DAAD by wuyunyi

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									DAAD                Deutscher Akademischer Austausch Dienst
                    German Academic Exchange Service




      Please, send your registration until 25th April 2011 to the following address:

                             E-mail: kirai@daadafrica.org & cosam@iucea.org


                           HiQAM I - EDULINK - QAC AGM 0
                                         23rd – 27th May 2011,
                                 Kenya School of Monetary Studies, Nairobi


 Last Name:                                   __________________

 First Name:                                  __________________

 Address/Institution:                         ___________________________________________

                                              ___________________________________________

 Phone Number:                                ___________________________________________

 E-mail:                                      ___________________________________________

 I will attend the conference:                □Yes (from________ to__________)
                                              □ No

 I am coming from (location):                 ___________________________________________

 I need a flight:                             □ Yes
                                              □ No


 Terms and conditions
 Accommodation and meals will be covered by DAAD funds from 22 nd – 27th May 2011 only. I accept that
 in case of the extension of my stay all additional expenses have to be covered by my own funds.
 Any costs related to last minute changes of my flight booking or in case of cancellation cannot be covered
 by DAAD, unless for medical reasons (submission of medical certificate needed); otherwise it will at my
 own costs.
 Should I be unable to attend the workshop, or should there be any changes in my flight details I will inform
 Margaret Kirai (kirai@daadafrica.org) immediately.



 I hereby agree to the above terms and conditions.


 ____________________                                                            ________________ _____
     Date and place                                                                        Signature

								
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