MICHAEL J. MOYLAN SR.
Tel: home (401) 567-0408 ; cell (401) 275-3660
Harrisville, RI 02830 e-mail: email@example.com
Applying for a Director or Engineering Management position to utilize my R&D, Product, and Test Development
skills. Experienced in all aspects of technical problem solving from early concept to high volume production.
Experienced in Circuit & Process Verification, Experimentation, Data Analysis, Mfg Planning, Operations, Strategic
Road Mapping, Budget Planning & Market Research. Systems Development, Integration & Test Optimization.
Package Development, Quality & Reliability, Failure Analysis, Process & Cost Improvements, Scrap reduction, P&L
and Customer Satisfaction.
International Rectifier Corporation; HiRel Division, Leominster, MA
Sr Staff Product Development Engineer:
Jan. 12 Responsible for the R&D of Si, GaN, SiC power MOSFET devices for Military, Aerospace, and Medical
to applications where high reliability and radiation harden requirements are desired. Experienced with JANS MIL-19500
Sep. 12 Space level screening and reliability. Manage Hermetic Rad Hard package development to be qualified for SEE &
TID testing to 1MRad capability.
Contour Semiconductor; North Billerica, MA (A venture-backed start-up company)
Product & Test Engineering Manager:
Aug. 07 Organize and implement R&D Test Development & Product Engineering departments in a start up environment.
to Direct report to the VP of Engineering. Responsible for design and process verification, define engineering
Nov. 11 procedures, procurement of capital equipment, departmental budgeting and staffing. Provide technical support during
the development of 1GB PCM NAND Flash Memory ICs on 90 nanometer Si technology.
This was a hands-on position providing managerial and technical support through IC design, process development
and test. Responsible for all ATE & bench testing, IC design verification, electrical and temperature characterization
for product die and process test modules. Responsible for all test data storage & analysis, failure analysis, DOE, DFT,
DFM, KGD, IC packaging, product reliability test & qualification. Plan & budget for test labs, and production volume
manufacturing. Responsible for project management, planning roadmaps & competitive analysis. Present weekly
updates, status, test data summaries, and proposals to the executive staff.
ON Semiconductor; East Greenwich, RI
Manager for Product Development, Test Development, & Product Engineering: (Promotion)
Sep. 05 Manager of the Product Engineering, Test Development & New Product Development Engineering
to Departments for the Computing Products Group (CPG). Responsible for the design, process and test
Aug. 07 capability of mixed signal analog circuits on BCD sub-micron Si technology. Manage a staff of Engineers local
and abroad in Design Centers and Manufacturing facilities (~35 Engineers).
Provide test and engineering support for Computing Power Management IC’s through design verification & process
development, failure analysis, RTP, RTM, production ramping, sustaining Mfg, with cost & yield improvements for
the business unit’s product portfolio. Responsible for departmental budgets and P&L.
ON Semiconductor; East Greenwich, RI
Product Engineering Manager: Responsible for continuous improvement of released Analog products.
Feb. 01 Manage product teams both local and abroad. Advise Product development strategies to grow business
to and meet Business Unit goals. Key member of the Business Unit Management Staff. Tasked to
Sep. 05 improve testing and reduce costs of assigned products in production. Act as strategic customer contact
for all issues relating to product portfolio. Work with customers to define specifications, device performance,
applications, and manufacturing issues. Oversee and ensure the control of product specifications for new
and released products. Coordinate cost reduction efforts such as test reductions, temperature test elimination,
failure analysis, yield improvements and BOM assembly changes. Advise new product development teams by
providing a manufacturing perspective and product experience. Approve test planning and definition as a
NPD member. Coordinate Design and Test Engineering product characterization and maintain cost metrics.
Ensure that all new products meet Production requirements by conducting post RTP manufacturing audits and
coordinating technical responses as required. Assume leadership roles, staffing, training, mentoring and development
of the Product Engineering staff.
