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F10-44-BUCKCONV-End of Project Memo.docx

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					Date: May 3rd, 2011

To:

          Dr. Harackiewicz

          Dr. Weston

          Mrs. Purcell

From: Team #44: Buck Converter (F10-44-BUCKCONV)

Subject: End of Project Memo

The purpose of this memo is to summarize the project and present the progress made.



Contents:

         Project Management Assessment Report
         Implementation Cost Estimate
         Project Expense Report
         Implementation Schedule
         Team Spring Hours
         Timeline
         Action Item List
         Agendas
         Recommendations for Future Teams
         What We Learned
Project Management Assessment:

Overall Team#44 worked cooperatively to achieve the common goal of the optimizing a buck
converter. Despite several unexpected setbacks, the team was able to work together to
increase the efficiency 4.5% in terms of power loss. The flexibility and organization of the team
were reasons why this project was so successful. When the hardware simulation of the circuit
was put on hold due to delay in arrival of parts, the team was flexible and began working on
multi-variable software simulations. In addition, the team began working on subsystem reports
while waiting for the parts to arrive. To organize the design report, “Design Report Component
Responsibility List” and keeping it updated with progress and due dates is an example of Team
#44’s organizational skills. This document allowed the whole team to keep track of the design
report’s progress.
                                Implementation Cost Estimate
Item #        Description                             Quantity     Unit Price Subtotal
          1   0 ohm resistor                                  50    on hand
          2   1 ohm resistor                                  50    on hand
          3   4.7 microfarad cap large size                   50    on hand
          4   4.7 microfarad cap medium size                  50    on hand
          5   4.7 microfarad cap small size                   50    on hand
          6   Inductor 325nH                                  36    on hand
          7   Inductor 380nH                                  30    on hand
          8   MOSFET                                          25    on hand
          9   Power supply input                               1    on hand
         10   Breadboard                                       2    on hand
         11   MATLAB                                           4    on hand
         12   LTSpice                                          4    on hand
         13   Cadence                                          1   borrowed
         14   PCB board                                       20    on hand
         15   Oscilloscope                                     4   borrowed
         16   LTC4444 boost                                    4       $2.61     $10.44
         17   LTC4444-5 boost                                  4       $2.42       $9.68
         18   LTC4446 boost                                    2       $2.42       $4.84
         19   IPD050N03L G MOSFET                              8       $1.08       $8.64
         20   IPB147N03L G MOSFET                              8       $0.98       $7.84
         21   BSC014N03LS MOSFET                               8       $2.53     $20.24
         22   IPB096N03L MOSFET                                8       $1.11       $8.88
         23   IPD135N03L MOSFET                                8       $0.63       $5.04
         24   1N914 Diode                                      8       $0.06       $0.48
         25   1N4148 Diode                                     8       $0.09       $0.72
         26   C0805C106K4PACTU capacitor                      10       $1.50     $15.00
         27   C1210C156K4PACTU capacitor                       6       $2.20     $13.20
         28   LQM18NN1R0K00D inductor                          4       $0.26       $1.04
         29   LQM18NN1R5K00D inductor                          4       $0.26       $1.04
                                                                       Total:   $107.08
Project Expense Report:

Item
#       Description                        Quantity   Unit Price   Subtotal
16      LTC4444 boost                      4          $2.61        $10.44
17      LTC4444-5 boost                    4          $2.42        $9.68
18      LTC4446 boost                      2          $2.42        $4.84
19      IPD050N03L G MOSFET                8          $1.08        $8.64
20      IPB147N03L G MOSFET                8          $0.98        $7.84
21      BSC014N03LS MOSFET                 8          $2.53        $20.24
22      IPB096N03L MOSFET                  8          $1.11        $8.88
23      IPD135N03L MOSFET                  8          $0.63        $5.04
24      1N914 Diode                        8          $0.06        $0.48
25      1N4148 Diode                       8          $0.09        $0.72
26      C0805C106K4PACTU capacitor         10         $1.50        $15.00
27      C1210C156K4PACTU capacitor         6          $2.20        $13.20
28      RESISTOR 1.00 OHM 100W 1% TO-247   12         $7.832       $93.98
29      OCS 5V HALF SIZE +/-50 PPM         2          $6.77        $13.54
30      CAP CER 0.1UF 100V X7R 10% RAD     10         $0.301       $3.01
31      CAP 15PF 50V CERAMIC C0G 5%        10         $0.252       $2.52
32      CONN JACK BANANA INSUL NYLON BLA   12         $0.5         $6
33      CONN JACK BANANA INSUL NYLON RED   12         $0.5         $6
34      CORD PATCH BANANA PLUG 4" RED      5          $3.7         $18.7
35      B-4-0-ND                           5          $3.7         $18.7
36      INDUCTOR SHIELDED PWR 0.72UH SMD   4          $2.41        $9.64
37      INDUCTOR HI CRNT 1.0UH 14.5A SMD   4          $2.79        $11.16
38      INDUCTOR POWER .68UH 15.5A SMD     4          $2.26        $9.04
                                                      Total        $297.29
Implementation Schedule

