Defect Reduction Technology Program by KOudP8X

VIEWS: 5 PAGES: 9

									ITRS – Yield Enhancement ITWG

    Meeting in Bonn/Königswinter
           April 3-4, 2008



    D. Patel, Dilip.Patel@ismi.sematech.org
     I. Thurner, ines.thurner@qimonda.com
  A. Nutsch, andreas.nutsch@iisb.fraunhofer.de



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Spring 2008 YE ITWG Participants

 • 12 Participants (Europe, Japan, USA, …)
    –   Dilip Patel (Intel / ISMI) – Co-chair
    –   Ines Thurner (Qimonda) - DDC
    –   Andreas Nutsch (Fraunhofer IISB) - DDC
    –   Michael Otto (Fraunhofer IISB) - WECC
    –   Andreas Neuber (AMAT) – WECC
    –   Sumio Kuwabara (NEC) – DDC
    –   Dave Roberts (Air Products) - WECC
    –   Chris Muller (Purafil) – WECC
    –   Dieter Rathei (DR YIELD) – DDC, YL
    –   Wolfgang Sievert (Honeywell) – WECC
    –   Hubert Winzig (Infineon) – WECC
    –   Jochen Ruth (PALL) - WECC




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Organization of the Chapter 2008
 • Chair: Lothar Pfitzner (Fraunhofer IISB)
   Co-Chair: Dilip Patel (Intel assignee to SEMATECH)

 • Difficult Challenges
           • Table YE 2
 • Technology Requirements and Potential Solutions
     - Yield Model and Defect Budget (YMDB)
           • Chair: Sumio Kuwabara (NEC) - Japan
           • Table YE 3, YE 4, YE 5,
     - Defect Detection and Characterization (DDC)
           • Chair: Ines Thurner (Qimonda) - Europe
           • Table YE 6, YE 7, YE 8
     - Wafer Environment Contamination Control (WECC)
           • Chair: Kevin Pate (Intel) - USA
           • Table YE 9
 - Yield Learning (YL – not active)
           • Chair: Tings Wang (Promos) - Taiwan

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Update: 2008 Key Challenges
 • Near Term (>22 nm)
     – Detection of Multiple Killer Defect Types / Signal to Noise –
       Detection of multiple killer defect types and their simultaneous differentiation at
       high capture rates, low cost of ownership and throughput. It is a challenge to
       find small but yield relevant defects under a vast amount of nuisance and false
       defects.
     – (Delete: High-Aspect-Ratio) 3D Inspection – (high aspect ratio,
       voids, embedded defects, non surface defects) The need for high-speed
       and cost-effective high aspect ratio inspection tools remains as the work around
       using e-beam inspection does not at all meet requirement for throughput and
       low cost.
     – Process Stability vs. Absolute Contamination Level Including the
       Correlation to Yield Test structures, methods an, data are needed for
       correlating process fluid contamination types and levels to yield and determine
       required control limits.
     – Delete in near term and combine with non-visual defects- Linking
       Systematic yield loss to layout attributes —The irregularity of features
       makes logic areas very sensitive to systematic yield loss mechanisms such as
       patterning marginalities across the lithographic process window.
     – Wafer bevel-Edge (delete: Control, Inspection and) Engineering &
       Review – Defects and process problems around wafer edge and wafer bevel
       are identified to cause yield problems.
                                                      DRAFT - NOT FOR PUBLICATION Bonn/Königswinter April 3-4,2008   4
Update: 2008 Key Challenges
 • Long Term (<22 nm)
    – Non Visual defects and process variations (new): Increasing
      Yield Loss due to non visual defects and process variations requires
      new methodologies of diagnosis and control
    – In - line Defect Characterization and Analysis – Alternatives to
      Energy Dispersive X-ray (EDX) analysis systems are required for in-
      line defect characterization and analysis for defects smaller 100nm.
      The focus is on light elements, small amount of samples due to particle
      size following the miniaturization, and microanalysis as an alternative
      to EDX analysis systems.
      New: Data volume + quality: strong increase of data volume due to
      miniaturization
    – Development of model-based design-manufacturing
      interface — Due to Optical Proximity Correction (OPC) and the high
      complexity of integration, the models must comprehend greater
      parametric sensitivities, ultra-thin film integrity, impact of circuit design,
      greater transistor packing, etc.



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Topics of Cross TWG Meeting 2008
 • Defect detection and characterization (DDC) alignment
   with Litho, FEP requirements

 • Test cross TWG: Challenge in identification and yield
   impact of systematic non visual defects

 • Evaluate the need of flatness and Nano-topography
   inspection




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Outlook: Topics for 2009 revision
 • Change of DB and YM:
     – New proposal for a outline of the YM and DB subchapter
     – input from IDM and IRC required

 • New sub-chapter: Proposal for Roadmap of systematic
   Yield Loss Issues
     – preparation of the proposal 2008 / 2009
     – outline of a subchapter:
         • Definitions
         • Tables showing a roadmap for
            – Roadmap for needed methodology and diagnostic systems
            – Identification of non visual defects and process variations
         • Key Challenge and Potential solutions
            – Definition and wording for 2008 update (!)
            – Wording and outline potential solutions




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Outlook: Topics for 2009 revision
 • Focus items WECC (UPW, Chem, Gas, AMC)
    – Particles: Measurement, composition, critical size
      and deposition model
    – Organics: Measurement, composition, Identify yield
      correlation, deposition model
    – Ions and chemical contamination: Deposition model
    – CVD/ALD precursor contamination control
      requirements
    – AMC integrated control concept, metrology
      requirements




