A+ Hardware Exam Cheat sheet

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							                                        A+ Hardware Exam Cheat sheet

Chapter 1
     Hardware Exam 220-301
     Register at www.vue.com for exam.
Chapter 2 Motherboard
     The form factor determines the actual physical shape & dimensions of the board.
     ISA is acronym for Instruction Set Architecture
     1983 IBM released eXtended Technology XT
     XT motherboard used jumpers and DIP Switches. AT introduced ROM BIOS & CMOS.
     1984 IBM released Advanced Technology AT form factor
     AT used 16-bit data path, first processor to use the AT form factor was Intel 80286. AT form factor
      use 5 pin DIN connector for Keyboard.
     1995 Intel released Advanced Technology eXtension (ATX) form factor. It is Open Standard means
      that anyone can use the design freely.
     ATX uses a single-keyed 20-pin Power supply Connector. ATX form factor featured I/O ports built
      right into the board. CPU Case Low Profile eXtension (LPX) developed by Western Digital was
      replaced by NLX.
     ISA original at 4.77MHz eventually set at 8.33MHz. VESA BUS is directly attached to 32-bit
      Processor. PCI was introduced in 1993 by its Intel 32 bit bus running at 33/66MHz; then changing
      to 64 bits ate 133MHz. PCI bus ad bus mastering enable several devices to share a single expansion
      slot’s IRQ. IRQ 9 being shared by multiple devices.
     North Bridge and South Bridge
          o North Bridge is generally used for high speed interface card such as video accelerator,
              Synchronous RAM (SRAM) and memory
          o South Bridge is generally used for slower devices such as USB ports, IDE drives & ISA
              slots. South Bridge works in conjunction with what’s called a Super I/O chip.


                                          CPU
                                                                  L2
                                                   L1


                                   400 MHZ       Front Side Bus




                      Fast                   NORTH                     AGP at 133 Mhz SDRAM,
                                                                       at 400 DIMM
                      Processing             BRIDGE




                      Slow Processing        SOUTH                     USB 1 & 2
                                                                       IDE 1, IDE 2
                                             BRIDGE                    CMOS, RTC


