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MEMS by shitingting

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									ITRS MEMS
  San Francisco, CA
    July 12, 2012



            Presentation by Michael Gaitan, NIST
                           MEMS Technology Working Group
                                        Chair: Mike Gaitan (NIST), Chair
                            Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

         Akihiro Koga    Toshiba                   Henne van Heeren    enablingMNT               Raji Baskaran    Intel
         Arthur Morris   Wispry                     Hiroshi Yamada     Toshiba                  Rakesh Kumar      Global Foundries
      Asif Chowdhury     Analog Devices              Ingrid De Wolf    IMEC                    Randy Wagner       NIST
      Brian Jamieson     SB Microsystems            Jae Sung Yoon      KIMM                  Robert De Nuccio     ST Micro
           Buzz Hardy    MEMSCAP                        Jim Spall      Delphi                       Ron Lawes     Imperial College
       Chengkuo Lee      National U of Singapore        Jim Mrvos      Lexmark                    Sacha Revel     Accutronic
        Chris Apanius    Promeus                      Jianmin Miao     NTU                         Scott Bryant   MANCEF
       Chris van Hoof    IMEC                         John Rychcik     Solidus                  Shawn Blanton     Carnegie Mellon University
    Christian Rembe      PolyTec                       Josh Molho      Caliper               Stephane Donnay      IMEC
   Chuck Richardson      iNEMI                      Karen Lightman     MEMS Industry Group          Steve Breit   Coventor
        Dave Howard      Jazz Semiconductor            Kevin Chau      MEMStaff              Steve Greathouse     Plexus
    Dimitrios Peroulis   Perdue                      Koji Fukumoto     Sony                        Steve Walsh    MANCEF
Dominique Schinabeck     Acutronic                 Marcie Weinstein    Akustica                 Takashi Mihara    Micromachine Center
           Don DeVoe     University of MD            Mark Crockett     SEMI, MEMSmart             Tetsu Tanaka    Tohoku Univ.
         Edward Chiu     Asian Pacific Micro       Mary Ann Maher      SoftMEMS                  Tony Stamper     IBM
        Fabio Pasolini   ST Micro                   Michel Brillouet   LETI                    Veljko Milanovic   Mirrorcle Technologies
       Fabrice Verjus    KFM Technology             Monica Takacs      MEMS Industry Group      Wei-Leun Fang     NTHU
  Fumihiko Nakazawa      Fujitsu                    Patric Salomon     4m2c                       Wendy Chen      KYEC
       Goro Nakatani     Rohm                       Pete Loeppert      Knowles Acoustics          Xiaoming Wu     Lexmark
       Hebert Bennett    NIST                           Raj Gupta      Volant Technologies Yasutaka Nakashiba     Renesas Electronics
                           MEMS Technology Working Group
                                       Chair: Mike Gaitan (NIST), Chair
                           Co-Chairs: MEMS Industry Group
                                      Robert Tsai (TSMC) and Philippe Robert (LETI)

         Akihiro Koga    Toshiba                   Henne van Heeren    enablingMNT               Raji Baskaran    Intel
         Arthur Morris
      Asif Chowdhury
                         Wispry
                         Analog Devices                MEMS TWG
                                                    Hiroshi Yamada
                                                     Ingrid De Wolf
                                                                       Toshiba
                                                                       IMEC
                                                                                                Rakesh Kumar
                                                                                               Randy Wagner
                                                                                                                  Global Foundries
                                                                                                                  NIST
      Brian Jamieson     SB Microsystems            Jae Sung Yoon      KIMM                  Robert De Nuccio     ST Micro
           Buzz Hardy    MEMSCAP                        Jim Spall      Delphi                       Ron Lawes     Imperial College
       Chengkuo Lee      National U of Singapore        Jim Mrvos      Lexmark                    Sacha Revel     Accutronic
        Chris Apanius    Promeus
                                                              Subgroups:
                                                      Jianmin Miao     NTU                         Scott Bryant   MANCEF
       Chris van Hoof    IMEC                                   Devices,
                                                      John Rychcik     Solidus                  Shawn Blanton     Carnegie Mellon University
    Christian Rembe      PolyTec                       Josh Molho      Caliper               Stephane Donnay      IMEC
   Chuck Richardson      iNEMI
                                                              Design and
                                                    Karen Lightman     MEMS Industry Group          Steve Breit   Coventor
        Dave Howard      Jazz Semiconductor                    Simulation,
                                                       Kevin Chau      MEMStaff              Steve Greathouse     Plexus
    Dimitrios Peroulis   Perdue                      Koji Fukumoto     Sony                        Steve Walsh    MANCEF
Dominique Schinabeck     Acutronic
                                                             Packaging and
                                                   Marcie Weinstein    Akustica                 Takashi Mihara    Micromachine Center
           Don DeVoe     University of MD                   Integration, and
                                                     Mark Crockett     SEMI, MEMSmart             Tetsu Tanaka    Tohoku Univ.
         Edward Chiu     Asian Pacific Micro       Mary Ann MaherTesting
                                                                       SoftMEMS                  Tony Stamper     IBM
        Fabio Pasolini   ST Micro                   Michel Brillouet   LETI                    Veljko Milanovic   Mirrorcle Technologies
       Fabrice Verjus    KFM Technology             Monica Takacs      MEMS Industry Group      Wei-Leun Fang     NTHU
  Fumihiko Nakazawa      Fujitsu                    Patric Salomon     4m2c                       Wendy Chen      KYEC
       Goro Nakatani     Rohm                       Pete Loeppert      Knowles Acoustics          Xiaoming Wu     Lexmark
       Hebert Bennett    NIST                           Raj Gupta      Volant Technologies Yasutaka Nakashiba     Renesas Electronics
   Focus: MEMS in Mobile Devices




Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012
            ITRS MEMS
• MEMS Device Technologies
– Accelerometers
– Gyroscopes
– Microphones
– RF MEMS
– Emerging MEMS

• Technology Requirements
– Device Performance
– Design and Simulation
– Packaging and Integration
– Device Testing
       MEMS Inertial Sensors
• MEMS Inertial Sensors continue to
  incrementally increase in performance and
  lower in cost.
• The integration of functionalities (tri axis
  accelerometer, gyroscope, magnetometer,
  and pressure sensor) towards the IMU has
  advanced to 9 DOF in the package.
• Driving down the cost of testing of the IMU
  continues to be a challenge.
Example - 9 DOF IMU Package Level




                     ST Microelectronics
                        Feb 12, 2012
        http://www.st.com/internet/com/press_release/p3273.jsp
         MEMS Microphones
• MEMS microphones are expected to
  incrementally increase in performance and
  lower in cost.
• As the sensitivity of microphones advances to
  68 db, testing in the factory environment is an
  issue.
• Advances in the ASIC include digital output
  and adaptive signal processing (such as noise
  cancellation).
• Testing of MEMS Microphones with adaptive
  signal processing is a challenge.
                  RF MEMS
• RF MEMS are intended to lower the power
  dissipation of the radio.
• RF MEMS are sill in the process of increasing
  their reliability and lowering cost before they
  can be adopted in mobile devices.
• RF MEMS are expected to increase in
  performance and reliability.
 – The biggest challenge in RF MEMS is enhancing
   reliability and lifetime (# of operations)
 – Some of the future performance metrics have no
   known solutions, (e.g., signal isolation requirements)
                       Grand Challenges
Difficult Challenges                     Potential Solutions
Integration of MEMS in the Package       Standardization for MEMS packaging to support
                                         integration.
                                         Packages are needed that reduce or eliminate
                                         mechanical stress and enhancing hermeticity.
                                         Package data that can be used to accurately
                                         predict the effect of the package on device
                                         performance.



Testing of MEMS                          More testing towards the wafer level.
                                         Validated tools to predict device device
                                         performance from wafer tests.
                                         Methodologies for “Design for Test” or “Design
                                         for NO Test.”

Validated accelerated life testing for   More knowledge of the physics of failure is
                                         required to develop accelerated life tests.
MEMS                                     Need to share information. Individual solutions
                                         exist but are not being generalized across the
                                         industry.
       MEMS Manufacturing
MEMS Manufacturing Cost     R&D Investment
                                    Packaging and Testing




    Device
  Fabrication
                Packaging
                   and
                                 Device and
                 Testing
                                  Process
                                Development
      ITRS and iNEMI
• The MEMS Technology Working Group is also
  affiliated with iNEMI.

• The iNEMI MEMS will be expanded to include
  consumer health applications: the "Worried
  Well."

• TWG discussions include the concept of
  integration node.

• An iNEMI project on MEMS Testing
  Requirements is in discussion. The focus will
  likely be on defining performance metrics in
  data sheets.
                         MEDICAL MARKET- High Potential




Bubble Chart Ref: IBM Institute for Business Value,” The future
of connected health devices”

                                        3 BILLION POTENTIAL CUSTOMERS FOR
                                                    CONNECTED HEALTH DEVICES
                  Integration Node
                     Tri-Axis
 Accelerometer
                  Accelerometer


                                  6 DOF Sensor

                     Tri-Axis
  Gyroscope
                    Gyroscope
                                                 9 DOF Sensor


                                                                10 DOF Sensor

                     Tri-Axis
 Magnetometer
                   Magnetometer




Pressure Sensor
            Conclusions
• Opportunities for industrial collaboration exist
  around issues at the back end (packaging and test)

• MEMS Sensor Fusion creates challenges for testing
  in increasing complexity while still lowering cost.

• MEMS Testing requirements depend on the
  application (consumer electronics, automotive,
  medical, defense and aerospace).

• Our road mapping has so far been on near term (5
  years). The concept of integration node might
  facilitate longer term road mapping of MEMS and
  other More than Moore Technologies.

								
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