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Special Offer - Avail 15% Discount on List Price ($3,500) - Memory Integrated Circuits (IC) Market to 2016 - Portable Gadgets Such as Smartphones, Tablet PCs and Ultrabooks to Boost Demand for Mobile Powered By Docstoc
					Memory Integrated Circuits (IC) Market to 2016
Portable Gadgets Such as Smartphones, Tablet PCs and Ultrabooks to Boost
Demand for Mobile DRAM and NAND Flash
GBI Research Report Guidance




                                              GBI Research Report Guidance
                                              ·     Chapter three provides an overview of memory ICs and different types of memory ICs.
                                              ·     Chapter four discusses the key end-applications of memory ICs.
                                              ·     Chapter five discuses the key technological developments in the memory ICs market.
                                              ·     Chapter six covers the key market drivers, restraints, challenges and future trends for the memory ICs
                                                    market.
                                              ·     Chapter seven provides a five force analysis of key memory ICs market – SRAM, DRAM and flash
                                                    memory. This chapter assesses the threat of new entrants, the bargaining power of suppliers, the
                                                    bargaining power of buyers, the availability of substitutes and the competitive rivalry prevailing in the
                                                    industry.
                                              ·     Chapter eight of the report provides memory ICs sales volumes and sales revenue, with forecast data
                                                    up to 2016.
                                              ·     Chapter nine analyses the memory ICs market based on key regions.
                                              ·     Chapter 10 discusses the key application markets of memory ICs.
                                              ·     Chapter 11 gives a memory ICs market analysis by key product types.
                                              ·     Chapter 12 discusses the DRAM market by key product types, regions and end application markets.
                                              ·     Chapter 13 discusses the flash memory market by key product types, regions and end application
                                                    markets.
                                              ·     Chapter 14 analyses the competitive landscape and the market share of key memory IC suppliers.
                                              ·     Chapter 15 provides company profiles for major companies.




  © GBI Research. This is a licensed product and is not to be photocopied                                                     GBISC030MR / Published AUG 2012
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Executive Summary




                                              Executive Summary
                                              Portable Gadgets Such as Smartphones, Tablet PCs and Ultra-thin PCs to Drive the Memory IC Market
                                              Increasing sales of smartphones, ultrabooks and tablet PCs will drive the global mobile memory market.
      The adoption of cloud                   These portable gadgets require high memory densities and so utilize NAND flash and mobile DRAM.
      computing services among                The figure below shows sales forecasts for smartphones and tablet PCs from 2011 to 2016.
      various enterprises and
      customers is leading to the               Smartphones and Tablet PCs, Global, Sales Volume, 2011 – 2016
      design and development of
      memory ICs suitable for                                                     1,400
      shared servers
                                                                                  1,200


                                                                                  1,000
                                                         Sales Volume (million)




                                                                                   800


                                                                                   600


                                                                                   400


                                                                                   200


                                                                                     0
                                                                                          2011   2012         2013           2014           2015          2016
                                                                                                                      Year
                                                                                                        Smartphones     Tablet PCs

                                                Source: GBI Research, based on primary research interviews with project managers and company presidents




                                              The power efficiency and performance that DRAM offers has encouraged its incorporation in these portable
                                              gadgets. NAND flash is used in Solid State Drives (SSDs) that are used in ultra-thin PCs. The performance
                                              capability of NAND also facilitates the convergence of multiple applications - voice, email, video, navigation
                                              and imaging into a single device. NAND flash, eMMC (embedded Multimedia Card) or electroStatic
                                              Discharge (eSD) NAND flash based storage chips are extremely durable and offer low-power consumption,
                                              small size and high data storage capacity with quick erase, read and write capabilities. They are used in
                                              these gadgets not only for storing songs, photos or videos but also to achieve high speed interfaces.
                                              Cloud Computing and Data Centers Spur the Growth of Memory ICs
                                              The adoption of cloud computing services among various enterprises and customers is leading to the design
                                              and development of memory ICs suitable for shared servers and storage devices in cloud computing and
                                              data centers. Samsung’s green DDR3 DRAM is one such example, which was developed to cater to the
                                              growing demand for efficient server and data centers. NAND flash increases the performance of the cloud
                                              computing infrastructure through high density and enables more applications per server. It reduces the cost
                                              of data center hardware and decreases latency for high response times.




