FOTORESIST CMOS

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					PHOTORESIST
POSITIVE RESIST
      light




    substrat

    SiO2
    photoresist
    photomask
POSITIVE RESIST
      light




    substrat

    SiO2
    photoresist
    photomask
POSITIVE RESIST



    spraying




                  Menghilangkan resist dengan larutan




    substrat

    SiO2
    photoresist
POSITIVE RESIST



   Visual inspection




     substrat

     SiO2
POSITIVE RESIST


   pemanggangan



                  on
                  off




    substrat

    SiO2
POSITIVE RESIST
                  re
                  sist
                  re
                  mai
                  ning
                  (%)



      +
                         Exposure energy (mJ/cm2)


    substrat

    SiO2
NEGATIVE RESIST
       light




     substrat

     SiO2
     photoresist
     photomask
NEGATIVE RESIST
       light




     substrat

     SiO2
     photoresist
     photomask
          NEGATIVE RESIST

                  pemanggangan
Visual inspection spraying



                            on
                            off




                 substrat

                 SiO2
re                                NEGATIVE RESIST
sist
re
mai
ning
(%)



                                    -              -
       Exposure energy (mJ/cm2)


                                        substrat

                                        SiO2
                   Perbedaan hasil akhir antara
                    positive dan negative resist



Imagenya merupakan daerah yang tidak        Imagenya merupakan daerah yang
         terkena sinar (light)                     terkena sinar (light)
Metode-metode
 lithography
1. ULTRAVIOLET




    photons




                 resist
                 SiO2


                 substrat
1. ULTRAVIOLET




   resolusi : 1μm

                    SiO2


                    substrat
2. ELECTRON BEAM


      Sumber electron




            resolusi : 0,5μm
3. X - RAYS




      mask



              resolusi : 0,5μm
SELESAI

				
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posted:11/6/2012
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