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					                                                                 IEEE/SEMI Advanced Semiconductor Manufacturing Conference




                Prognostic/Diagnostic
          Health Management (PHM) System
                         for
                   FAB Efficiency

                                                          Chin Sun



                             chin@globalcybersoft.com



1   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                     C. Sun Slide 1
                                                             IEEE/SEMI Advanced Semiconductor Manufacturing Conference




      Outline


          • Introduction
                      – Industry Trend
          •     PHM – What?
          •     Method
          •     Results
          •     Conclusion



2   May 22-24, 2006      ASMC 2006 – Boston, Massachusetts              C. Sun Slide 2
                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



      Industry Trend:
      APC/AEC 2005 Presentation from Samsung




     APC/AEC 2005 / Samsung Electronics Co., Ltd. "An Application
     of Multivariate Statistics in Detecting Equipment
     Changes" Presenter: Lee, Seungjun
3   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 3
                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



      Industry Trend:
      APC/AEC 2005 Presentation from Samsung




       APC/AEC 2005 / Samsung Electronics Co., Ltd. "An Application
       of Multivariate Statistics in Detecting Equipment
       Changes" Presenter: Lee, Seungjun
4   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 4
                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



      Industry Trend:
      APC/AEC 2005 Presentation from Helix Tech.




       APC/AEC 2005 / Helix Technology Corporation "Predictive Capability
       Enabled by a Deterministic Method of Analysis or Real World Vacuum
       System e-Diagnostics" Presenter: Gaudet, Peter
5   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 5
                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



      Industry Trend:
      APC/AEC 2005 Presentation from Helix Tech.




       APC/AEC 2005 / Helix Technology Corporation "Predictive Capability
       Enabled by a Deterministic Method of Analysis or Real World Vacuum
       System e-Diagnostics" Presenter: Gaudet, Peter
6   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 6
                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



      Industry Trend:
      APC/AEC 2005 Presentation from Adventa




        APC/AEC 2005 / "Reaping the Benefits of Heuristic Fault
        Modeling" Presenter: Jared Warren,
        Adventa Control Technologies

7   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 7
                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



      Industry Trend: Weighted FDC
      APC/AEC 2005 Presentation from Intel




       APC/AEC 2005 / Intel Corporation "Weighted Fault Detection
       and Classification" Presenter: Mao, John

8   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 8
                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



      Industry Trend: Weighted FDC
      APC/AEC 2005 Presentation from Intel




       APC/AEC 2005 / Intel Corporation "Weighted Fault Detection
       and Classification" Presenter: Mao, John

9   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 9
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       The Evolution of Quality Control



                                                                                            PHM-
                                                                                            Equip



                                                                                         FDC




10   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 10
                                                               IEEE/SEMI Advanced Semiconductor Manufacturing Conference



         CONVENTIONAL e-Diagnostic APPROACH


                                                                                                     ?

                                                             Equipment Engineers
                                                      Host

                                           Slow Trouble Shooting Process
     • Opportunities of Human Errors: Labor intensive and Time
       consuming
     • Passive Approach: No knowledge sharing or self learning,
       lacking of predictive capability
     • Inconsistency: Analysis results are human dependent
     • Cost of Resources: Delay Time-to-Corrective Actions,
       Long training time for new engineers
11     May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                C. Sun Slide 11
                                                              IEEE/SEMI Advanced Semiconductor Manufacturing Conference



          AUTOMATED e-Diagnostic APPROACH




                          Host + PHM-Equip Equipment Engineers                             Management

                                          Enable Real Time Auto-Diagnostic
     • Reduce or Eliminate potential Human Errors: Automated, Knowledge
       based Analysis
     • Feed Forward ↔ Feed Backward Proactive Approach: Enable
       Knowledge Sharing, Self Correction, and providing Predictive Capability
     • Consistency: Analysis results are based on Data and Knowledge
     • Saving Resources: Fast Time-to-Corrective Actions, Shorten training
       time for new engineers


