected behaviour).                very similar, software languages are typically        and the methods used to achieve these means
                                                     used to describe functions in terms of how out-       that either standard can be used for a proposed
Following a critical design review (CDR), due        puts should behave in relation to inputs during       certification of an FPGA implementation. The
shortly, REP will simulate the design in Model-      the sequential execution of a program. In VHDL        issue of DO-178B and DO-254 in firmware
Sim. The VHDL will then be imported into             or Verilog you are describing the connectivity        certification has been addressed by the DO-
Libero IDE which will synthesise the RTL into        of hardware functions that will see the processing    178C committee (of which REP is an active
the gate-level net list. The simulation will also    of all inputs in parallel. Verification of the        member), and the guidance, due out shortly,
involve the creation of a VHDL test bench            FPGA design, a requirement under DO-254               is that either standard is applicable and whichev-
which will then be used to exercise the imple-       and DO-178B, is best done through simulation          er approach is chosen must be documented as
mented design within the ModelSim environ-           – but before that the modelling of the RTL            part of the certification plan. 

                                                          Product News
  Mouser and TDK-Lambda announce                    and interface functions on a very small foot-           Mouser: EZ-USB FX3 SuperSpeed USB
   partnership for global distribution               print featuring superior thermal characteristics.        controller from Cypress
Mouser Electronics has announced its global          News ID 15675                                         Mouser Electronics announced that it is stocking
partnership with TDK-Lambda providing de-                                                                  the EZ-USB FX3 SuperSpeed USB controller
sign engineers with reliable power solutions           Freescale introduces three reference               from Cypress Semiconductor as well as the USB
for their latest designs through Mouser’s fast,         designs to help redefine battery charging          3.0 Re-Driver from NXP Semiconductors. The
convenient ordering capabilities. TDK-Lamb-          Freescale announced three reference designs           Cypress EZ-USB FX3 is the next-generation USB
da’s highly reliable products reflect the latest     for wireless charging that could change the           3.0 peripheral controller that enables developers
advancements in materials technology, process        way consumers power their energy-hungry               to add USB 3.0 device functionality to any system.
technology, evaluation & simulation technol-         devices. The wireless charging reference design       News ID 15644
ogy, circuit design technology and other core        for high-capacity, single- and multi-cell battery
technologies of the TDK Group.                       packs targets applications including power              MSC: Cree extends XLamp ML family of
News ID 15665                                        tools, handheld radios and various industrial            LEDs
                                                     applications. The reference design charges four       The new Xlamp ML-C (Distribution: MSC)
  Rutronik: WLAN modules with integrated            Li-Ion battery packs simultaneously to deliver        convinces with a very even light distribution
   WLAN and TCP/IP stack                             a total of 120 watts of power.                        and is available in different price-performance
The RS9110-N-11-22-(xx) module from Red-             News ID 15685                                         variants. The new XLamp allows the use of
pine’s Connect-io-n family of products is a                                                                more efficient and more compact driver, for
complete IEEE 802.11bgn based wireless device         Data Display: highly modular platform               example to offer LED replacement lamps more
server that directly provides a wireless interface     for industrial applications                         cheaply. The single footprint of the ML-housing
to any equipment with a serial or SPI interface      Data Display Solution introduces a new prod-          is retained in the new LED. This gives customers
for data transfer. It is available with integrated   uct line of assembly monitors. The two new            the opportunity to expand their product port-
antenna or with uFL connector for external           series of monitors, „KioskLine“ and „Perfor-          folio quickly and easily.
antenna at distributor Rutronik.                     manceLine“, present an utmost modular plat-           News ID 15563
News ID 15652                                        form for professional touch applications. The
                                                     PerformanceLine is characterized by its robust          FTDI signs global distribution agreement
  Vincotech: power module for decentralized         construction, and it is optionally available             with Arrow Electronics
   motor drive applications                          with an IP65 protected front panel. The in-           Future Technology Devices International has
The growing trend of decentralized drives in         dustrial PC platform is aligned for a very long       signed a global distribution agreement with
factory automation demands for a new kind            availability. Data Display with its KioskLine         Arrow Electronics. Under the agreement, Arrow
of inverter with widely improved performance.        fulfills the needs of mass markets like POS as        will distribute FTDI’s complete portfolio to
To achieve these requirements a novel Power          well as demanding store fittings (Shop-eMedia)        customers in the Americas, EMEA and Asia
Module is needed, which incorporates a stan-         with individual design and functionality.             Pacific regions.
dard module together with all the drive, sense       News ID 15594                                         News ID 15602

