Docstoc

07

Document Sample
07 Powered By Docstoc
					Capability Competency-PCB

Core Competency/Capability

                                                    Factory Floor Area
                                                     Total employees
                                                         Capacity
                                          Process Capability
                    Inner board cutting   Minimum cutting size
                       and scrubbing      Board thickness
                                          Inner scrubbing
                                          Board thickness
                                          Maximum board working size
                                          Minimum board working size
                                          Film line width&Space:
                                          1 /3Oz
                    Inner Image transfer 1 /2Oz
                                          1 Oz
                                          2Oz
                                          3Oz
                                          4Oz
                                          5Oz
                                          Board thickness
                                          Maximum board size
                                          Minimum board size
                                          film line width&Space:
                                          1 /3Oz
                    Inner Image etching 1 /2Oz
                                          1 Oz
                                          2Oz
                                          3Oz
                                          4Oz
                                          5Oz
                                          Maximum board size
                       OPE machine        Minimum board size
                                          Board thickness
                                          Multibond Max board size
                                          Multibond Minboard size
                                          Multibond line board thickness
                        Inner Oxide
                                          Black oxide Max board size
                                          Black oxide Min board size
                                          Black oxid board thickness
                                          Maximum board size
                                          Minimum board size
                                          Board thickness
                             Lay-up       Prepreg qty of outer dielectric structure
                                          The producible qty of layer board
                        Lay-up

                                     Alignment precision
                                     The obligate size of boards border
                                     Mass lam:
                                     Max of layer qty
                                     Max of thickness
                                     Min of thickness
                                     Multi-later alignment precision
                                     Board twist/warp
                       Pressing
                                     Pin Lam:
                                     Max of layer qty
                                     Max of thickness
                                     Min of thickness
                                     Multi-later alignment precision
                                     Board twist/warp
                                     Mechanical and optical drilling:
                                     Aspect ratio
                                     Maximum hole diameter
                                     Minimum drilling hole diameter
                                     Hole size tolerance
                                     True positional tolerance
                                     Maximum board size
                       Drilling      Depth control
                                     Laser drilling:
                                     Aspect ratio
                                     Maximum hole diameter
                                     Minimum drilling hole diameter
                                     Hole size tolerance
                                     True positional tolerance
                                     Maximum board size
                                     Aspect ratio
                                     Aspect ratio for blind hole
                     Hole Plating
                                     Max panel size
                                     Thickness of hole wall
                                     film manual -registration tolerance
                     Out dry film    film auto-registration tolerance
                                     Max size
                                     Aspect ratio
                                     Aspect ratio for blind hole
                     Panel Plating
                                     Thickness of hole wall
                                     Max panel size
Process Capability
                                     Orignal line width/spacing:
                                     1/3OZ
                                     1 /2Oz
                                     1 Oz
                     Out etching
                                     2Oz
                                     3Oz
                                     4Oz
                                     5Oz
                      E-spraying coating or Screen printer:
                      Board size
                      Board thiness
                      Aspect ratio
                      Registering capability
                      Solder resist thickness
                      S/M in hole but not blocked hole:
                      ≤H/H OZ
   Solder mask        1/1 OZ
                      2/2 OZ
                      ≥3OZ
                      3. S/M not in hole:
                      ≤H/H OZ
                      1/1 OZ
                      2/2 OZ
                      ≥3OZ
                      Via plugging depth before S/M
     Carbon           Registration of carbon paste
       Ink            Line width
                      Line space
                      Registration of peelable s/m
  Peelable mask       Line width
                      Line space
                      Hole wall solder thickness
                      Max board size
      HASL            Board thickness
                      Min hole diameter
                      Max aspect ratio
                      Hole wall OSP thickness
                      Max board size
       OSP            Board thickness
                      Min hole diameter
                      Max aspect ratio
                      Gold Plating Thickness
                      Ni plating thickness
Gold Finger Plating
                      Board size
                      Board thickness
                      Immersion Nickel thickness
                      Immersion Gold thickness
                      Aspect ratio
   Imm Au&Ni
                      Board thickness range
                      Board size range
                      Blind hole aspect ratio
                      Gold Plating Nickel thickness
                      Gold Plating Gold thickness
                      Gold layer hardness
                      Ni layer hardness
 Panel Hard Gold      Aspect ratio
     Plating
                  Panel Hard Gold
                      Plating       Board thickness range
                                    Board size range
                                    Blind hole aspect ratio
                                    Surface roughness of finished goods
                                    Gold Plating Nickel thickness
                                    Gold Plating Gold thickness
                                    Gold layer hardness
                                    Ni layer hardness
                  Panel Soft Gold   Aspect ratio
                                    Board thickness range
                                    Board size range
                                    Blind hole aspect ratio
                                    Surface roughness of finished goods
                                    .Immersion Tin Thickness
                                    Eutectic Solder: Tin thickness
                                    Pb Free Solder: Tin thickness
                  Immersion Tin     Board Size
                                    Aspect ratio
                                    Board thicknes
                                    Blind hole aspect ratio
                                    Silver thickness
                                    Board Size
                  Immsiion Silver   Aspect ratio
                                    Board thicknes
                                    Blind hole aspect ratio
                                    Laboratory Equipments
                                                       1
                                                       2
                                                       3
                                                       4
                                                       5
                                                       6
                                    Relibility Test Requirments
                                    Solderability test
                                    Thermal Strees Test
                                    ET
                                    CAF(Conductive Anodic Filament)
                                    Relflow &wave test
Quality Control                     ROHS
                                    Halogen-Free
                                    Others