12      May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 12
                                                                                     IEEE/SEMI Advanced Semiconductor Manufacturing Conference



            PHM-Equip Infrastructure
                                                             Equipment Manufacturers
                                                               PHM-Equip Systems
     A global Internet-                PHM DVP                                                    PHM Production
           based                        Servers                     Verified Rules                   Servers
       collaborative                                                  Transfer
     Knowledge Base
     accumulation and
          sharing                                                                                                 Knowledge is power,
       environment                                                                                                 but only when it is
                                                      Prognostic Rules                 DTC False                        shared
                             NO DTC
                                                             upload                     Alarm
                            Scenarios
                                                      e.g. failing oxygen              Scenarios
                                                            sensors


          Equip. Engr. A                                       Equip. Engr. B                             Equip. Engr. C
         PHM-Equip Client                                     PHM-Equip Client                           PHM-Equip Client
         PHM-Equip will help resolve NO DTC (Diagnositc Troub-shooting Code)
         problems
         PHM-Equip will help resolve DTC False Alarm problems
         PHM-Equip will accumulate Prognostic Rules from experienced equipment
         engineers
13        May 22-24, 2006       ASMC 2006 – Boston, Massachusetts                               C. Sun Slide 13
                                                                                    IEEE/SEMI Advanced Semiconductor Manufacturing Conference


                   PHM-INT, PHM-Equipment, PHM-FAB & PHM-BE
                                  PHM-INT

        PHM-Equip                              Process Info
                                                                       PHM-FAB             Device Info
                                                                                                                 PHM-BE
                              Equipment Engineers                                                                      Yield/Product
                              populate PHM-Equip with                        Process Engineers                         Engineers
                              equipment rules based on                       populate PHM-FAB                          populate PHM-BE
                              their knowledge                                with APC rules based                      with feedback
       KB Info
        feed
                                                                       APC   on their knowledge                        rules based on
                                                                                                                       previous analysis
      forward/
        feed
     backward       PHM-E1 PHM-E2                                     PHM-F1 PHM-F2                 PHM-Etest     PHM-DDR         PHM-BEST
         thru
        entire
      process
         flow
                                              KNOWLEDGE
                                              BASES


                                                  Fab equipment sets
                                                                                                     E-TEST                       Wafer Sort
                                                Fab equipment sets                                                                  /Final
                                                                                                                                     Test
                                                                                       Process
                             Gate         Vt              Litho                         Flow                     Defect Density
                                                                                                                   Reduction
                             Ox           implant
                                                                        Fab Processes
14
                                   Front End
                              FAB ASMC 2006 – Boston, Massachusetts
                 May 22-24, 2006
                                                                                                        FAB Back End
                                                                                               C. Sun Slide 14
                                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



          PHM-Equip Architecture
         Western Electrical (WE) control charts with pattern recognition
        capability + Multivariate FDC to identify out of control tool parameters
         Advanced Real Time-Knowledge Management (RT-KM) Rule-based
        methodology automatically determine when an equipment fault occurs,
        what caused it, and how to correct it

     Multivariate Mahalanobis
     Distance Fault Detection
              Engine                                    PHM-Equip
                                                                                              Tool
                           Data            RT-KM              Fault       Fault      Cause
     Equip/Tool                                                       Classification
                                                                                           Diagnostic
                                           Engine                                            Report


                                     Fast Corrective Action
                                                                                              RT-KM Rule-Based
                                                                                                Root Causes
                                                                                                Identification


15      May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                          C. Sun Slide 15
                                                               IEEE/SEMI Advanced Semiconductor Manufacturing Conference

                                                  Highlighted Features
     •       Shorten time to analyze data to validate decisions
              – Automatic Equipment diagnostics
     •       Increase Engineers’ productivity and efficiency.
              – Resolve equipment malfunction problems faster
              – Use Knowledge system as a continuous learning tool
     •       Integrated Knowledge base/Database optimized for Ediag data
              – Fast, simple access to diagnostic report
              – Facilitates collaboration among different FAB equipment
                     engineers
     •       Versatile and interactive Rule development tool
              – Worksheet based
              – Easy to use
              – Rules are specific for Equipment Diagnostic analysis