     Step    Step Description                                                     Weeks
       1     Part ordering                                                           2
       2     Desoldering the original parts                                          1
       3     Replace with the recommended parts                                      1
       4     Test the efficiency for the operation (Including Trouble-Shooting)      1
             Total                                                                   5
           Team Spring Hours



Week
Number         1      2        3     4      5     6       7    8     9     10    11    12    13   14    15    16
Sunghun
Cho            9      8      10      7      7     6      10    8     2      6    15    14    12   8     10    0      132
Michael
Howe          9.5     8      15    10.5    10    8.5     8.5   12    1     6.5   25 26.75    16   18    6.5   2    183.75
Samantha
Reh            8     7.5     11     10     6.5    7     10.5   10    3     12    15   9.75   10   9     20    10   149.25
Mallory
McGuire       13      8    14.75     8    7.75    7    12.25   10   2.5   6.25   20 20.75 15.5    9     16    4    174.75
Total
Hours:       39.5   31.5   50.75   35.5 31.25 28.5     41.25   40   8.5 30.75    75 71.25 53.5    44   52.5   16   633.75
Spring 2011 Timeline

Month               J       J        F       F       F       F       M       M       M       M    M    A       A    A    A    M
Day                 18      25           1       8   15      22          1       8   15      22   29       5   12   19   26       3
Week                    1       2        3       4       5       6       7       8       9   10   11   12      13   14   15   16
Set up test bench
                                     *1
LTSpice
simulations


Hardware
verification -
individual
subsystems


                                                     *2
Hardware
verification -
multiple
subsystems


                                                                     *3              *3
Test prototype


                                                                             *4      *4
Compile data


Modifications
                                     *5                                                           *6                     *7
Design report
and presentation



Proposed Timeline                   Updated Timelime

Milestones:

*1 – All test fixtures created to start hardware verification on subsystems
*2 – All subsystems with optimum component selection found on individual subsystems
*3 – Final component selection for entire system
*4 – First prototype created
*5 – Design review
*6 – Final design for buck converter created and tested for any compatibility issues
*7 – Design report finished and turned in
         Action Item List