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                                                                                                                                                                       Page 3
Executive Summary




                                              Bringing in Balance between DRAM Supply and Demand is a Challenge
                                              Large price cuts have been observed in the DRAM market for years. This downgrading price pressure has
                                              been attributed to the oversupply of DRAM memory in the market, which was itself caused by a reduction
                                              in demand for DRAM due to economic uncertainty and the development of new applications that require
                                              less DRAM. Price pressure caused the selling price of memory devices to dip below the production cost,
                                              preventing DRAM manufacturers from making profits. To avoid such situation in the coming years, stability
                                              must be brought in to the market by avoiding over supply of memory chips.
                                              Elpida filing for bankruptcy and being acquired by Micron created a positive trend in the DRAM market. The
                                              inventory levels are coming down, reducing the oversupply of DRAM chips, decreasing the price drops and
                                              thereby bringing in stability in the market. Using this trend as an opportunity, more efforts must be made
                                              by the manufacturers to strike a balance in the DRAM industry and maintain supply-demand equilibrium in
                                              the coming years.
                                              Lack of Strong SRAM Product Reduces the Opportunities for SRAM Market
                                              Unlike the Dynamic Random Access Memory (DRAM) or flash memory market where Double Data Rate
                                              (DDR) products and NAND flash products account for more than 90% of the overall memory market sales
                                              revenue, the Static Random Access Memory (SRAM) market does not have any strong product category to
                                              drive the market. SRAM is available in numerous configurations, such as asynchronous SRAM, DDR,
                                              synchronous burst SRAM, multiport SRAM, First-In, First-Out (FIFO) and pipelined SRAM amongst others. Of
                                              these product categories, only Quad Data Rate (QDR) and DDR SRAMs collectively possess a 40% market
                                              share in terms of sales revenue in 2010, and have a positive growth rate due to emerging networking
                                              applications. The rest of the product categories are either declining or cater to a small saturated market.
                                              The product life cycles of some of the asynchronous SRAMs are more than 10 years long and they have
                                              already entered a declining stage after reaching maturity long ago.




  © GBI Research. This is a licensed product and is not to be photocopied                                                  GBISC030MR / Published AUG 2012
                                                                                                                                                    Page 4
Table of Contents




                                              1         Table of Contents
                                              1   Table of Contents ........................................................................................................................................ 5
                                                  1.1      List of Tables .................................................................................................................................... 8
                                                  1.2      List of Figures................................................................................................................................. 10
                                              2   Introduction .............................................................................................................................................. 12
                                              3   Memory Integrated Circuit (IC) Market..................................................................................................... 13
                                                  3.1      Overview ....................................................................................................................................... 13
                                                  3.2      Definitions ..................................................................................................................................... 13
                                                      3.2.1      Memory IC ............................................................................................................................. 13
                                                      3.2.2      Static Random Access Memory (SRAM) ................................................................................ 13
                                                      3.2.3      Dynamic Random Access Memory (DRAM) ........................................................................... 14
                                                      3.2.4      First-In, First-Out (FIFO) and Last-In, First-Out (LIFO) SRAM ................................................. 15
                                                      3.2.5      Flash Memory and Electronically Erasable Programmable Read Only Memory (EEPROM) .. 15
                                                      3.2.6      Erasable Programmable Read Only Memory (EPROM) ......................................................... 15
                                                      3.2.7      Programmable Read-Only Memory (PROM) ......................................................................... 15
                                                      3.2.8      Mask Programmed ROM (MROM) ........................................................................................ 15
                                                      3.2.9      Memory Cards ....................................................................................................................... 15
                                                  3.3      Emerging Memory Chips ............................................................................................................... 16
                                                      3.3.1      DDR4 DRAM .......................................................................................................................... 16
                                                      3.3.2      Phase Change Memory (PRAM) ............................................................................................ 16
                                                      3.3.3      Ferroelectric RAM (FeRAM, F-RAM or FRAM) ....................................................................... 16
                                                      3.3.4      Magnetoresistive Random Access Memory (MRAM) ............................................................ 16
                                                      3.3.5      Resistive Random Access Memory (ReRAM) ......................................................................... 16
                                                  3.4      Comparison of Key Memory ICs by Key Features .......................................................................... 16
                                              4   Memory ICs, End-Applications .................................................................................................................. 17
                                                  4.1      SRAM, End-Applications ................................................................................................................ 17
                                                  4.2      Flash Memory, End-Applications ................................................................................................... 17
                                                  4.3      DRAM, End-Applications ............................................................................................................... 18
                                              5   Memory IC Market, Technological Developments .................................................................................... 19
                                                  5.1      Hybrid Memory Cube .................................................................................................................... 19
                                                      5.1.1      3D Stack Technique ............................................................................................................... 19
                                                      5.1.2      3D-IC Through Silicon Via (TSV) ............................................................................................. 19
                                                  5.2      High Density PRAM ........................................................................................................................ 19
                                              6   Memory IC Market, Industry Dynamics .................................................................................................... 20
                                                  6.1      Key Market Drivers ........................................................................................................................ 20
                                                      6.1.1      Smartphones and Tablet PCs Drive the Mobile Memory Market .......................................... 21
                                                      6.1.2      Ultrabooks to Increase the Consumption of Memory ICs in PC Segment .............................. 22
                                                      6.1.3      Increase in Demand for Memory Chips for Automobile Applications .................................... 22
                                                      6.1.4      Increasing Adoption of Cloud Computing and Data Centers Fuelling the Growth of Memory
                                                                 IC ........................................................................................................................................... 22
                                                  6.2      Key Market Restraints ................................................................................................................... 23
                                                      6.2.1      High R&D and Capital Expenditure Impede Technology Innovations .................................... 23
                                                  6.3      Key Market Challenges .................................................................................................................. 23
                                                      6.3.1      Bringing in Balance between DRAM Supply and Demand ..................................................... 23
                                                      6.3.2      Lack of Strong SRAM Product ................................................................................................ 23
                                                      6.3.3      Higher Density NAND Flash Chips.......................................................................................... 23
                                                      6.3.4      Natural Disasters Limit the Shipments of the Memory Chips ................................................ 24
                                                  6.4      Future Trends ................................................................................................................................ 24
                                                      6.4.1      Potential of ReRAM to Replace DRAM, Flash Memory and Hard Drives ............................... 24
                                                      6.4.2      MRAM May Replace DRAM and Flash Memory .................................................................... 24
                                                      6.4.3      FRAM - Embedded Memory Alternative for MCUs Application ............................................. 24