                                    Certifications
                                    ISO 9001
                                    ISO14000
                                    TS16949
                                    ISO13485
                 FDA
                 UL
                 Others
                 FR4-Tg140
                 FR4-Tg150
                 FR4-Tg170
                 FR4-Tg180
                 FR4-Tg200
Material Types   FR5
                 TEFLON
                 CEM1
                 CEM3
                 Aluminum
                 Metal (Copper)
               Description

Factory area is 46,000 square meters
1300
750000square feet per month
+/-2mil
10"*14"
0.075-2.6mm
water broken time >30S
0.075-2.6mm
21*24"
10"*14"

3/3mil
4/3mil
4/3mil
7/3mil
12/4mil
17/5mil
20/6mil
0.075-2.6mm
21*24"
10"*14"

3/3mil
3/4mil
3/4mil
5/5mil
8/8mil
11/11mil
14/14mil
0.075-2.6mm
21*24"
0.075-2.6mm
21*24"
9.8*12"
0.075-2.6mm
21*24"
9.8*12"
0.075-2.6mm
21*24"
10"*14"
0.075-2.6mm
≦3sheets
≦3sheets(6L),≦2sheets(More than 6L)
                            ±3mil
                            4L:0.4724mm,More than 6L:0.591mm(include)

                            16L
                            3.5mm
                            0.3mm
                            ±3mil
                            ≦0.75%

                            18L
                            4.2mm
                            0.3mm
                            ±3mil
                            ≦0.75%
cal and optical drilling:
                            ≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
                            6.5mm
                            0.1mm
                            ±1mil(Slot Hole:±2mil)
                            ±3mil
                            21"*24"
                            5mm

                            ≦1
                            10mil
                            4mil
                            ±10%
                            ±2mil
                            21"*24"
                            ≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
                            ≦0.75
                            21"*24"
                            0.6-1.4mil
                            ±3mil
                            ±2mil
                            CCD:9"×12"--21"×24" manual:24"*30"
                            ≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
                            ≦0.75
                            0.3-0.7mil
                            21"*24"

                            3/4mil
                            3/4mil
                            4/4mil
                            5/9mil
                            6/14mil
                            11/15mil
                            16/16mil
ng coating or Screen printer:
                        21"x24"
                        0.4-3.5mm
                        ≦6
                        ±3mil
                       on copper:0.2-1.0mil,on substrate:0.4-2.0mil
ole but not blocked hole:
                       Ok
                       OK
                       OK
                       OK

                      Ok
                      OK
                      OK
                      OK
                      80%
                      ±4.5mil
                      Carbon ink coverage copper pad unilateral min 4.5
                      min16mil
                      ±6mil
                      Slot Hole Width <1.0mm, slot length 14.8mm
                      ±6mil
                      0.04~1.0mil
                      600mm*610mm
                      0.4~3.5mm
                      0.2mm
                      ≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
                      0.15~0.5μm
                      620mm*610mm
                      0.3-3.5mm
                      0.2mm
                      ≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
                      3~40u”
                      100~200u”
                      10*14"~21*24''
                      0.4~3.5mm
                      100~200u”
                      1~5u”
                      ≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
                      0.4~3.5mm
                      10*14"~21*24''
                      ≦0.75
                      100~200u”
                      3~40u”
                      6H
                      6H
                      ≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
0.4~3.5mm
10*14"~21*24''
≦0.75
OK
100~200u”
1~5u”
6H
6H
≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
0.4~3.5mm
10*14"~21*24''
≦0.75
OK
0.4~3.5mm
10~60u”
10~60u”
620mm*610mm
≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
0.4~3.5mm
≦0.75
6~20 u”
10*14"~21*24''
≦7(Hole Dia0.2mm),≦7.5(Hole Dia 0.25mm Above )
0.4~3.5mm
≦0.75

CMI900 Surface thickness test Instrument
CMI700 Copper thickness test Instrument
CMII Chloride ion test Instrument
Copper foil tension test Instrument
Metallographic microscope
Surface Insulation Resistancetest Instrument


YES
YES
YES
YES
YES
YES
YES
YES




YES
YES
YES
N/A
N/A
YES
N/A
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES
YES

				
DOCUMENT INFO
Shared By:
Categories:
Tags:
Stats:
views:1
posted:10/18/2012
language:English
pages:10