ON Semiconductor; (Formerly Cherry Semiconductor) East Greenwich, RI
Sr. Product/Test Engineer: Responsible for product Test, Yield, and Customer support of Linear
Feb. 00 BiPolar and BiCMOS ICs used in Automotive applications. Test optimization and test time reduction
to through platform conversions, multi-site test hardware development, and temperature insertion
Feb. 01 elimination. Lead teams for product line process integration transfers to Europe and test transfers to the
Philippines and Japan.
Anadigics Inc. Warren, New Jersey
Sr. Staff Product Development Engineer: Gallium Arsenide process technologies utilized in the
Jun. 97 RF Wireless application (GSM, PCS, DCS, AMPS); Fiber Optical TIA’s (Long & Short Wave)
to applications. Project Manager for IC Development of Wireless and Fiber product business segments.
Feb. 00 Manage new product development (NPD) cross functional teams from IC concept to RTM.
Define wafer process DOE matrices to obtain corner lot and process targets. Responsible for lot starts,
Fab process optimization and all electrical test data analysis. Provide Cp \ Cpk indices for design
process capability. Produce statistical yield analysis including trend, frequency, and correlation data
for IC development. Comply with corporate requirements for gross margin targets. Provide projection
plans for continuous improvement. Support a smooth transition into Production Manufacturing with
Product Sustaining Engineering. Act as Project Team Leader for Yield Enhancement & Scrap
Reduction Engineering Teams to reduce cost, cycle time and achieve overall yield improvements.
Perform RC failure analysis on test line fallout for wafer and final test and provide corrective action plans.
Proficient in weekly Verbal Presentation and Technical Reporting to the Executive Staff. Manage a
technical staff of Engineers and Technicians.
Delco Electronics; Kokomo, Indiana
Senior IC Supplier Quality Engineer: Automotive Powertrain Control System Manufacturing.
Nov. 94 Responsible for providing technical support to DE operations and GM assembly plants.
to Perform component level diagnostics to identify, quantify, and resolve quality problems
Jun. 97 on proto type and production engine control systems. Identify system / IC deficiencies at
the manufacturing test and vehicle systems application levels. Interact with Bipolar, BiCMOS, and CMOS
semiconductor suppliers and provide technical fail data used to develop supplier test containment. Communicate daily
with suppliers to reduce IC quality deficiencies, monitor continuous improvements, and cost saving programs.
Responsible for the review and final closure of supplier Failure Analysis Reports. Analyze warranty returns and
develop a lessons learned database for System Development Engineering. Lead Response Teams to resolve Quality
Alerts during Assembly Plant and Warranty critical return events. Provide technical data and participate in Risk
Acessment Teams when determining plant shutdowns or vehicle recalls. Review supplier mfg. process changes for
yield improvement / cost reduction requests. Visit new & existing supplier locations to perform Supplier Audits for
qualification with approval based on manufacturing and quality capabilities. Non-conforming product waivers are also
reviewed for approval. Utilize GM’s five-phase resolution plan for containment, root cause, and irreversible corrective
actions. Provide quarterly supplier quality feedback reports for Motorola, Intel, SGS, TI, Harris, and IC Delco to name
a few. Comply with ISO 9000 / QS 9000 standards.
Delco Electronics; Kokomo, Indiana
Advanced IC Product Engineer / IC Delco Customer Applications Support (Promotion)
May 93 Responsible for customer support to Powertrain Control Systems Manufacturing.
to Track and distribute failure returns through database management. Verify test data and
Nov. 94 correlate between IC production and customer application to reduce erroneous returns.
Communicate containment plans, root cause failure analysis, and irreversible corrective
actions to the customer Reduce PPM failures for manufacturing line pulls, assembly plant , and field warranty returns.
Coordinate teams for IC process improvements, test methodologies, and cost reduction. Generate monthly PPM and
Status Reports for closed and pending issues. Responsible for Customer Challenge cost & quality forecasting reports.