#    Activity                                     Person   Assigned     Due         Extension: Status Comments
 1   Build system test fixture                    MM       12/19/2011   1/25/2011   2/1/2011    100%
 2   Build input supply                           MM       12/19/2011   1/25/2011               100%
 3   Create load                                  MM       12/19/2011   1/25/2011   3/3/2011    100%
 4   Acquire additional parts                     MM       12/19/2011   1/25/2011               100%
 5   Create simulation organization document      MH       12/19/2011   1/25/2011               100%
 6   Create simulation organization document      SC       12/19/2011   1/25/2011               100%
 7   Create simulation organization document      SR       12/19/2011   1/25/2011               100%
 8   Set up diode test bench                      MH       12/19/2011    2/1/2011               100%
 9   Set up FET test bench                        MH       12/19/2011    2/1/2011               100%
10   Set up boost device test bench               SR       12/19/2011    2/1/2011               100% N/A
11   Set up capacitor bank test bench             SR       12/19/2011    2/1/2011   2/3/2011    100%
12   Set up inductor test bench                   SC       12/19/2011    2/1/2011   2/3/2011    100%
13   Vary diodes for LTSpice simulation           MH       12/19/2011   2/15/2011               100%
14   Vary FETs for LTSpice simulation             MH       12/19/2011   2/15/2011               100%
15   Vary capacitors for LTSpice simulation       SR       12/19/2011   2/15/2011               100%
16   Vary boost devices for LTSpice simulation    SR       12/19/2011   2/15/2011               100%
17   Vary inductors for LTSpice simulation        SC       12/19/2011   2/15/2011               100%
18   Vary loads for LTSpice simulation            MM         2/2/2011   2/15/2011               100%
19   MATLAB Code to Website                       MH         2/2/2011    2/8/2011               100%
20   Voltage Spike Explanation                    MM         2/2/2011    2/8/2011               100%
21   Verify diodes LTSpice simulation             MH        2/15/2011   2/17/2011               100%
22   Verify FETs LTSpice simulation               MH        2/15/2011   2/17/2011               100%
23   Verify capacitor LTSpice simulation          SR        2/15/2011   2/17/2011               100%
24   Verify boost devices LTSpice simulation      SR        2/15/2011   2/17/2011               100%
25   Verify inductors for LTSpice simulation      SC        2/15/2011   2/17/2011               100%
26   Verify load LTSpice simulation               MM        2/15/2011   2/17/2011               100%
27   LTSpice Single Variable Report - Boost       SR        2/22/2011    3/1/2011               100%
28   LTSpice Single Variable Report - Capacitor   SR        2/22/2011    3/1/2011               100%
29   LTSpice Single Variable Report - FETs        MH        2/22/2011    3/1/2011               100%
30   LTSpice Single Variable Report - Diodes      MH        2/22/2011    3/1/2011               100%
31   LTSpice Single Variable Report - Inductor    SC        2/22/2011    3/1/2011               100%
32   LTSpice Single Variable Report - Load        MM        2/22/2011    3/1/2011               100%
33   Vary assigned multi-variable simulations     SR        2/22/2011    3/1/2011               100%
34   Vary assigned multi-variable simulations     MH        2/22/2011    3/1/2011               100%
35   Vary assigned multi-variable simulations     SC        2/22/2011    3/1/2011               100%
36   Vary assigned multi-variable simulations     MM        2/22/2011    3/1/2011               100%
37   Complete Written Progress Report             MM        2/22/2011    3/1/2011               100%
38   LTSpice Multi-Variable Report - Capacitor    SR        2/27/2011    3/3/2011               100%
39   LTSpice Multi-Variable Report - FETs             MH   2/27/2011    3/3/2011              100%
40   LTSpice Multi-Variable Report - Diodes           MH   2/27/2011    3/3/2011              100%
41   LTSpice Multi-Variable Report - Inductor         SC   2/27/2011    3/3/2011              100%
42   LTSpice Multi-Variable Report - Load             MM   2/27/2011    3/3/2011              100%
43   Collect juction to case temp - Inductor          SC   2/27/2011    3/3/2011              100%
44   Collect juction to case temp - FET               MH   2/27/2011    3/3/2011              100%
45   Research reliability issues                      MM   2/27/2011    3/3/2011   4/7/2011   100%
46   Create load schematic                            MH   2/27/2011    3/3/2011              100%
                                                                                                   Diodes
48 Vary diodes for hardware simulation                SR    3/1/2011 3/24/2011 3/31/2011      100% reassigned
49 Vary FETs for hardware simulation                  MH    3/1/2011 3/24/2011                100%
                                                                                                   Hardware
50   Vary capacitors for hardware simulation          SR    3/1/2011   3/24/2011 3/31/2011    100% issues
51   Vary inductors for hardware simulation           SC    3/1/2011   3/24/2011              100%
52   Vary loads for hardware simulation               MM    3/1/2011   3/24/2011              100%
53   Troubleshoot why FETs are not switching          MH    3/8/2011   3/24/2011              100%
54   Design report - Subsystem Bullets (first five)   MH    3/8/2011   3/24/2011 4/7/2011     100% Diodes
55   Design report - Subsystem Bullets (first five)   SR    3/8/2011   3/24/2011              100%
56   Design report - Subsystem Bullets (first five)   SC    3/8/2011   3/24/2011              100%
57   Talk to Bob about getting 18A surge current      MM    3/8/2011   3/24/2011              100%
58   Fet/Inductor Multi-Variable HW Simulation        MH   3/24/2011    4/7/2011              100%
59   Fet/Inductor Multi-Variable HW Simulation        SC   3/24/2011    4/7/2011              100%
60   Fet/Cap Multi-Variable HW Simulation             SR   3/24/2011    4/7/2011              100%
61   Duty Cycle Baseline HW Simulation                MM   3/24/2011    4/7/2011              100%
62   Subsystem - Design Report(s)                     MH    4/5/2011   4/14/2011              100%
63   Subsystem - Design Report(s)                     SC    4/5/2011   4/14/2011              100%
64   Subsystem - Design Report(s)                     SR    4/5/2011   4/14/2011              100%
65   Subsystem - Design Report(s)                     MM    4/5/2011   4/14/2011              100%
                                                                                                   User's
                                                                                                   guide not
66   User's Guide/Technical Manual                    SR    4/5/2011   4/19/2011              100% needed
67   Executive Summary                                MM   4/12/2011   4/21/2011              100%
68   Definition/Description of Purpose                MM   4/12/2011   4/21/2011              100%
69   Introduction                                     MM   4/12/2011   4/21/2011              100%
70   Cost and Time Implementation                     SC   4/12/2011   4/21/2011              100%
71   Other Issues                                     MH   4/12/2011   4/21/2011              100%
72   Transmittal Letter                               SR   4/12/2011   4/21/2011              100%
73   Table of Contents                                SC   4/12/2011   4/21/2011              100%
74   Acknowledgements                                 SR   4/12/2011   4/21/2011              100%
75   Discussion of Options                            MH   4/12/2011   4/21/2011              100%
76   Expected Performance Setup                       MH   4/12/2011   4/21/2011              100%
77   Description of Appearance                        SR   4/12/2011   4/21/2011              100%
78   Title/Cover Page                     MM   4/12/2011   4/21/2011   100%
79   Expected/Observed Performance Data   SC   4/12/2011   4/21/2011   100%
80   Description of Expectations          MH   4/12/2011   4/21/2011   100%
81   Recommendations for Improvement      SR   4/12/2011   4/21/2011   100%
82   What Have We Learned                 SC   4/19/2011   4/28/2011   100%
83   Recommendations for Future Teams     SR   4/19/2011   4/28/2011   100%
84   Project Management Assessement       MM   4/19/2011   4/28/2011   100%
85   Timeline                             MH   4/19/2011   4/28/2011   100%
86   Presentation Slides                  SR   4/19/2011   4/28/2011   100%
87   Presentation Slides                  MM   4/19/2011   4/28/2011   100%
88   Presentation Slides                  SC   4/19/2011   4/28/2011   100%
89   Presentation Slides                  MH   4/19/2011   4/28/2011   100%
                                 Team 44: Buck Converter
                                    January 18th, 2011
                                      Team Meeting

