Mohammad Nikpour by 0klOu69


									                       Mohammad Nikpour

The University of Texas at Dallas

Masters, Business Administration (Itnl Marketing), 2009 -2011 GPA: 3.74

Bachelor, Telecommunications engineering, 1999 -2002 GPA: 3.26


Process Engineer (Expat) at Texas Instruments (clark, Philippines)

August 2010 -Present (1 year 3 months)

    Development of new or modified processes in various areas of
      semiconductor processing -mainly photo-lithography
    Definition of processing or handling equipment requirements and
    reviews product requirements with design staff to ensure
      compatibility of processing methods
    compile and evaluate test data to determine appropriate limits and
      variables for process or material specifications
    Conceive and plan projects involving definition and selection of
      new concepts and approaches in the processing or development of new
      or improved processes in photo mask, diffusion, deposition, wafer
      fabrication, and device physics.

   release of 5 new technologies in the photo process in TI's newest,
    state of the art factory in Philippines
   train over 20 engineers (equipment and process)
   institute multiple new IT and inline systems from Dallas to Clark

Wafer Fab Process Engineer at Texas Instruments (Dallas, TX)

April 2006 -September 2010 (4 years 6 months)

   Hardware and Software Design of 3 Macro and 4 Micro inspection
    tools in a class 10k clean room environment.
   Monitor all macro/micro/electrical defects inline and end of line
    and detect process excursions ASAP.
   Work with assembly test sites around the world, and other FABS in
    Dallas to maximize product quality.
   Also responsible for FAB website, training of all technicians,
    inline root cause analysis of excursions at photo, plate, sputter,
    and ETCH processes, etc..
Product Engineering Technician at Texas Instruments

April 2004 -August 2006 (2 years 5 months)

   Prevention of shipping defective (due to micro/macro defects) 6 and
    8 inch wafers to different analog customers, via inline inspections
    at multiple levels within wafer fab and probe lab on a
    micro/macro/test level.
   Determine if failures are reliability failures or not and overall
    quality assurance of product sent to customer by using inline,
    multiprobe, and testprobe data.
   Identify macro defects on wafers; consequently performing root
    cause analysis in order to determine what tool and or process is
    causing these macro defects.

Manufacturing Specialist at Texas Instruments

September 2000 -April 2003 (2 years 8 months)

Qualification and running of CVD and PVD thin-film tools in KFAB

Honors and Awards

Member Group Technical Staff in Texas Instruments

Specialties/ Skills

• New Product and technology Introduction
• Yield improvement/defect reduction. (odyssey)
• Data Analysis (Jump, sql server, Excel).
• Complex Problem Solving.
• Wafer Fab processing.
• Cost & Cycle time Reduction.
• Statistical Process Control.
• Microsoft Office.
• Bilingual (Farsi/English).Can read and write Arabic, learning to speak
as well
• SPC, FMEA, 8D's
• Visual Basic, Sharepoint, C++

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