16       May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 16
                                                               IEEE/SEMI Advanced Semiconductor Manufacturing Conference

                                                   Highlighted Benefits
     •       Improved Time To Market and Reduce the waste of
             manpower
     •       Enable effective Knowledge Sharing
     •       Utilize Engineering Knowledge in FDC to have more
             accurate detection
     •       Enable Real-time feedback, Continuous Improvement
     •       Eliminate False Alarms
     •       Reduce scrapped/low performance wafers
     •       Enable 24x7 Equipment Process Monitoring
     •       Capable of Supporting multiple Equipment
     •       Reduce engineers’ pressure, increase productivity and
             efficiency
     •       Permanent repository of Knowledge and Expertise

17       May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 17
                                                               IEEE/SEMI Advanced Semiconductor Manufacturing Conference


                                                  PHM-Equip Solutions
     •   Real time feedback of Equipment & Process Status

     •   Automatically Identify equipment
         malfunctions/Process misprocessing

     • Real time feedback of Diagnostic/Prognostic reports

     •   Knowledge retained in database, never lost




               Fast Time-to-Corrective Actions and
               Enabling Continuous Improvement
18       May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 18
                                                                      IEEE/SEMI Advanced Semiconductor Manufacturing Conference

                                                               Conclusions

     •      Knowledge Based Methodology
     •      On-line, Real time
     •      Auto diagnostics/prognostics
     •      Permanent repository for knowledge
     •      24 X 7 Equipment monitoring
     •      Enable Global e-Diagnostic

         In Summary: PHM-Equip provides an innovative
         methodology for Equipment Control. PHM-Equip enables
         continuous improvement in the day-to-day Operation of
         Equipment. As the results, PHM-Equip presents numerous
         possibilities to improve the Overall Equipment Efficiency (OEE)


19       May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                     C. Sun Slide 19
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Method: Mahalanobis Distance




20   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 20
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Method: Mahalanobis Distance




21   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 21
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Method: Mahalanobis-Taguchi System




22   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 22
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Method: Mahalanobis-Taguchi System
       A Multidimensional diagnosis system




23   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 23
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Method: Mahalanobis-Taguchi System
       A Multidimensional diagnosis system




     Where Si= standard deviations of i – th variable,
     C-1 = the inverse of correlation matrix,
     k = number of variables,
     n = number of observations,
     T = transpose of the standard vector.
24   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 24
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       PHM-Equip Examples: Data Source




25   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 25
                                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       PHM-Equip Examples: Data Source


                                                           (OES) Optical Emission
                                                           Spectroscopy
                                                           wavelength monitored
                                                           250 nm
                                                           261.8 nm
                                                           266.6 nm
                                                           272.2 nm
                                                           278.3 nm
                                                           284.6 nm
                                                           288.25 nm
                                                           …..
                                                           791.5 nm




26   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                              C. Sun Slide 26
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Results: Fault Detection

           • Step 1: Define the Problem




27   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 27
                                                                          IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Results: Fault Detection

           • Step 2: Define Control/Response Variables


                                                           (OES) Optical Emission             (MD) Mahalanobis
                                                           Spectroscopy                       Distance
                                                           wavelength monitored
                                                           250 nm
                                                           261.8 nm
                                                           266.6 nm
                                                           272.2 nm
                                                           278.3 nm
                                                           284.6 nm
                                                           288.25 nm
                                                           …..
                                                           791.5 nm


28   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                             C. Sun Slide 28
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Results: Fault Detection

           • Step 3: Construct the “Full Model MTS
             Measurement Scale”
           Note: The measurement scale is constructed by training
             datasets




29   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 29
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Results: Fault Detection

           • Step 4: Validate the ability of measurement
             scale
           Note: the capability of measurement scale is demonstrated by
             test datasets.