    June 2012                                                               26
                                                                                                                                        PRODUCT NEWS

  PEAK-System: programmable converter                  Holtek: synchronous step-up DC/DC
   for RS-232 to CAN                                     converters
With the PCAN-RS-232, PEAK-System offers              Holtek announced a new range of synchronous
a versatile converter for RS-232 to CAN. This         step-up DC/DC converter, the HT77xxS series.
allows, for example, the connection to CAN            The “S” suffix in the part number indicates          Editors
bus of control or diagnostic units having a           synchronous operation. The HT77xxS devices,          Jürgen Hübner
serial interface. The central part of the converter   manufactured using trimmed CMOS technol-             phone +49(0)8092-2477413
                                                                                                           fax     +49(0)8092-2477429
is the freely programmable microcontroller            ogy, have a low start-up voltage of only 0.7V
NXP LPC2194 with 16/32-bit ARM CPU.                   and a standby current of 4uA. These features
Using the supplied library and the WinARM             are especially suitable for use in applications      Wolfgang Patelay
software (contains the GNU Compile Collec-            which are powered using a single Alkaline, Ni-
tion GCC for C and C++) a custom firmware             MH, Ni-Cd or Lithium-ion cell.
                                                                                                           Tony Devereux
can be created and afterwards be transferred          News ID 15566                              
to the module via CAN.
News ID 15530                                           GLYN and ARS Software: Bluetooth for              For Reader Inquiries and Address Changes
                                                         Renesas RX210                                     please contact:
  TI speeds data rates in highly-loaded              You can now get iAnywhere Blue SDK 3.2 (Blue-
   CAN networks with new transceivers                 tooth 2.1+EDR-compatible) for Renesas micro-         Sales & Marketing Director
Texas Instruments introduced a family of              controllers in the RX210 series. This new devel-     Manfred Blumoser
turbo CAN transceivers designed for data              opment will save time and money. The iAny-           phone +49(0)8092-2477411
                                                                                                           fax     +49(0)8092-2477429
rates in excess of 1 Mbps, meeting the growing        where stack was ported on RX MCU with the
demand for more nodes and greater data                help of GLYN. The idea is to simplify the devel-
transmission length in today’s industrial CAN         opment of Bluetooth systems on the basis of          Claudia Mellein
networks.       The    SN65HVD255          and        the RENESAS RX210. The developer has prac- 
SN65HVD256 devices offer short propagation            tically no porting or integration requirements.      Christiane Lockner
delay and fast loop times to support higher           News ID 15584                              
data rates and deliver more timing margin in
                                                                                                           Sales Office - UK and USA, Benelux,
these systems. These devices continue TI’s              Swissbit: CFast card with SATA II
CAN innovation and provide a next-genera-                interface and capacity of up to 64GB              Blue Sky Communications
tion design path from the SN65HVD251 and              With the new F-200 series CFast card and the         Malcolm Cameron
SN65HVD1050 transceivers.                             SATA CompactFlash card, Swissbit has ex-             21 Cliffe Avenue
                                                      tended its CFast portfolio with a new processor      Westbrook,
News ID 15646                                                                                              Margate, Kent CT9 5DU, UK
                                                      technology, which has enabled it to design           phone +44 (0)77 88-10 84 11
  Freescale announces new Qorivva                    SLC storage cards with a capacity of up to           fax      +44 (0)80 82-8010 57
   automotive powertrain microcontroller              64GB. The F-200 series includes an SATA II 
Freescale has announced sampling of the mul-          (Spec 2.6) interface and is compatible with