  © GBI Research. This is a licensed product and is not to be photocopied                                                                                           GBISC030MR / Published AUG 2012
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Table of Contents




                                              7    Global Memory IC Market- Five Force Analysis......................................................................................... 25
                                                   7.1      DRAM, Porter’s Five Forces Analysis ............................................................................................. 25
                                                   7.2      Flash Memory, Porter’s Five Forces Analysis ................................................................................. 26
                                                   7.3      SRAM, Porter’s Five Forces Analysis .............................................................................................. 26
                                              8    Global Memory IC Market Analysis and Forecasts .................................................................................... 28
                                                   8.1      Sales Revenue................................................................................................................................ 28
                                                   8.2      Sales Volume ................................................................................................................................. 30
                                              9    Memory IC Market Analysis by Geography ............................................................................................... 32
                                                   9.1      Memory IC Market Breakdown by Geography, 2011 .................................................................... 33
                                                   9.2      Americas ........................................................................................................................................ 34
                                                   9.3      EMEA ............................................................................................................................................. 37
                                                   9.4      APAC .............................................................................................................................................. 40
                                                   9.5      Japan ............................................................................................................................................. 43
                                              10   Memory IC Market Analysis by End-Application ....................................................................................... 46
                                                   10.1 Memory IC Market Breakdown by End-Application, 2011 ............................................................ 47
                                                   10.2 IT/Computers ................................................................................................................................ 48
                                                   10.3 Communications............................................................................................................................ 51
                                                   10.4 Consumer Electronics .................................................................................................................... 54
                                                   10.5 Industrial and Automotive............................................................................................................. 57
                                                   10.6 Other Applications......................................................................................................................... 60
                                              11   Memory IC Market Analysis by Product Types .......................................................................................... 63
                                                   11.1 Memory IC Market Breakdown by Product Types, 2011 ............................................................... 64
                                                   11.2 DRAM Market ................................................................................................................................ 65
                                                   11.3 Flash Memory Market ................................................................................................................... 68
                                                   11.4 SRAM Market ................................................................................................................................ 71
                                                   11.5 Other Memory Types .................................................................................................................... 74
                                              12   DRAM Market Analysis and Forecasts....................................................................................................... 77
                                                   12.1 DRAM Market Analysis by Product Types ..................................................................................... 77
                                                       12.1.1 DDR DRAM Market................................................................................................................ 78
                                                       12.1.2 DDR2 DRAM Market.............................................................................................................. 80
                                                       12.1.3 DDR3 DRAM Market.............................................................................................................. 82
                                                       12.1.4 DRR4 DRAM Market .............................................................................................................. 84
                                                       12.1.5 Other DRAMs Market ............................................................................................................ 86
                                                   12.2 DRAM Market Analysis by Geography ........................................................................................... 88
                                                       12.2.1 Americas................................................................................................................................ 89
                                                       12.2.2 EMEA ..................................................................................................................................... 91
                                                       12.2.3 APAC ...................................................................................................................................... 93
                                                       12.2.4 Japan ..................................................................................................................................... 95
                                                   12.3 DRAM Market Analysis by End-Application ................................................................................... 97
                                                       12.3.1 IT/Computers......................................................................................................................... 98
                                                       12.3.2 Communications.................................................................................................................. 100
                                                       12.3.3 Consumer Electronics .......................................................................................................... 102
                                                       12.3.4 Industrial and Auto .............................................................................................................. 104
                                                       12.3.5 Other Applications............................................................................................................... 106
                                              13   Flash Memory Market Analysis and Forecasts ........................................................................................ 108
                                                   13.1 Flash Market Analysis by Product Types ..................................................................................... 108
                                                       13.1.1 NAND Market, Global .......................................................................................................... 109
                                                       13.1.2 NAND Market Breakdown by Product Types, 2011 ............................................................. 111
                                                       13.1.3 NOR Market ........................................................................................................................ 113
                                                   13.2 Flash Market Analysis by Geography ........................................................................................... 115
                                                       13.2.1 Americas.............................................................................................................................. 116
                                                       13.2.2 EMEA ................................................................................................................................... 118