30   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 30
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Results: Fault Classification
         Method: Distinguish the signal pattern shift of each
         variable between the test dataset and the model




31   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 31
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Results: Fault Classification
        Results: Test wafer 2 and test wafer 18 have the same four
        machine state variables associated with the RF-12 system
        fault.




32   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 32
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Create Diagnostic Rule from pattern
       signature




33   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 33
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference


       PHM Fault Detection and Classification

                                                                  Real Time
                                                                  FDC
                                                                  Monitor
                                                                  Window




34   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 34
                                                                   IEEE/SEMI Advanced Semiconductor Manufacturing Conference


       PHM Fault Detection and Classification
       Report




                                                           Root cause of
                                                           equipment
                                                           malfunction
                                                           and PIDs
                                                           associated
                                                           with faults




35   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                      C. Sun Slide 35
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       PHM Fault Detection and Classification
       Summary




36   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 36
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       Promote Predictive Maintenance
       Example of Prognostic Rule for oxygen sensor




37   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 37
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       PHM-Equip Example: Diagnostic Results




                                                                                        Normal
                                                                                        process
                                                                                        patterns




38   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 38
                                                              IEEE/SEMI Advanced Semiconductor Manufacturing Conference



          PHM-Equip Example: Diagnostic Results




     Progressive
     degrading
     Operating
     patterns can
     be used to
     generate
     prognostic
     pattern
     recgonition
     rules

39      May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 39
                                                                     IEEE/SEMI Advanced Semiconductor Manufacturing Conference



         State-based Warning System
                                                                          4. Do not
                                                                          commence
                                                                          processing




        1. Normal
                                   2. Predictive           3. Recommand
                                   Monitoring              preventive maintenance                  5. Stop
                                   started                 (PM) in 48 hr                           Processing
                                                           Monitoring started



40   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts                        C. Sun Slide 40
                                                                                    IEEE/SEMI Advanced Semiconductor Manufacturing Conference


                   PHM-INT, PHM-Equipment, PHM-FAB & PHM-BE
                                  PHM-INT

        PHM-Equip                              Process Info
                                                                       PHM-FAB             Device Info
                                                                                                                 PHM-BE
                              Equipment Engineers                                                                      Yield/Product
                              populate PHM-Equip with                        Process Engineers                         Engineers
                              equipment rules based on                       populate PHM-FAB                          populate PHM-BE
                              their knowledge                                with APC rules based                      with feedback
       KB Info
        feed
                                                                       APC   on their knowledge                        rules based on
                                                                                                                       previous analysis
      forward/
        feed
     backward       PHM-E1 PHM-E2                                     PHM-F1 PHM-F2                 PHM-Etest     PHM-DDR         PHM-BEST
         thru
        entire
      process
         flow
                                              KNOWLEDGE
                                              BASES


                                                  Fab equipment sets
                                                                                                     E-TEST                       Wafer Sort
                                                Fab equipment sets                                                                  /Final
                                                                                                                                     Test
                                                                                       Process
                             Gate         Vt              Litho                         Flow                     Defect Density
                                                                                                                   Reduction
                             Ox           implant
                                                                        Fab Processes
41
                                   Front End
                              FAB ASMC 2006 – Boston, Massachusetts
                 May 22-24, 2006
                                                                                                        FAB Back End
                                                                                               C. Sun Slide 41
                                                           IEEE/SEMI Advanced Semiconductor Manufacturing Conference



       PHM VALUE PROPOSITION
            Provide Predictive Equipment Maintenance
             & Diagnostics
            Correct Problems before failure occurs
            Real time process/tool/equipment health
             feedback
            Pinpoints miss processing/equipment
             malfunction steps
            Diagnostic report feeds backward
            Diagnostic report feeds forward
            Knowledge reusable, never lost


42   May 22-24, 2006   ASMC 2006 – Boston, Massachusetts              C. Sun Slide 42

				
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