003_Ashing_Emitech K1050X Plasma Asher_200609 by xiaopangnv


									                              Emitech K1050X Plasma Asher
Procedure No.:                    Physics CR-003
Procedure Title:                  Ashing: Emitech K1050X Plasma Asher
Revision:                         1
Date:                             20th June 2009
Author:                           Xuhua Wang
Checked By:

       Instruction for the Emitech K1050X Plasma Asher
       1. Check the oil level in the pump whether it is within the working level. (There are two
       marks‐too low and too high levels). If it is too low, refill only with Fomblin Perfluoro
       Polyether YL Vac 06/6 oil, which is kept in the top draw opposite the machine with all other
       parts for the Plasma Asher.
       2. Turn on the Plasma Asher using the switch at the back right. The pump is controlled by the
       Plasma Asher which is on, too.
       3. Turn on the Oxygen gas supply valve and switch on the oxygen gas to the level which is
       marked on the meter. The maximum pressure should be 1.5 bar. Please never go beyond the
       maximum level of the Oxygen! If the oxygen level is higher than Maximum, please close the
       two valves to run the machine for once. The oxygen gas level will reduce to lower level than
       the maximum. Turn on the valves back on again. Make sure you have the right oxygen gas
       level, before you process your substrates.
       4. The Oxygen gas should feed into the inlet marked Gas 1. The screen panel should now
       “Press ENTER to load/change parameters…”
       5. Load samples by placing them face‐up on top of a microscope slide. It is best to use the
       plasma asher immediately before spin‐coating, as the effects of oxygen plasma treatment
       will last no more than 20‐30 minutes. For this reason, do no more than a few samples at a
       6. Always check the parameters before ashing. Press ENTER to start, and if you need to
       change any values, use the up and down buttons.
                 a) Set the RF Power Level (in Watts). It goes from 0‐100W. For standard ITO on glass,
                    80 W is fine. For flexible substrates much lower power levels are needed (e.g.
                    30W) or you’ll end up with holes in your substrates.
                 b) Man/Auto Power Ctl should be left at 1.
                 c) The Ashing Time can then be set in hours, minutes and seconds. For standard ITO
                    substrates 3 minutes is fine.
                 d) Bleed Delay Time should be left at 2.
                 e) Process Gas should left at Gas 1 (This is where the oxygen is feeding into).
                 f) Vent Valve should left at “Restricted”.
                 g) Turbo Pumping Enabled should be left at 0.
       7. When you are happy with the parameters, make sure the door is closed properly, and
         press START. The screen will let you know what is going on. First the chamber will pump
         down to 6‐7 x 10‐1 mbar, then the gas will start bleeding into the chamber. By this time the
         ball in the pressure gauge on the front‐left panel of the machine will have risen. The
         screen will then read “Ashing Sample at … Watts, depending on what you entered as the
         RF Power Level. Whilst ashing, the chamber will emit a UV glow (purple colour).
8. Once the ashing has stopped, gas will be vented into the chamber, and the ball on the
  pressure gauge will fall. The screen will then read “Venting, CAUTION PARTS MAY BE
  HOT”. Wait until the STOP button illuminates and the screen again read “Press ENTER to
  load/change parameters…” before opening the chamber door.
9. Never ever force to open the chamber door!!!
10. Remove your sample and close the chamber door. When you have finished, turn off the
    oxygen supply valve (butterfly valve), and then turn off the machine.

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