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                                                    13.2.3 APAC .................................................................................................................................... 120
                                                    13.2.4 Japan ................................................................................................................................... 122
                                                 13.3 Flash Market Analysis by End-Application ................................................................................... 124
                                                    13.3.1 IT/Computers....................................................................................................................... 125
                                                    13.3.2 Communications.................................................................................................................. 127
                                                    13.3.3 Consumer Electronics .......................................................................................................... 129
                                                    13.3.4 Industrial and Auto .............................................................................................................. 131
                                                    13.3.5 Others Applications ............................................................................................................. 133
                                              14 Memory IC Market, Key Suppliers ........................................................................................................... 135
                                                 14.1 Memory IC Market - Competitive Landscape .............................................................................. 135
                                                 14.2 Memory ICs, Market Share .......................................................................................................... 136
                                                    14.2.1 DRAM .................................................................................................................................. 136
                                                    14.2.2 Flash Memory ...................................................................................................................... 137
                                                    14.2.3 SRAM ................................................................................................................................... 138
                                              15 Memory IC Market, Key Company Profiles ............................................................................................. 139
                                                 15.1 Samsung Electronics .................................................................................................................... 139
                                                    15.1.1 Samsung Electronics – Business Description ....................................................................... 139
                                                    15.1.2 Samsung Electronics – Key Memory Products ..................................................................... 140
                                                    15.1.3 Samsung Electronics – SWOT .............................................................................................. 140
                                                    15.1.4 Samsung Electronics – Latest Developments....................................................................... 142
                                                    15.1.5 Samsung Electronics – Mergers and Acquisitions................................................................ 142
                                                 15.2 SK Hynix Inc ................................................................................................................................. 142
                                                    15.2.1 SK Hynix Inc – Business Description ..................................................................................... 143
                                                    15.2.2 SK Hynix Inc – Key Products ................................................................................................. 143
                                                    15.2.3 SK Hynix Inc – SWOT............................................................................................................ 144
                                                    15.2.4 SK Hynix Inc – Latest Developments .................................................................................... 145
                                                 15.3 Toshiba Corporation .................................................................................................................... 145
                                                    15.3.1 Toshiba Corporation – Business Description........................................................................ 146
                                                    15.3.2 Toshiba Corporation – Key Memory Products ..................................................................... 147
                                                    15.3.3 Toshiba Corporation – SWOT .............................................................................................. 147
                                                    15.3.4 Toshiba Corporation – Latest Developments....................................................................... 149
                                                    15.3.5 Toshiba Corporation – Mergers and Acquisitions................................................................ 149
                                                 15.4 Micron Technology, Inc ............................................................................................................... 150
                                                    15.4.1 Micron Technology, Inc – Business Description ................................................................... 150
                                                    15.4.2 Micron Technology, Inc – Key Products ............................................................................... 151
                                                    15.4.3 Micron Technology, Inc – SWOT .......................................................................................... 151
                                                    15.4.4 Micron Technology, Inc – Latest Developments .................................................................. 152
                                                    15.4.5 Micron Technology, Inc – Mergers and Acquisitions ........................................................... 153
                                                 15.5 Cypress Semiconductor Corporation ........................................................................................... 153
                                                    15.5.1 Cypress Semiconductor Corp – Business Description ........................................................... 153
                                                    15.5.2 Cypress Semiconductor Corp – Key Memory Products ........................................................ 154
                                                    15.5.3 Cypress Semiconductor Corp – SWOT.................................................................................. 154
                                                    15.5.4 Cypress Semiconductor Corp – Latest Developments .......................................................... 155
                                                 15.6 Nanya Technology Corporation ................................................................................................... 156
                                                    15.6.1 Nanya Technology Corporation – Business Description ...................................................... 156
                                                    15.6.2 Nanya Technology Corporation – Key Products .................................................................. 156
                                                    15.6.3 Nanya Technology Corporation – SWOT ............................................................................. 157
                                                    15.6.4 Nanya Technology Corporation – Latest Developments...................................................... 158
                                              16 Appendix ................................................................................................................................................. 159
                                                 16.1 About GBI Research ..................................................................................................................... 159
                                                 16.2 Glossary of Terms ........................................................................................................................ 159
                                                 16.3 Bibliography ................................................................................................................................ 160