Old Business:
    All parts are ordered.
          o Boost devices are backordered and we are waiting to hear from Gladys.

New Business:
   Discuss progress made over break
         o PWM is set up, but needs to be verified and three more need to be built.
   Need to discuss with management about going over budget.
         o $121.61 versus $107.08 due to PWM components.
   Set up new meeting time.

Action Items:
     Lab keys
     Update notebooks
     Update website
     Create a document that outlines your organization of simulation experiments
     Begin working on AIL components below
                                  Team 44: Buck Converter
                                     January 18th, 2011
                                   Management Meeting

New Business:
   Progress over break:
         o All parts are ordered.
                Boost devices are backordered and we are waiting on progress.
         o Lab station is set up with all devices and software needed.
         o Input supply is set up, but needs to be verified and three more need to be built.
   Progress in the next two weeks:
         o All members will receive lab keys
         o Update notebooks\website
         o Create a document that outlines your organization of simulation experiments
         o Complete AIL components below

Action Items




Questions/Comments:
    Over budget due to input supply components. What is the process for this?
          o $121.61 versus $107.08
                                  Team 44: Buck Converter Project
                                      Client Meeting Agenda
                                         January 25th, 2011

Introductions

Buck Converter Schematic
        Schematic layout and LTSpice layout differences.
              o Why is C6 located far right mid board instead of in line with the rest of the
                  capacitor bank?
              o Why are there two capacitor banks? Is each phase using the same bank?
        What is the U8, temperature sensor used for?
              o Can we use this to verify our temperature stays below a threshold?
        What are the six output signals (REF)? Can we use them?
        PVPS – Output?
        PVDC – 16V Rail?

Load
          Varying array of resistors.
          What range?