                      Very Slow
                      Processing
                                             SUPER I/O
                                             CHIP                      COM 1 2 LPT 1
                                                                       Floppy, K/B, Mouse. Flash
                                                                       ROM
     The main difference between a PCI bus and a VL-Bus is that the PCI bus is a specifically designed,
      high speed main expansion bus shared by multiple devices. VL-Bus was dedicated to single device.
     PCI-X specifies a 64-bit bus and uses clock speeds of 133Mhz, 266Mhz and 533Mhz
     PCI was a 32 bit bus, clocked at 33/66MHz with 133MB/s.
     PCI-X (rev 1.0) provided for 133MHz clock speed allowing for 1GB/s throughput.
     PCI-X (rev 2.0) used 266 & 533Mhz producing 4.3GB/s throughput.
     DMI Desktop Management Interface ensures that the PnP device can store configuration
      information in Management Information Format (MIF) files. The DMI Service Layer stores the
      information to an MIF database.
     MCA IBM Micro Channel Architecture, 32bit later went away.
     CPU works with the North Bridge and the memory controller to move data bits in and out of Main
      Memory
     PCMCIA Personal Computer Memory Card Industry Association
          o Type I 3.3 mm Type II 5 mm
          o Type III 10.5 mm Type IV thicker than 10.5
     ISA 16 bit bus ISA clocked at 8.33MHz
     PCI 32 bit & 64 bit bus clocked at 33/66MHz
     PCI –X is clocked at 133/266/533MHz
Chapter 3 Memory Types and Forms
     Shadow RAM is a method of storing a copy of certain BIOS instructions in main memory.
     DRAM cells are made up of many capacitors.
     SRAM Static RAM works with transistors, rather than capacitors. SRAM is a lot faster than DRAM
      and SDRAM. SRAM is more expensive to manufacture. SRAM is typically used in Level 1 and
      Level 2 caches L2 cache is usually 256KB or 512KB. By keeping as much information as possible
      in SRAM (cache) the computer avoids having to access the slower DRAM.
     L1 and L2 caches run at the speed of the processor bus known as FSB
     SDRAM is synchronous because it waits for a clock tick before responding to instruction.
     SDRAM modules should be sync at 100MHz. PC100 standard was upgraded to PC133.
     Intel PC800 RDRAM was released with 800 series chipset running at 800MHz.
     PSRAM is called Pseudo Static RAM with built-in refresh and address control circuitry to make it
      behave similarly to SRAM.
     ROM BIOS is where the motherboard remembers the most basic instructions about the hardware of
      a particular chipset. CMOS stores system configuration settings as well as settings for additional
      hardware connected to basic chipset. CMOS requires small amount of electricity to maintain its
      settings.
     Upto 486 family of chips the CPU had no internal cache. The 80486 introduced 8KB internal L-1
      cache which was increased to 16KB. The Pentium added 256KB or 512KB external L-2 cache.
     L-3 cache is to build some additional memory chips directly into the North Bridge. All three types
      of cache runs at the processor speed, rather than the speed of a slower memory bus.
     Burst Mode: Next expected information is prepared before the CPU actually makes a request.
     DRAM originally began with FPM Fast Page Mode. Fast Page mode simplifies the process by
      providing an automatic column counter. FPM automatically increments the column address when the
      controller selects a memory page. Using FPM, the controller doesn’t have to waste time looking for
      a range address for at least three more times.
     FPM evolved into EDO (Extended Date Output) EDO process eliminates 10ns per cycle delay of
      FPM generating faster throughput. FPM is like writing all zeros to disk and EDO is like changing
      only the first letter of the index name. Both FPM and EDO are asynchronous. In asynchronous mode
      the CPU and memory controller have to wait for each other to be ready before they can transfer data.
     RDRAM is known as narrow channel system because data is transferred only 2 byte (16bits) at a
      time. It reads data on both rising and falling edge of the clock signal. RDRAM use the processor
      memory bus timing frequency not the motherboard clock. SDRAM are synced to the CPU at
      multiple closer to the motherboard clock. RIMMs are connected to the bus in series. Data item has to
      pass through all modules before it reaches the memory bus. RDRAM uses 16-bit for data signals.
     DDR came about as a response to Intel’s RDRAM changing architecture and licensing fees. DDR
      reads data on both the rising and falling edges of the clock tick. DDR memory supports both ECC
      (error code correction) used in server and non-parity used in desktop/laptops.
     The big difference between DRAM and SDRAM is the synchronization feature. SIMMs are usually
      30-pin 8-bit chip or 72-pin 32-bit chip modules and DIMMs uses 168 pin configuration.
     Parity is set to odd or even to make total to odd or even. Parity can detect single bit error but cannot
      correct. If the parity is odd and error is received circuit gets even number and vice versa.
     ECC requires more bits for each byte, but the benefit is that it can correct single bit error, rather than
      only the entire word. Because 90% of data errors are single bit ECC does very good job.
Chapter 4 Processor, IRQ’s and DMA
     Registers are usually as wide as the CPU’s internal bus structure. CompTIA defines byte as 8 bits.
      Control Unit can decode, execute, or store. Decode unit translates the data into binary bits.
     FPU floating point unit went onto the chip die in the 486. Net Burst increases both the number of
      stages and the number of pipelines to enable development of high speed processors. RISC
      instructions are a set length whereas CISC instructions are variable length. IBM an Intel decided to
      use CISC architecture. The lithographic process works with ultra-violet light and a mask.
     16 bit memory page addresses 1 MB requires 20 bit address bus. 32 bit processor works with 32 bit
      memory pages using 36 bit address bus. In other words internal highway is narrower than the
      external processor bus.
     Processor chips differ in following ways
          o Changes to the microcode
          o Manufacturing process, no of transistors, and register size.
          o Internal bus width
          o Address bus width
          o Front side bus speed & amount of L1 L2 cache
     IRQs Interrupt Requests.
          o An IRQ is a signal coming from a piece of hardware (such as a mouse) indicating that it
              needs the CPU to do something. Original XT could only handle eight IRQ’s. Starting AT
              motherboard began using two controllers each controller handles eight lines (0-7 and 8-15).
              IRQ 2 cascades to IRQ 9. By daisy chaining two controllers AT motherboard can handle 16
              IRQ’s. An Interrupt controller is also known as Programmable Interrupt Controller (PIC)
              PIC is a chip. Depending upon which device is active, the PCI bus can allow or disallow the
              use of that “locked” IRQ.
                                       16 IRQ Lines 2 Controllers
         IRQ 0       System Timer                   IRQ 8     Real Time Clock
         IRQ 1       Keyboard                       IRQ 9     Redirected Cascade to IRQ 2
         IRQ 2       Cascaded from IRQ 9            IRQ 10    OPEN
         IRQ 3       COM 2 or COM 4                 IRQ 11    OPEN
         IRQ 4       COM 1 or COM 3                 IRQ 12    MOUSE PS/2
         IRQ 5       LPT2 or Sound Card             IRQ 13    Math Co-processor
                     original XT HD Controller
         IRQ 6       Floppy Drive Controller        IRQ 14    Primary Hard disk Controller
         IRQ 7       LPT1                           IRQ 15    Secondary HD Controller
        A PnP specification requires 1. Compatible BIOS 2. Operating System 3. Device Controllers.
         Bus Mastering is where a device takes control of a bus during a throughput operation. PCI
         Steering on the other hand is where the bus itself directs data traffic to specific IRQs based on
         their availability.
        IRQ 15 is set aside for the secondary IDE drive controller not a second drive.
        DMA Direct Memory Access was developed to avoid bottlenecks in processing. For example if
         hard drive needs to access system memory for addresses or instructions, those interrupt requests
         don’t have to interrupt the CPU.
        Originally, a motherboard had only one DMA controller. The system worked so well that a
         second DMA controller was added. Each controller allows four channels, so today we have 8
         DMA channels (0-7) available on most systems. Again two controllers, with 8 Channels.
             o 2 DMA Controllers 4 Channel each making it total 8 Channels
        COM 1 & 3           IRQ 4         03F8            03E8

        COM 2 & 4           IRQ 3         02F8           02E8

Chapter 5 Processor and Chipsets

        Intel 8080 2MHz with 6000 transistors 8-bit system bus April 1974
        Intel 8086 (5, 8 & 10MHz) 16-bit internal bus, 20 bit address bus. 1MB Memory June 1978
        Intel 8088 (5 & 8MHz), 8-bit internal bus (processor bus) 20-bit address bus 1MB Memory 1979
        Second Generation Intel 80286 (6,8,12.5MHz) 16-bit processor bus, 24 bit address bus allows
         16MB Memory and 1GB virtual memory with swap files 1981
         The problem with 286 was that when a 16-bit application requested Real Mode again, the chip
         couldn’t switch back
        Third Generation Intel 80386 (16, 20, 25,33MHz) 32-bit processor bus with extra chip Math
         Co-processor.
            o DOS (Together with Window 3.x is 16-bit OS. Windows 98 & Me are hybrid 16 and 32
                 bit OS. Windows 9x is mostly 32-bit OS, with a 16-bit subset of instructions to allow for
                 backward compatibility. Windows NT, 2000, XP are all 32-bit OS. XP recently release its
                64bit version.
             o Virtual Real Mode is the method by which Windows emulates a 16-bit DOS OS so as to
                run older application.
             o 386DX 32 bit address bus 368SX/SL 24/16-bit address bus. 16MB Addressable Memory
        Fourth Generation 80486 DX, DX-2 66MHz, DX-4 133MHz, SX, and SL(to save power)
             o First Processor to have Floating Point Processor
        Fifth Generation Pentium P5
             o First Series 60/66 PGA
             o Second Series 90/100 SPGA
             o Third Series Pentium Pro for Servers 150/166/180/200MHz
                            Frequency                                 Data       Address
                  Release                                                                  Cache
     Processor              (when       Register bit capacity         bus bit    space
                  date                                                                     size
                            released)                                 capacity   size