Appointed as Lead Engineer for IC Delco Power Train IC Division (Jun. 93) to manage manufacturing line pulls in
Kokomo, Milwaukee, & Mexico and GM related quality/application concerns. Manage a team of Product Sustaining
Engineers and Technicians. Developed an activity reporting system for IC Delco Management and the Customer for
improved problem response time.
Delco Electronics; Kokomo, Indiana
IC Product Engineer: Power Train / Body & Chassis IC Divisions
Jan. 93 Responsible for product support of Linear BiPolar, BCD, I2L thin EPI BiPolar and MEMS ICs used
to in Automotive Application. Perform ATE / Bench Test verification / correlation, root cause failure
May 93 analysis, corrective action planning via test, process, or design. Cost reduction and yield enhancement.
Delco Electronics; (Subsidiary of General Motors) Kokomo, Indiana
IC Development Engineer: Powertrain/Body & Chassis IC Division
Apr. 91 Responsible for the development of Linear BiPolar ICs utilized in the Supplemental
to Inflatable Restraint System. Perform IC characterization via Design of Experiments to
Jan. 93 achieve +/- 6 sigma across temperature. Perform EOS, ESD, Latch-up and Inversion
studies. Perform Reliability Testing via extended electrical, environmental temperature & humidity stress testing
conforming to the JEDEC standards through 0 Hr. and end point testing. Manage an interactive team of cross
functional engineers to achieve on time delivery for product need dates from Proto type, Pilot, and into Production.
Develop and implement a Single Digit PPM Quality Plan. Champion corrective action teams to achieve product goals
and customer satisfaction. Developed good oral and written communication skills.
Cherry Semiconductor; East Greenwich, Rhode Island
IC Failure Analysis Engineer:
Nov. 89 Responsible for Root Cause Failure Analysis with Phase Reporting for Linear BiPolar
to and I2L Thin EPI BiPolar ICs used in the automotive; memory management, power
Apr. 91 supply, and motor control applications. Flip-Chip, thick film ceramic, and plastic
package technologies. Proficient in all facets of IC Failure Analysis: application to bench
correlation, X-Ray real time & fluorescence, C-SAM, C-SLAM, optical microscopy,
SEM, Auger/EDS elemental analysis, Ion Chromatography, Micro-probing, Laser
applications, Light Emission microscopy, Liquid Crystal detection, FIB, TEM, Mechanical cross sectioning techniques,
wet chemical and plasma deprocessing.
Sprague Electric Company; Worcester, Ma. (Presently Allegro Micro Systems Inc.)
IC Product/Test Engineer:
May 78 Responsible for monitoring wafer fab PCM data, design verification & characterization (first
to silicon), specification revisions and document control, ATE test SW/HW development and maintenance,
Sep. 89 production support, wafer/final test data collection/analysis, report generation, failure
analysis, process/cost improvements through yield analysis and test optimization.
Central New England College; Worcester, Massachusetts:
Bachelor of Science Degree in Electrical Engineering
Worcester Vocational HS; Worcester, Massachusetts:
Electrical Construction, Motors & Generators, Transformers, and Electronics Technology
Additional Courses: Statistics I, II, and III, Design of Experiments, Taguchi’s Methods, Ford’s Eight Disciplines,
FMEA, GR&R, Teradyne & Nextest ATE (basics & options), GM/Delco management training, Kepner/Tregoe problem
solving & decision making, Kepnor/Tregoe rational management, Attended several other circuit design & test seminars,
DFT, DFM, GM project management, and EDS, SAS Operating System Training, JMP. Ovonyx phase change
GST225 process, test, and reliability.
Audited many MSEE courses in circuit design & analysis, test, Semiconductor Physics, Statistics,
and Engineering Management through the Universities of Indiana, Kentucky, Purdue, Rutgers, & Rhode Island.
Personal Interests: Board Member & former President of the New England Numismatic Association (NENA), classic
car enthusiast, building construction projects, New England sports fan, and family oriented.