                                                                                                           Sales Office - Asia
ticore Qorivva MPC5746M, a high-perfor-               ATA7 and ATA8. A high level of reliability is        Jean Cheng,
mance 32-bit MCU built on a new 200-mega-             achieved through well designed wear leveling,        Vivian Hung,
hertz quad-core Power Architecture platform.          read disturb management and the BCH-ECC              Innovative Media Information & Services
The Qorivva MPC5746M increases the com-               unit, which can correct up to 24 bits per 1024       7F-3, No. 26, Sec. 2, Ming-Quan East Rd.
                                                                                                           Taipei 104 Taiwan
putational and memory capabilities available          bytes using a tried-and-tested procedure.
                                                                                                           phone +886 2 2563 1186
to the automotive industry, including 4 MB of         News ID 15560
embedded flash memory. The new device pro-                                                                 Head Office
vides more than twice the performance of                ADDI-DATA: RTX drivers for PCI-Express
Freescale’s benchmark-setting MPC5674F                   boards, PCI boards and CompactPCI
MCU, while maintaining the same power                    boards
budget and capability of running in harsh au-         ADDI-DATA has announced that it is offering          ICC Media GmbH
tomotive under-hood environments.                     drivers for IntervalZero’s RTX hard real-time        Rauwagnerstr. 5
                                                      software for real-time measurement, regulation       85560 Ebersberg / Germany
News ID 15512
                                                      and control applications on numerous inter-          Editorial Office UK
  CONEC: flange clutch for applications              ference-free PCI-Express boards, PCI boards          36a Blackacre Road
   in harsh environments                              and CompactPCI boards. IntervalZero’s sym-           Theydon Bois
CONEC takes account of the increasing demand          metric multiprocessing-enabled RTX trans-            Essex, CM16 7LU
of connectors for continuous and reliable data        forms Microsoft Windows into a hard RTOS,
                                                                                                           Copyright© All rights reserved.
transfer even in harsh industrial environments.       and is a key component of IntervalZero‘s ver-        No part of this publication may be reproduced or transmitted
For this interface solution required by the market,   tically integrated RTX RTOS Platform. ADDI-          in any form or by any means without the prior express written
                                                                                                           permission of ICC Media.
CONEC has supplemented the already existing           DATA, a long-time IntervalZero Partner, noted        Although we make every effort to present up-to-date, accurate
flange family M12x1 by a new model with               that because RTX supports multicore multi-           information, boards&solutions will not be responsible for any
screen connection for direct board mounting.          processing, users can perform several applica-       errors or omissions or for any results obtained from the use of
                                                                                                           such information. The magazine will not be liable for any loss
In this model, the flange housing is completely       tion tasks simultaneously on different processor     caused by the reliance on information obtained on this site.
closed up to the circuit board 360°. Screen con-      cores. Also, because RTX supports Message            Furthermore, ece does not warrant the accuracy or
nection is done via three moulded solder pins         Signalled Interrupts it can offer better real-       completeness of the information, text, graphics in this maga-
                                                                                                           zine. The opinions expressed in the articles are those of the
that are soldered directly onto the circuit board.    time ability on the PCI-Express boards.              authors and not necessarily the opinions of the publisher.
News ID 15606                                         News ID 15696
                                                                                                         Tools Muss