                                        16-bit    general   purpose              1
     8086         1978      8 MHz                                     16                   -
                                        registers (GP)                           MBytes

                                                                                 16
     80286        1982      12,5 MHz    16-bit GP                     16                   -
                                                                                 MBytes

                                                                                 4
     80386DX      1985      20 MHz      32-bit GP                     32                   -
                                                                                 GBytes

                                                                                 4         8KBytes
     80486DX      1989      25 MHz      32-bit GP, 80-bit FPU         32
                                                                                 GBytes    L1

                                                                                           16
                                                                                 4
     Pentium      1993      60 MHz      32-bit GP, 80-bit FPU         64                   KBytes
                                                                                 GBytes
                                                                                           L1

                                                                                           16
                                                                                           KBytes
     Pentium                                                                     64
                  1995      150 MHz     32-bit GP, 80-bit FPU         64                   L1; 256,
     Pro                                                                         GBytes
                                                                                           512, 1 K
                                                                                           L2

                                                                                           32
                                                                                           KBytes
                                        32-bit GP, 80-bit FPU, 64-               64        L1; 256,
     Pentium II   1997      266 MHz                                   64
                                        bit MMX                                  GBytes    512
                                                                                           KBytes
                                                                                           L2

                                                                                           32
                                                                                           KBytes
     Pentium                            32-bit GP, 80-bit FPU, 64-               64        L1; 256,
                  1999      500 MHz                                   64
     III                                bit MMX, 128-bit XMM                     GBytes    512
                                                                                           KBytes
                                                                                           L2



   Intel MMX technology introduced 57 new microcode for audio, 2D, 3D, video, voice etc.
   SIMD Single instruction Multiple Data, is another extension of the microcode that tells dual
    pipeline Pentium chips how to process different instructions simultaneously. SIMD for Pentium
    III SSE ver 1 SSE ver 2 improved 3D Graphics, video, speech recognition.
   AMD uses 3DNow! and 3DNow Professional.
   Sixth Generation P6 is Pentium II Pentium III
        o Slot 1and Slot 2 for Pentium II and some PIII. Socket 370 /FC-PGA for PIII used 0.18
           micron process
   Pentium 4 used 0.13 micro process
   Net Burst Technology
        o Net Burst technology is a combination of various features.
                Hyper-Threading (ht) technology
                A 400MHz System Bus
                An Execution Trace Cache
                Multiple ALU Rapid Execution Engine
   Hyper-Threading (HT) allows a single CPU to logically divide itself into multiple virtual
    processors. SpeedStep technology, used in mobile computers, allows a chip to shut down
    depending on demand. SpeedStep is a fine advantage, but HT Technology seems to cancel out
    the same advantage.
   Centrino mobile is a Pentium M processor on an i855 chipset with built in wireless(802.11b)
    and Power Management is directly related to battery power.
              Socket 4 - 273 pins (Pentiums 60-66) Socket 6 486
              Socket 5 - 320 pins (K5 and Pentium 75-133)
              Socket 7 - 321 pins (K5-K6 and Pentium 75-300)
              Socket 8 - 387 pins (Pentium Pro)
              Socket 370 - duh… (Celeron and "flip chip" PIIIs)

              Slot 1 - Pentium II - Celeron - Pentium III (to about 800MHz) 440BX Chipset
              Slot 2 - Pentium XEON

              Socket 423 - For Pentium 4
              Socket 478 - For Pentium 4 and Celeron
              Socket 418 – Intel Itanium
              Socket 603/604 - Pentium XEON

              Slot A - AMD Athlon K-7
              Socket A - 462 pins - AMD Duron and Athlon (T-bird and XP)
              Socket 940 / 754 – AMD Opteron, Athlon 64FX, Athlon 64

          MMX specialized multimedia instructions
          SIMD, SSE, SSE-2 original multimedia instructions 3D Now! Only supports only Intel SSE and
           not later versions.
          32-bit internal architecture and 36-bit address bus working with a 64-bit processor bus. Mobile
           chips use 31-bit
          Net Burst, as a compilation of several ways to tweak performance at speeds over 2GHz.

Chapter 6 Basic Electronics
      Watts = Volts + Current
      Continuity checking with millimeter. Power Supply converts AC current to DC.
      EMI Electromagnetic interference Electricity modifies a surrounding area. Modifications
         generated by strong electrical currents and their fields are called EMI
        ESD Electro-Static Discharge. Your body routinely builds up static electricity that discharges to
         the ground when you touch something conductive. When this takes places we call it ESD
         ESD you should at least ground yourself by touching a metal part of the chassis (such as
         powersupply) The Problem with this solution is that although the computer and your body have
         equalized, the charge is still contained within the combined system.
        ESD Kit uses a wrist strap (with a resistor) connected to ground wire. Special floor mat that
         discharges a current into ground, bypassing the computer. Exam might not include mat. During
         low humidity ESD can easily develop.