Setting Up Test Fixtures
             How to connect input signals to boost device?
         How to connect to load?
         How hot can boards get while using hot air/soldering guns.
                               Team 44: Buck Converter Project
                                   Team Meeting Agenda
                                     January 27th, 2011


Design Review
     Presentation
     List of Questions
     Send out invitations

LTspice and Schematic Update
    Add capacitors to LTspice
    Change names of components to match schematic

Begin work on test fixtures and PWMs.
                               Team 44: Buck Converter Project
                                   Client Meeting Agenda
                                      January 30th, 2011


Finish Presentation

Build Test Fixtures
     System
     Capacitor
     MOSFETs/Diodes
     Inductor

Troubleshoot Input Supply Devices
                               Team 44: Buck Converter Project
                                   Design Review Agenda
                                     February 1st, 2011

Team Introduction

Presentation

Questions

Discussion




Questions:

   1. Can we have access to a soldering station for smaller components?
   2. It was recommended we use heat sinkable resistors for our load. Is there any available
      or do we need to order these?
   3. Can you explain how thermal couplers work and how we can use them with our boards?
                                  Team 44: Buck Converter Project
                                      Client Meeting Agenda
                                         February 8th, 2011


Discuss need of 150 MHz function generator.

Discuss load set up.

Discuss boost device soldering.

Research thermocouples.

Explain PWM set up on LTSpice.

LTSpice Simulations.
                                  Team 44: Buck Converter Project
                                      Client Meeting Agenda
                                          March 3rd, 2011


Old Business:
    Crystal oscillator chip is in.

New Business:
   Finish construction of load.
   Look into how the crystal oscillator chip works.
   Prepare for hardware simulations.
                               Team 44: Buck Converter Project
                                   Client Meeting Agenda
                                      March 10th, 2011


Old Business:
    Female banana plugs and short leads have arrived.

New Business:
   Solder plugs to board and test impedance.
   No longer need oscillator chip, because we can double the device frequency of 472 kHz
      since it is a two phase buck converter.
   Troubleshoot why the FETs are not switching.
   Prepare for hardware simulations.
                               Team 44: Buck Converter Project
                                Management Meeting Agenda
                                         03-22-2011

Updates:
    Discovered a way to supply the needed frequency to the PWM generator without using
      the 150MHz crystal oscillator chip.
    Inductors have arrived

Completed Tasks:
    All parts are ordered/arrived.
    Input supply devices built.
    Test benches built.
    MATLAB code compiled.
    Single variable LTSpice completed
         o Data exported.
         o Data analyzed.
         o Report compiled.
    Multi-variable LTSpice simulations complete.
         o Data exported.
         o Data analyzed.
    Load implementation with Technology Department.
    Multi-variable reports.

In Progress Tasks:
     Finding a way to supply a surge current of up to 20A.

To Be Completed Tasks:
     Single variable hardware verification.
     Multi-variable hardware verification.
     Prototype design and tested.
                                Team 44: Buck Converter Project
                                    Team Meeting Agenda
                                        April 5th, 2011


Old Business:
    Design board is finished

New Business:
   Need to simulate prototype and baseline (with short wires) in hardware.
   Assign design report components
                            Team 44: Buck Converter Project
                                  Team Meeting Agenda
                                      April 12th, 2011


Old Business:
    Subsystem reports are finished.

New Business:
   Need to create load schematic.
   Discuss design report formatting.
   Discuss cost and time implementation.
   Discuss user’s guide and technical manual.
                            Team 44: Buck Converter Project
                                  Team Meeting Agenda
                                      April 19th, 2011


Old Business:

New Business:
   Set up circuit for demonstrations.
   Need to re-solder and test baseline board.
   Gather data for summary section.
Recommendations to Future Engineers
    Be organized and prioritize the most difficult tasks early.
       Divide research based on each team member’s interests or knowledge first.
       Ask management questions about any concerns with the design report.
       Seek advice from faculty, staff, and members of industry to aid in design
       Keep notebooks and action item lists updated.
       Be prepared for management meetings by having an agenda with a list of questions.
       Design reviews should be planned for in advance.
       While work may be done on an individual basis it is important to set aside time to meet
        as a team to assist with any issues and discuss progress.


What We Learned

       How to manage time and scheduling with a team.
       How to communicate effectively in order to reach consensus.
       Parameters that affect efficiency of power electronics components.
       How to optimize a power electronics design.
       How to utilize LTSpice.
       How to utilize MATLAB to determine efficiency and response time in conjunction with
        LTSpice.
       How to set up hardware experiment.
       How to use all the test equipment such power supplies, oscilloscope and multi-meter.
       How to create load using heat sinkable resistors.
       Managing teamwork for multi-variable simulation.
       How to write design report effectively.
       Trouble shooting of hardware simulation.

				
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