                                                                            27                                                                                June 2012

  Microsemi: system management design             MathWorks: Simulink code generation               Toshiba: ARM Cortex-M0-based
   tools for communications                         targets built into Freescale motor control         microcontroller for smart metering
Microsemi introduces a suite of system and          toolbox                                         Toshiba Electronics Europe is launching a 32-
power management design tools for high avail-     MathWorks announced that Simulink code            bit RISC microcontroller built around the
ability wired and wireless communications in-     generation targets have been built into           ARM Cortex-M0 processor core. The new
frastructure equipment. The new design tools      Freescale’s new Motor Control Development         TMPM061 is also Toshiba’s first Cortex-M0
include Microsemi’s Mixed Signal Power Man-       Toolbox through Embedded Coder. The tool-         device specifically designed for smart metering
ager 4.0 reference design, which supports up      box, consisting of Simulink motor control         applications. The new microcontroller allows
to 64 power rails and mixed analogue and          blocks and target-ready code generation sup-      designers to replace the conventional two-chip
digital point-of-loads (POLs), as well as         port, lets automotive and industrial controls     analogue front end and processor approach to
PMBus-based communication. The company            engineers design motor control systems using      smart meter design with a single IC. ARM’s
also offers an evaluation kit that can be used    Freescale microprocessors in IEC 61508 (SIL3)     smallest processor, the ARM Cortex-M0 de-
with Microsemi’s SmartFusion customisable         and ISO 26262 (ASIL-D) compliant systems.         livers exceptionally small silicon area, low
system-on-chip solution to enable quick           News ID 15518                                     power and minimal code footprint, making it
product-functionality assessments.                                                                  ideal for smart meter designs.
News ID 15539                                       Gleichmann now distributes displays            News ID 15666
                                                     from Kaohsiung Opto-Electronics
 ADI: four-channel, 16-bit, 125-MSPS             Following the integration of the display busi-     Xilinx ships heterogeneous 3D FPGA
  A/D converter                                   nesses of Hitachi, Sony and Toshiba to create     Xilinx announces initial shipments of the
Analog Devices introduces the addition of a       Japan Display and the integration of Hitachi’s    Virtex-7 H580T FPGA 3D heterogeneous all
4-channel high-speed A/D converter to its         industrial display products in the newly found-   programmable product. Virtex-7 HT devices
data converter product portfolio. The AD9653      ed Kaohsiung Opto-Electronics (KOE), the          use Xilinx’s SSI technology and features up to
A/D converter is designed for medical imaging     highly successful partnership between Hitachi     sixteen 28 Gbps and seventy-two 13.1 Gbps
and communications applications where the         Europe and MSC-Gleichmann now enters into         transceivers, making them the only single-
combination of high channel density, low          a new phase.                                      chip solutions for addressing key Nx100G and
power and small size provide systems engineers    News ID 15608                                     400G line card applications and functions.
with greater design flexibility and lower                                                           News ID 15671
per-channel cost for data conversion.               SiLabs: customer- friendly microcontroller
News ID 15612                                        die sales program                                Infineon: 32-bit MCUs for safety and
                                                  Silicon Laboratories introduced a customer-          powertrain requirements in automotive
 Holtek: 4-channel CCD vertical driver           friendly microcontroller die sales program,       Infineon Technologies introduced a new AURIX
Holtek has released its new 4-channel CCD         accelerating time to market and giving cus-       family of 32-bit multicore microcontrollers that
vertical driver, the HT82V805A. When used         tomers another option for small-footprint de-     serves the requirements for powertrain and
together with a CCD sensor the device is suit-    signs. Silicon Labs’ new die sales program has    safety applications of the automotive industry
able for use in black-and-white or color sur-     a minimum order quantity of only one wafer        and features up to three independent 32-bit
veillance cameras. Compared with its previous     unlike typical die sales programs that require    TriCore processor cores to meet the highest
product, the HT82V805, this new device offers     very high-volume orders to qualify.               safety standards. The AURIX multicore archi-
more competitive pricing in addition to re-       News ID 15611                                     tecture was developed according to an audited
taining all of the original ESD protection fea-                                                     ISO26262 compliant process and designed to
tures. Regarding device features, the               austriamicrosystems announces new              efficiently meet ASIL D on application level.
HT82V805A includes two 3-level vertical driv-        company “ams” brand                            News ID 15586
ers, two 2-level vertical drivers and a single    austriamicrosystems announces that “ams” will
2-level electronic shutter driver.                be its new company brand. The new brand
News ID 15514                                     name, “ams,” unites austriamicrosystems and
                                                  the brand and identity of TAOS (Texas Opto-                               COMPANY                PAGE
  Digi-Key inks global distribution              electronic Solutions). ams, headquartered in
   agreement with Infinite Power Solutions        Unterpremstaetten, Austria, is a leading global                           ARM                      11
Digi-Key announced the signing of a global        designer and manufacturer of high perform-
distribution agreement with Infinite Power        ance analog ICs that provides innovative analog
Solutions. The THINERGY Micro-Energy Cell         solutions to the most challenging applications
product line of solid-state, rechargeable thin-   in sensors and sensor interfaces, power man-                              Digi-Key                  2
film batteries from IPS serves to address an      agement and wireless. ams’ products are aimed
                                                                                                        Advertisers Index

ever-increasing need for a maintenance-free,      at applications which require high accuracy,
embeddable energy storage solution that lasts     wide dynamic range, sensitivity, and immunity
the life of the application.                      to noise or ultra-low power consumption.                                  Express Logic            19
News ID 15545                                     News ID 15595

                                                                                                                            Green Hills Software      5

     M      ore information about each news is available on
      You just have to type in the “News ID”. —
                                                                                                                            Lauterbach               25

    June 2012                                                           28

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