Chapter 7 Input Devices
      Keyboard: When you press a key, it generates an electrical signal, and a microprocessor in the
           keyboard changes the signal to a digital code- a scan code. It then sends the scan code to the
           computer.
              o Keyboard Switch Technology
                      Pure Mechanical: Metal contacts and a spring durable and self cleaning.
                      Foam Element: The foam reduces bounce, but gives the k/b mushy feel lack of
                        audible feedback metal foil contacts
                     Rubber dome: Electrical contacts are sealed but not k/b mechanics. Have carbon
                         button contacts. Rubber dome collapse to make contact
                      Membrane sheet: Often used in commercial and industrial environments Spill
                         and dust proof
             o Capacitive Technology: Non Mechanical Switch puts the two conductive plates of a
                 capacitor inside a housing. Electrons are drawn onto the bottom plate by positive charge
                 on the plunger, causing a small current to flow.
        MODEM MODulator DEModulator, analog signals are converted to digital signals and then
         back again. Phone lines work mainly in analog mode.
        UART Chips: Universal Asynchronous Receiver Transmitter. Converts serial data from the
         modem into parallel data the CPU can understand and vice versa. Three types of UART chips
         used in Modem
             o 8250 used in XT and PC-AT with 1-byte buffer
             o 16450 introduced with AT with 2-byte buffer
             o 16550A 16 byte first in first out FIFO to eliminate data overrun. Faster speed used
                 16550AN and 16550AFN
        MODEM Commands
             o +++ Escape or hangup ATA Answer incoming call, ATD Dial ATDP Pulse Dial ATDT
                 Tone dial, W Wait AT H Hang up, ATZ Rest modem, ATI Identification, ATMn
                 ATM0 Turn off the modem sound ATM1 turns sound ON, AT&C Carrier detect.
        SCANNER: CCD is composed of many small diodes. 300x600 horizontal vs vertical resolution
         or 1200x1200 dpi is dots per inch Parallel Port moves 8 bits of info at a time. Newer Scanners
         use USB. 24 bit scanner provides 16.77 million addresses at 256 levels of intensity
        To clean mouse Remove the ball and wipe it with a solvent (alcohol works well)
Chapter 8 Peripherals: Storage Devices
        SCSI Small computer systems interface.
        Physical disks can contain from 1 to 24 logical drives.
        IDE Integrated Drive Electronics is a 16 head hard drive with a built in controller and logic
         board. EIDE is a 256 head hard drive developed by WD. DMA direct memory access is a way
         data moves into system RAM without passing through processor. CHS Addressing scheme used
         by BIOS to find physical cylinder, head and sector address. LBA Logical Block Addressing to
         translate logical CHS to Physical CHS addresses directly, bypassing BIOS translation tables.
        HARD DRIVE COMPONENTS
             o Platter: Plates or Circular very thin structure coated on both side with electromagnetic
                 material
             o Spindle: Platters have a hole in center and is stack on a rotating center – the spindle
             o Spindle motor: High speed motor rotates spindle
             o Actuator: All head arms are attached to the actuator, which positions the arms
                 simultaneously over tracks on the platters.
             o Logic board (controller): Integrated circuit board to control spindle motor speed, head
                 braking, commands and controls, read-write circuit, encoding instructions, address
                 translation and power management instructions.
        Track O is on the outer edge, and contains the boot sector. Modern disk have flying height of
         approx 5-20 nanometers (0.005-0.02 microns) Human hair is 150 microns. Head do require air in
         order to develop the flying height and so HD are not sealed in a vacuum. At very high altitudes,
         the air may be too thin for head flying and could crash.
        Areal Density: No of tracks per inch TPI. Bit density in given sector is bit per square inch
         BPSI. Taken together TPI and BPSI makes areal density.
   Head Actuator Motor: Head actuator is designed to extend and retract the arm to precise
    distance from the center of the platter.
   Stepper Motor and Voice Coils: Head actuators use either a stepper motor or a voice coil to
    move the head arms. Stepper motor are often used to move both the actuator and the spindle. The
    problem is that mechanical steps are limited as to how small they can be. Mechanical motions
    always is much larger than electrical movements. To get around this, voice coil motors use
    electromagnet to attract or repel the end of a head arm in faster and smaller increments.
   Stepper motor does not know about temperature change where as voice coil use a combination
    of distance movement and feedback instructions to determine the position of read write head. So
    the controller makes adjustments because of thermal expansion or shrinking.
   IDE uses IRQ 14 and 15 to communicate with CPU.
   The boot sector points to Head 0, Cylinder 0 track 0 and sector 0 (side 0). Boot sector is not
    same as MBR. Sector is usually 512 bytes. Floppy disk has 135 tracks per inch. Older disk
    drives used the same number of sectors in every track. Modern disks put different number of
    sectors on different groups of tracks. The number of sectors is based on the lengths of tracks.
    Therefore, outer tracks have more sector than inner tracks.
   Format Process defines minimum sectors per cluster. Every volume must be completely filled
    with clusters. FAT16 used with DOS. FAT32 & NTFS provides variable size clusters.
   FDISK uses BIOS interrupt 13h to determine disk size and partition information. CHS
    introduced a volume address limit of 528MB.
   LBA is a way to handle the translation between logical addresses and 28-bit physical numbers
    without having to bother the BIOS routines. It put limit for IDE drives to 137GB. For the
    moment ATA/IDE drives larger than 137GB requires Windows 2000/XP. And ATA/133 PCI
    Controller card and supporting chipset. Later ATA-6 Specification adopted 48-bit addressing
    scheme to extend max capacity to 144petabytes.
   CLUSTERS are groups of sectors, and sectors are 512 bytes pieces of tracks.
        o Tracks are divided into sectors of 512 bytes.
        o Sectors are combined into Clusters, starting at 2KB or 4 sectors.
        o Clusters must fill entire Volume. The size of volume dictates size of clusters. Volume is
            technical term for logical formatted partition.
        o Max number of FAT16 clusters is 65525. The largest cluster 16-bit DOS can make is
            32KB. This limits FAT16 to 2GB as largest logical drive that DOS can address.
        o LBA allows for access to 8GB hard drive.
        o FAT32 and NTFS allow for larger logical drives, because they define cluster sizes
            differently than DOS. (Until recently, the maximum was 137GB.)
   FLOPPY DRIVE
        o 5.25”in DS-HD 1.2 MB and DS-DD 360KB
        o 3.5” in DS-HD 1.44MB and DS-DD 720KB
   ATA specifies how data will be combined, managed, controlled and validated as it moves from a
    magnetic spot on a disk through to system memory. DMA controllers, using direct memory
    access to offload work from the CPU. IDE refers to any drive that has a built-in controller. ATA
    IDE combination called a 40-pin keyed controller. The maximum length of the cable was
    specified as 18 inches.
        o I/O Interface                        Max Speed
        o ATA 3 or Fast ATA                    Throughput 16.7MB/s
        o ATA 4 or Ultra DMA/33                33MB/s
        o ATA 5 new 80 pin connector           66MB/s
        o ATA 6 Ultra ATA/100                  100MB/s
        o ATA 7 ATA/ATAPI-7                    133MB/s
   PCI Express supports the older PCI bus method of using A,B,C or D virtual interrupts.. MSI is
    optional in PCI 2.2 and 2.3 devices.
   A single SCSI bus can hold up to eight devices, each with a unique identification ID number.
    The ID number from 0 to 7 is called Logical Unit Number LUN. Don’t be confused by the 8 ID
    numbers and 7 devices on the overall bus. Remember that the host adapter automatically takes up
    one ID number. SCSI needs terminator on both end. SCSI-1 cable length was limited to 6 meters
    or 19 ft.
   SCSI-2 introduced bus-mastering. SCSI-2 specification brought change in the width of the bus
    from 8-bit to 16-bit.
                                                                 # of           Bus          Bus
                       Name              Specification                                                   MBps
                                                               Devices          Width       Speed
                   Asynchronous
                                             SCSI-1                8            8 bits      5 MHz       4 MBps
                       SCSI
                   Synchronous
                                             SCSI-1                8            8 bits      5 MHz       5 MBps
                      SCSI
                       Wide
                                             SCSI-2                16           16 bits     5 MHz      10 MBps
                       SCSI
                       Fast
                                             SCSI-2                8            8 bits     10 MHz 10 MBps
                       SCSI
                    Fast/Wide
                                             SCSI-2                16           16 bits    10 MHz 20 MBps
                      SCSI
                       Ultra                 SCSI-3
                                                                   8            8 bits     20 MHz 20 MBps
                       SCSI                   SPI
                    Ultra/Wide               SCSI-3
                                                                   8            16 bits    20 MHz 40 MBps
                       SCSI                   SPI
                       Ultra2                SCSI-3
                                                                   8            8 bits     40 MHz 40 MBps
                       SCSI                   SPI-2
                    Ultra2/Wide              SCSI-3
                                                                   16           16 bits    40 MHz 80 MBps
                        SCSI                  SPI-2
                       Ultra3                SCSI-3                                                       160
                                                                   16           16 bits    40 MHz
                       SCSI                   SPI-3                                                      MBps