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Table of Contents




                                                  16.4 Methodology ............................................................................................................................... 160
                                                     16.4.1 Market Size Estimates ......................................................................................................... 160
                                                     16.4.2 Market Size Forecasts.......................................................................................................... 161
                                                     16.4.3 Geographies Discussed ........................................................................................................ 161
                                                     16.4.4 Coverage ............................................................................................................................. 161
                                                     16.4.5 Secondary Research ............................................................................................................ 161
                                                     16.4.6 Primary Research ................................................................................................................ 161
                                                     16.4.7 Expert Panel Validation ....................................................................................................... 162
                                                  16.5 Contact Us ................................................................................................................................... 162
                                                  16.6 Disclaimer .................................................................................................................................... 162


                                              1.1       List of Tables
                                              Table 1:        Comparison of Key Memory ICs by Key Features ......................................................................... 16
                                              Table 2:        SRAMs End- Applications .............................................................................................................. 17
                                              Table 3:        Flash Memory End-Applications ................................................................................................... 17
                                              Table 4:        DRAMs End-Applications .............................................................................................................. 18
                                              Table 5:        Porter’s Five Forces Analysis, DRAM ............................................................................................ 25
                                              Table 6:        Porter’s Five Forces Analysis, Flash Memory ................................................................................ 26
                                              Table 7:        Porter’s Five Forces Analysis, SRAM ............................................................................................. 26
                                              Table 8:        Memory ICs, Global, Sales Revenue ($bn), 2004–2016 ................................................................ 29
                                              Table 9:        Memory ICs, Global, Sales Volume (billion), 2004–2016 .............................................................. 31
                                              Table 10:       Memory IC Market Breakdown by Geography (%), 2011 ............................................................. 33
                                              Table 11:       Memory ICs, Americas, Sales Revenue ($bn) and Sales Volume (billion), 2004–2016 ................. 36
                                              Table 12:       Memory ICs, EMEA
				
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Description: The report provides key information and analysis on the market opportunities in the memory IC industry. The report covers industry dynamics, information on the sales revenue and sales volume of the memory ICs, and the key suppliers. The report also provides product type-based, region-based and end-application based forecasts up to 2016, as well as forecasts for the overall DRAM, SRAM and flash memory markets. The markets for memory ICs in IT/computers, communications, consumer electronics, industrial and automobiles applications are also discussed. The increasing application of memory ICs in portable gadgets such as smartphones, tablets and ultrabooks is expected to boost the market. The emerging areas of application of memory ICs are in the medical and automobile sectors.
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