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2008 YE ITWG Contributors
Europe                                                                                             United States (cont.)
         Ines Thurner (DDC; Qimonda)                Taiwan
                                                             Tings Wang (YL; Promos)                          Dave Roberts (WECC; Air Products)
         Lothar Pfitzner (Chair; Fraunhofer IISB)                                                             David Blackford (WECC, FMT)
         Andreas Nutsch (DDC; Fraunhofer IISB)               CS Yang (Winbond)
                                                             CH Chang (; SIS)                                 Diane Dougherty (WECC;)
         Andreas Neuber (WECC; AMAT)                                                                          Dimitry Znamensky (WECC;)
         Benoit Hirschberger (DDC; ST)                       ChanYuan Chen (; TSMC)
                                                             CS Yang (; Winbond)                              Drew Sinha (WECC, SUMCO)
         Dieter Rathei (DDC/YMDB; DR Yield)                                                                   Ed Terrell (WECC; PMS)
         Francois Finck (DDC/YMDB; ST)                       Jim Huang (; UMC)
                                                             Jimmy Tseng (; PSC )                             Frank Flowers (WECC; FMC)
         Christoph Hocke (WECC; Infineon)                                                                     James McAndrew (WECC; AirLiquide)
         Francesca Illuzzi (WECC; ST)                        Len Mei (; Promos Tech )
                                                             Steven Ma (; Mxic )                              Janice Edler (WECC, IBM)
         Hubert Winzig (WECC; Infineon)                                                                       Jeff Chapman (WECC; IBM)
         Michael Lurie (WECC; Tower)                                                                          Jeffrey Hanson (WECC; TI)


Japan
         Michael Otto (WECC; Fraunhofer IISB)
                                                         Thank you                                            Jian Wei (WECC; Mykrolis)
                                                                                                              Jill Card (, Exponent)
                                                                                                              John Degenova (WECC; TI)
         Yoshinori Nagatsuka (DDC; SEIKO-EPSON)
         Koichi Sakurai (DDC/YMDB; Renesas)
         Kazuo Nishihagi (WECC; Technos)
                                                         very much!                                           John Kurowski (WECC; IBM)
                                                                                                              Jonathan M. Myers (WECC, IBM)
                                                                                                              Joseph O’Sullivan (WECC; Intel)
         Ken Tsugane (WECC; Hitachi)                United States                                             Keith Kerwin (WECC; TI)
         Masahiko Ikeno (DB&YM; Hitachi HT)                  Dilip Patel (Co-chair, DDC, Sematech)
                                                                                                              Kosei Matsumoto (WECC, Kurita)
         Sumio Kuwabara (DB&YM; NEC EL)                      Kevin Pate (WECC, Intel)
                                                                                                              Larry Rabellino (WECC, SAES)
         Yoko Miyazaki (DDC; Accretech )                     J. Ritchison (DDC; TI)
                                                                                                              Luke Lovejoy (WECC; Freescale)
         Yoshimi Shiramizu (WECC; NEC EL)                    James Dougan (DDC; Freescale)
                                                                                                              Mark Camenzind (WECC; Air Liquide )
         Ryu Shioda (YL, Agilent)                            Allyson Hartzell (WECC; Exponent)
                                                                                                              Mark Crockett (WECC; Applied Materials )
         Katsunobu Kitami (WECC, Kurita)                     Aaron Shupp (WECC, PMS)
                                                                                                              Rajat Agrawal (WECC;)
         Takahiko Hashidzume (DDC, Panasonic)                Andrew Bomber (WECC, Intel)
                                                                                                              Rick Udischas (WECC; Ais Liquide)
         Takashi Futatsugi (WECC; Organo)                    Barry Gotlinsky (WECC; Pall)
                                                                                                              Rob Henderson (WECC; YieldService)
         N.N. (update will follow)                           Bart Tillotson (WECC; Fujifilm Electronic
                                                                                                              Biswanath Roy (WECC; Pall)
                                                                    Materials)
                                                                                                              Sarah Schoen (WECC; Air Liquide )
Korea                                                        Billy Jones (WECC; Qimonda)
                                                                                                              Slava Libman (WECC; Intel)
                                                             Bob Latimer (WECC; )
         Uri Cho (; Samsung)                                                                                  Scott Anderson (WECC; Air Liquide )
                                                             Chris Long (WECC; IBM)
         Hyun Chul Baek (; Hynix)                                                                             Scott Covington (WECC, Purita)
                                                             Chris Muller (WECC; Purafil)
         Sang KyuPark (; Magna Chip)                                                                          Stephen Toebes (WECC; Brooks)
                                                             Dan Rodier (WECC; PMS)
                                                                                                              Steve Hues (WECC; Micron Technology)
                                                             Dan Fuchs (WECC, BOCE)
                                                                                                              Terry Stange (WECC; Hach Ultra)
                                                             Dan Wilcox (WECC; Spansion)
                                                                                                              Tony Schleisman (WECC; Air Liquide )
                                                                                                              Tracey Boswell (WECC; Sematech)
                                                                                                              Val Stradzs (WECC; Intel)
                                                                                                              William Moore (WECC; IBM)
                                                                                                              James S. Clarke (DDC; Intel)
                                                                                                              Kevin Sequin (WECC; Donaldson)



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