                                       The 7 Generations of SCSI
      Up to 5         Up to 10          Up tp 20         Up to 40        Up to 80         Up to 160      Up to 320
      Megabytes       Megabytes         Megabytes        Megabytes       Megabytes        Megabytes      Megabytes
      Per Second      Per Second        Per Second       Per Second      Per Second       Per Second     Per Second

                                                                         Ultra2                          Ultra320
                                                                         SCSI
                                                                                          Ultra3 or      SCSI
                                                                                          Ultra160
                                                                         Fast-40          SCSI           Fast-160
                                                                         SPI-2            Fast-80        SPI-4
                                                                         LVD SCSI         SPI-3          LVD SCSI
                                                                                          LVD SCSI
                      SCSI-2            SCSI-3 SPI       Fast-20
      SCSI-           SE                Fast & Wide      Ultra SCSI
      1                                 SE               SE
                      SCSI-2            SCSI-3 SPI       Fast-20
                      Fast              Fast & Wide      Ultra SCSI
                      Differential      Differential     Differential
                      HVD SCSI          HVD SCSI         HVD SCSI



        Narrow (8 bit data) bus only                  Wide (16 bit data)                   Wide (16 bit data) bus only
                                                  and narrow (8 bit data) bus
         QIC quarter inch cartridge analog tape format. QIC was replaced by digital audio tape (DAT).
          High end tape system used digital linear tape DLT. DLT is one of the several technologies
          developed in recent years to increase the data transfer rates and storage capacity of computer
          tape drives.
         CD
               o CLV Constant Linear Velocity. As the reading laser moves inward, the revolution per
                   minute of the spindle motor increases
               o CAV Constant Angular Velocity uses a small buffer to vary the data stream through a
                   microprocessor. So it doesn’t matter how slow or fast data enters the buffer because the
                   data coming out of the buffer is adjusted for speed.
         DVD digital versatile disks. Dual-layer DVD have a second semi-transparent layer on top of
          each primary layer. The reading assembly shifts the focal point.
         Flash Memory works with something called Fowler-Nordheim tunneling effect. PROMs us a
          jolt of electricity. EEPROM use ultraviolet light as electrical source. Flash Memory cards use
          regular DC current to change individual transistors.

Chapter 9 Peripherals: Output Devices

     Transient output is the stream of data being sent somewhere for fleeting observation or temporary
      storage.
     CRT or VDT or CON or LCD.
          o CRT the inside surface of the viewing pane is coated with a layer of dots made up of three
             different kinds of phosphor (a chemical). Each beam making one type of phosphor glow.
             Each phosphor dot on the inside of a monitor is a single pixel. Combining three color into a
             RGB “dot” is called a pixel triad. A standard VGA monitor has 640x480 horizontal &
             vertical pixels. SVGA is typically 1280x1024 or 1600x1200.
          o Most LCD panels have a fixed number of crystals leading to typical resolution of 1024x768.
          o DPI is not the same as dot pitch. Dot Pitch is the diagonal measurement between the centers
             of two neighboring triads or measurement as from the center of any two dots of the same
             color. Dot pitch range from 0.28mm to 0.25mm.
          o VGA 640x480             XGA 800x600 at 16million color or 1024x768 at 65536 color
          o SVGA 1280x1024 with 256 color
     Non Interlaced and Interlaced Monitors
          o Electron beams sweeps across the pixels from top to bottom and left to right in one pass is
             called non-interlaced. Non Interlaced provides more stable image (less flickering).
          o When electron beam sweeps from top to bottom in two passes we call it interlaced.
             Interlaced
     AGP accelerated graphics processing. But “P” stands for port not processing for exam. Maximum
      AGP bus length is 9 inch because of timing requirements. The AGP uses narrower bus with a clock
      multiplier.
          o AGP x1           66 MHz clock, 266MB/s throughput                    3.3v
          o AGP x2           133MHz clock, 533MB/s throughput                    3.3v
          o AGP x4           266MHz clock, 1066MB/s throughput or 1GB/s          1.5v
          o AGP x8           533MHz clock, 2.1GB/s throughput                    1.5v
     Passive and Active Matrix LCD
          o Passive matrix has only one switch per column. Active matrix gives every liquid crystal its
             own switch address. Passive matrix typically contrast ratio of 15:1 Active matrix usually has
             400:1. Early LCD monitor response time was 40-200ms current response time is 17-20 ms
             making them fast enough for many games.
   PRINTERS
        o Impact Printers (dot matrix), Thermal Printers (fax and portable), Ink & Bubble Jet, and
            Laser Printers.
        o Form feed involves pulling a piece of paper into a printer, aligning it in front of a printing
            mechanism. Impact Printer applies to dot matrix printer. Usually 9-pin, 18-pin and 24-pin.
            Dot matrix printers use either a tractor-feed or pressure roller. Two type of feeds are “form
            tractor” & “sprocket feed”. Form tractor is like a tractor belt encircling the wheels of a
            military tank. Sprocket feed uses a less expensive plastic tooted wheel.
   THE LASER PRINTING PROCESS
        o Step 1 Erasing: Latent images are like a memory of a picture. To remove the previously
            charged dots from the EP drum, a series of erase lights are set up near the drum’s surface.
        o Step 2 Cleaning: After Erase unit returns EP surface to neutral charge, a rubber cleaning
            blade gently scrapes it clean of any residual toner.
        o Step 3 Conditioning: (primary corona wire) The EP drum is negatively charged evenly
            throughout the surface. This process is called conditioning. Voltage of about -6000 is
            distributed by a very thin wire called the “corona wire”. The high voltage being sent through
            the corona wire causes a short circuit between the wire and the image drum. The air around
            the wire breaks down, causing a corona. And –ve charge migrate to drum.
        o Step 4 Writing: The writing mechanism is sophisticated device that controls the way laser
            beam moves over the surface of the drum. A beam of light touches the surface of the drum, it
            discharges a small amount of electricity usually -100 volts. Because the surrounding area of
            the drum is between -600 to -1000 volts, the spot(or dots) is more positively charged than the
            surrounding area on drum.
        o Step 5 Developing: The high-voltage power supply sends current, but this time through the
            toner cylinder, which “charges the toner particles with a negative charge. The charge is
            somewhere between the charge on the drum and the places where the laser light touched the
            surface”. Where there was light, there’s less of a charge than on the toner particles, so the
            toner particles are attracted to the surface of the drum in those places.
        o Step 6 Transfer corona Wire: (or secondary corona wire) The paper takes on a very high
            positive charge. The paper must be charged enough to pull the toner particles off the drum,
            but not so much that the paper wraps itself around the drum.
        o Step 7 Fusing: The fusing assembly is a quartz heating lamp inside a roller tube, positioned
            above a rubber pressure roller. This heating roller is made of a high quality nonstick material.
        o Step 8 End of Cycle: Finally, a fabric-cleaning pad, located on the opposite side of the
            heated upper roller, rubs off any residual melted toner.
   The Primary corona wire negative charges the EP drum so it can attract toner. The secondary or
    transfer corona wire charges the paper +ve so it can pull toner away from EP drum to paper.
   Separation pad, right below the pickup roller, tries to make sure only one piece of paper is pulled.
    Common cause of the jam is either more than one paper enters the system or the paper separation
    pad. Or wrong paper type can’t move the first page. “Paper out” message means that the pickup
    rollers can’t pickup the first piece of paper. If the page comes out of the printer completely black
    problem is with the primary coronal wire. If the paper comes out with a smudged image, and toner
    rubs off, the problem is with the fusing assembly.
   Bitmap fonts computer stores every single bit (dot) of the image. Raster Fonts are vector fonts
    change the size simply recalculates the lengths of the virtual lines. Microsoft later figured out their
    own raster fonts called true type fonts ttf (.ttf & .fot files)
Chapter 10 Basic Networking

     PnP is both a hardware and software solution. PnP needs three aspects 1. PnP hardware, 2. PnP
      BIOS 3. PnP Operating system
     SCSI allows a total of 8 devices – one host adapter and seven peripherals. SCSI-2 allows up to 16
      devices, including the host adapter.
     USB 1.0 and 1.1: USB 1.0 and 1.1 has two channels high and low. Transfer data of low channel is
      of 1.5Mbps and high channel is 12Mbps. 1 USB controller can sustain up to 127 devices. USB 2.0
      has transfer rate of 480Mbps or 60MB/s. USB 2.0 was designed to add the benefits of high speed
      video and multimedia. USB 2.0 device is not compatible with USB 1.0 or 1.1.
     NRZI encoding means that only variations in the voltage produce a change in state. NRZI is one of
      the way USB can generate much higher throughput then earlier serial transfer protocols.
     IEEE 1394 FireWire: Design to deliver speeds up to 400Mbps new 1394b up to 800Mbps. IEEE-
      1394 uses daisy-chained topology and allows 63 nodes, with 16 devices. FireWire or ilink transfer
      information from device to device. USB moves information through the computer.
     Networks can be peer-to-peer or client/server. All PC’s are equal in peer-to-peer network as opposed
      to client/server network where some PC act as a server and others clients. Both networks use
      software that performs the redirector function. The redirector monitors the CPU and determines
      whether data requests are local or remote. Redirector used INT 21.
     3 groups of 24-bit MAC address is assigned my manufacturer and stored in ROM on the card. 1st
      group is a unique vendor code middle group identifies the particular card and the 3rd group are serial
      number.
     Ethernet is a baseband network meaning only one signal can be on the network at a time and that the
      signal takes up the entire bandwidth. Ethernet is called carrier sense, multiple access, collision
      detection (CSMA/CD) network. Terminator prevents signals along the wire from reflecting back
      onto each other from the cable end. Terminator absorbs the signals. Token ring network connects
      PC’s in a ring called ring topology. A bridge is a way to break down a large network running at full
      capacity into smaller groups of segment. Bridge work with only the addresses of the network cards
      on a specific network. Bridge allows for more PCs to be connected to the network without creating
      traffic bottlenecks. Router directs traffic to different, whole network. Bridge uses the built-in MAC
      address and router use the TCP/IP address.
     OSI LAYER
          o Physical Layer
                    Network media, voltage level, connectors, media details. OSI lower layer
          o Data Link Layer
                    Responsible for error-free communication between two network devices or nodes.
                    LLC sub-layer on top of MAC sub-layer provides for connectionless and connection-
                      oriented communication.
          o Network Layer
                    Specifies path and packet switching between networks. Using routing protocol like
                      IP, IPX, Appletalk
          o Transport Layer
                    Establishes end-to-end connections. Also ensures reliable data flow. Protocol like
                      TCP, UDP. SPX.
          o Session Layer
                    Establishes, manages, and terminates communication by coordinating service requests
                      and responses between two or more stations.
          o Presentation Layer
                   Makes sure information is delivered to Application layer in readable and proper
                    format. Data encryption/decryption, data compression/decompression and data
                    representation. ASCII, EBCDIC, MIDI, MPEG, JPEG and GIF
        o Application Layer
                 Any application that reaches out over the network is some form of communication is
                    considered to be a layer 7 application.
   The HyperText Transfer Protocol HTTP was invented to transmit those HTML documents over
    WWW. XML is an extended markup language, designed to handle information formatting. ISDN
    provides up to 128Kbps of digital transmission over ordinary phone line. DSL connection, the PC
    must be within three miles of CO. transfer rates 1.5Mbps download and upload 128Kbps.
   PING uses the Internet Control Message Protocol ICMP to send data packets to another computer.
   TRACERT is used to time the various hops- the route- a packet takes to reach the destination IP
    address.
   Wireless 802.11 a / b / g
        o 802.11 wireless use spread spectrum transmission.
        o 802.11a Uses 5GHz OFDM Orthogonal frequency division multiplexing. 54Mbps
            OFDM divides the available channel into sub-channels and encodes a portion of the signal
            across each sub-channel in parallel
        o 802.11b Wi-fi Uses 2.4MHz FHSS freq hopping spread spectrum. 11Mbps
            the channel is broken into sub-channels, and the transmitter jumps from sub-channel to sub-
            channel (freq hopping)
        o 802.11g Uses 2.4MHz DSSS Direct sequence spread spectrum. DSSS smears a signal across
            a wide band of freq. The receiver listens to the entire band and rebuilds the signal.
   SSID service set identification used as the name of the network. WEP allows a device to send
    encrypted data over a wireless link. Typically 64-128 bit encryption. In addition o encryption key,
    the system can be configured as either open or closed. In an open system, the access point sends out
    a beacon and only those stations with the correct encryption key can decipher the data. On a closed
    system the access point doesn’t send a beacon. Each station sends an active probe, requesting a
    connection from access point. An active probe (closed system) takes longer to establish a link but is
    more secure. Bluetooth short range 5-10 meters uses 2.4GHz freq, transfer rate 1Mbps, developed
    by Ericsson Comm. IR uses light freq. Speed range from 0.9 to 4Mbps.
   Fiber Optics
        o Single mode 22 kilometer uses 5 micron wide fiber
        o Multi mode 6 kilometer uses 62 micron fiber
        o Uses 1. Bayonet (ST) connector looks like BNC connector or
                  2. Snap-on (SC) connectors looks like rj45 connector.
Chapter 11 Basic Networking

     XT used DB25 serial port AT introduced 9 pin serial connector. DB9. Super I/O chip includes
      controller for IDE, COM Ports, FDD controller, LPT port also NIC, modem etc.
      LPT is a 25 pin parallel interface. Maximum length of LPT cable is 25ft. for serial cable is 50ft.
     Types of Parallel Ports IEEE 1284
          o Unidirectional: Data flows out, but can’t come back
          o Standard bidirectional: Peripherals can send status message back
          o Standard Parallel Port (SPP) found in laptops and Notebooks
          o Extended Parallel Port (EPP) also 10 times faster than Standard bi-directional port.
          o Extended Capabilities Port (ECP) ECP port is about 10 times faster than standard bi-
              directional port. Allows Compression.
     Port on back of motherboard is 25pin female Parallel Port. Note that XT motherboard had 25pin
      male which was serial port and 25pin female Parallel Port. Serial is RS-232C.
     9 pin Serial, 15 pin Video, 25 pin Parallel, 36 pin centronics, 50 pin SCSI, 5 pin DIN, 6 pin
      Mini DIN or PS/2.
     10Base5 Thicknet 500 meters, 10Base2 Thinnet 200 meters, Uses Coaxial Cable RG-58 with 50
      ohms impedance. RG59 is for video audio transmission with 75 ohms impedance.
     10BaseT T stands for twisted pair. Uses CAT-5 four pairs to total of 8 wires. CAT 1 2 & 3 intended
      for voice-grade analog signal. CAT 5 and CAT6 used for data grade cable used for digital signaling
      up to 100Mbps Fast Ethernet.
     Category 5 CAT5 can be either solid core or stranded core. Stranded core wire is made up of many
      very thin strands of wire and more flexible than solid core wire. Solid core wire is less flexible, but it
      has less signal loss (attenuation) per meter than flexible core. Solid-core wire used for longer cable
      run up to 100 meters. STP is primarily used in IBM Token ring networks.
     CAT3 16MHz               CAT4 20MHz            CAT5 100MHz             CAT5e 350MHz
     CAT6 and CAT7            550MHz.
     RJ11 can have 1 2 or 3 pairs of wire where as RJ45 has 4 pairs of wire.
                                          END OF HARDWARE
                                              EXTRA NOTES

     Water Cooling  Condensor coil radiator. Liquid Cooling  CPU cooling Block & Refrigerant
      Cooling  Evaporator.
     POST Errors
         o 1xxMotherboard errors, 2xxRAM errors,                 3xxKeyboard Errors, 3xxxx NIC
         o 6xxFloppy error,               11xxCOM1 errors, 17xxHard drive errors.
     Maximum Length of Standard Parallel Cable is 10ft, some enhanced use 25ft
     Maximum Length of RS232 Serial Cable is 50ft for RS232C is 100ft
     Firewire is 14ft 4.5 meters Max IrDA length is 1 meter speed is 115kbps
     SCSI recommended cable length is 20ft/6meters fast SCSI is 6ft and SCSI segment is 3 ft.
       32 bit transfer use 68pin centronics  0=lowest 15 highest priority (forced-perfect termination)
      Default SCSI host adapter id is 7. LVD use 3.3v Low voltage High Speed.
      Laser Printer Process: Cleaning, Conditioning, Writing, Developing, Transferring, Fusing.
      Remember CCWDTF
     PCMCIA operating system must support two levels “Card Level” & “Socket Level”
     I/O Address of Video Controller is C0000-C7FFF.
     Primary IDE controller standard address is 1F0.
   Available IRQ are 0 2 8 13 are reserved for internal Computer 3-7 9 -12 14-15
   BIOS consults ESCD extended System Configuration data went PnP device is connected.
   SCSI ID 7 has the highest priority on the SCSI bus. The priority of the remaining IDs, in descending
    order, is 6 to 0, 15 to 8 [7 6 5 4 3 2 1 0 15 14 13 12 11 10 9 8 ]. So SCSI Host Adapter usually
    assigned ID 7 and Primary HD ID 0.
   I/O Address Primary HD is 01F0-01FF IRQ 14             Secondary HD is 0170-0177 IRQ 15
   COM 1 & 3 is IRQ 4 03F8 03E8                           COM 2 & 4 is IRQ 3 02F8 and 02E8
   LPT1 I/O address 0378h-037f                            LPT2 I/O address 0278h-027f, NIC I/O is 360
   PIO Stands for Programmed Input / Output. FRU abbreviated for Field Replaceable Units.
   If a SCSI card is controlling both external and internal devices then the terminator resistor must be
    disabled on the controller and both the last internal and last external devices must be terminated.
   Diff between ESD & EMI. ESD is not recoverable EMI is recoverable.
   Low Level Format, Partition and then Format. MBR is at Cylinder 0, Track 0, Sector 1.
   Green is earth/ground, Black is live Shorter Prong, White is neutral
   USB Cable length 5 meters.
   IDE Controller has 2 channels Primary & Secondary. Each Channels can have 2 HD Master and
    Slave.
   Enable 13h int on SCSI controller for Bootable CD-ROM.
   2 Type II PCMCIA Laptop can install 1 Type III Card 10.5 mm . Just empty both slots.
   “Local digital loop back” checks the transmitter and receiver of a modem.
   RAMBUS can be 168 pin, 184 pin or 242 pin (dual channel)
   SCSI has (single ended) SE 1.5m length, HVD 25meter or LVD 12meter length cable
   DMA channels are 0 to 7.
   ISDN BRI is 2B channels (64kbps)+1control = 128kbps. PRI =23B+1control=3Mbps.
   Thicknet 10Base5 uses Vampire connector or AUI connector (15pin)
   10BaseT 100m             10Base2 185m &        10Base5 500m
   RG-58 coaxial and Fiber Cable good in EMI environment.



						
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