An Intelligent Infrastructure Management solution comprising

							AMPTRAC CMS Technical Specifications


An Intelligent Infrastructure Management solution comprising hardware and software
shall be proposed for “Your Organization”.

The proposed “Intelligent Infrastructure Management” solution shall be very flexible and
scalable in design and implementation, allowing for use in office buildings, data centers
and remote/branch offices. The solution shall be able to accommodate any network
infrastructure including those with single and multiple floors and multi-building campus
network as well as remote branch offices designs. There shall be no limit in number of
ports/drops which can be monitored.

The proposed “Intelligent Infrastructure Management” solution shall accommodate new
or existing cabling systems. It shall functions with network equipment and patch panels
in an interconnect design or between patch panels in a cross-connect design. The network
equipment and panels shall incorporate or are retrofitted with sensor pads for each RJ45
or fiber port.

In basic terms, the system shall monitor the circuit connection between two patch panels
in a cross connect configuration or, between a patch panel and network switch in a inter-
connect configuration, for each cable drop in the network, determined by the AMPTRAC
patch cord’s connection to the sensor pads.

The Intelligent Infrastructure Management solution shall be able to explore, discover
monitor, and map the connectivity of the customer network infrastructure. It shall also
simplify the process of all future moves, adds and changes (MACs) of end-users
connectivity. The software shall allow simultaneous access by a spectrum of department
representatives.

The proposed solution shall be able to support the following features:
 Real-Time Monitoring – automates the process of discovering, documenting,
   monitoring, and managing the physical network’s connections and its devices.
 Automatically Updates the Database – reports authorized or unauthorized changes in
   real time.
 Self-Discover Patching – discovers all AMPTRAC enabled port connectivity.
 Event Logs – whenever the system detects a connectivity change, it automatically
   creates an entry in an internal comprehensive log.
 Automated Work Order Process
    The IIM software provides a greatly automated work order system, to be shared
       between the Help Desk, Network/Telecom managers and technicians.
    Each user works from a simple user interface, unique to their task. Access rights
       and privileges are determined by the administrator.
    Authorized users select proposed moves of workstations, phones, printers or other
       equipment. Moves can be performed singly or in bulk, as in departmental
       relocation.



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       The system automatically generates auto-routing, and a step-by-step work order
        and schedule, which can be accepted or revised by the user. Tasks can be divided
        and distributed between various administrators and technicians via email.
     Work orders can include system diagrams and floor plans. When a work order is
        completed for an AMPTRAC monitored port, the system record instantly updates,
        ensuring accurate information.
     For unmonitored ports, a simple verification by technical staff/management
        ensures that the work flow automatically updates the IIM database.
     The system can also generate comprehensive reports containing all work order
        details such as the author, status, creation and scheduled dates, and notes.
   Tablet PC – utilizing Remote Desktop or Terminal Services Advanced Client
    (TSAC), one can use a Windows Tablet PC to setup AMPTRAC enabled equipment;
    or to query the database in real time. One can also map ports, remotely create and
    delete database items, conduct circuit traces of individual ports, and perform
    diagnostic tests on specific ports. All other AMPTRAC IIM functions are also
    accessible.
   Automatic Re-Synchronization – if a network outage should occur, the AMPTRAC
    IIM database automatically re-synchronizes upon the restoration of power, showing
    network asset connectivity changes.
   Security Features – AMPTRAC system distinguishes unauthorized changes from
    authorized ones.
   Virtual Machine (VM) management – identifies, tracks, and documents the logical
    configuration of VMs
   Open Database Connectivity (ODBC). – enables read-only integration of the
    AMPTRAC database with 3rd party software solutions


Intelligent Ready Patch Panels for Unshielded and Shielded Twisted Pair
     The patch panel shall be made from black powder-coated steel, AMPTRAC
        design and accommodate 4 pieces of front loadable jack-housing modules per 1U
        height.
     The front of the jack-housing shall feature numeric labeling above each port and
        provide additional labeling area at the top of the housing.
     The jack-housing module shall be polyphenylene oxide, 94V-0 rated. It shall
        accommodate 6 individual pieces of Slim Line design standard compliant jacks.
     The jack-housing module shall incorporate solid contacts sensor pad (pin contact
        area) for enhanced durability and reliability.
     The sensor pad shall be constructed from phosphor bronze, 8mm by 3mm wide
        and gold plated.
     Connections shall be made to the sensor pads via 110 IDC punch down or 110
        plug & play connector at the rear of panel.
     The jack housing module for shielded solution shall incorporate metallic
        grounding contact at the rear pocket of the housing for bonding shielded jacks to
        the telecommunication grounding system.


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        The jack contacts shall be made from beryllium copper, plated with 1.27 mm
         thick gold in localized area and 3.81 mm minimum thick tin-lead in solder area
         over 1.27 mm minimum thick nickel underplate.
        The jack shall have durability of 750 mating cycles and the rear 110 block 200
         termination cycles.
        RJ45 jacks performance shall be verified by independent third part laboratory for
         conformance.
        Individual jack must also support a cable strain relief for cable retention and
         enhanced performance.
        Panel shall be designed to maintain continuity of the connector pin and contact
         point under vertical and horizontal loading of the AMPTRAC patch cord.
        Panel shall be standard flush versions or angled versions for improved cable and
         space management.


Intelligent Ready Patch Panels for Shielded Twisted Pair
     The front of the patch panel shall be standard flush and incorporate solid contacts
        sensor pad (pin contact area) for enhanced durability and reliability.
     The sensor pad shall be constructed from phosphor bronze, 10mm by 6mm wide
        and gold plated.
     The front of the patch panel shall feature numeric labeling below each port and
        additional labeling area at the top.
     The patch panel shall support up to 24 jacks and an I/O connector cassette in a 1U
        height.
     Connections shall be made to the sensor pads via the cassette with IO cable
        featuring AMPLIMITE HD-22 connector for front connection or AMPMODU
        connector for rear connection.
     The jack contacts shall be made from beryllium copper, plated with 1.27 mm
        thick gold in localized area and 3.81 mm minimum thick tin-lead in solder area
        over 1.27 mm minimum thick nickel underplate.
     The jack shall have durability of 750 mating cycles and the rear 110 block 200
        termination cycles.
     RJ45 jacks performance shall be verified by independent third part laboratory for
        conformance.
     The rear of the patch panel shall incorporate rear cable management support for
        cable strain relief and retention as well as enhanced performance.
     Panel shall be designed to maintain continuity of the connector pin and contact
        point under vertical and horizontal loading of the AMPTRAC patch cord.


Intelligent Ready Patch Cable
     The patch cable assemblies shall be AMPTRAC designed using Cat6 component
        compliant modular plugs, wired to the T568B wiring pattern.
     The plug housing shall be made from clear polycarbonate.




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        The plug terminals shall be made from phosphor bronze with 50 micron gold
         plating on selected area, gold flash over the remainder, over 100 micron nickel
         under-plate.
        The wire conductors shall be 24 AWG stranded copper.
        The cable assemblies shall use the “ninth” wire outside the inner jacket connected
         to a probe pin on each end of the molded plug housing to enable the AMPTRAC
         connectivity management system.
        The probe pin shall be made from phosphor bronze with 30-micron gold plating at
         the pin tip.
        The probe design shall be off-center to accommodate stacked-jack LAN switch
         configurations.
        The strain relief boot shall feature a reverse latch release design.
        The AMPTRAC patch cable assemblies shall be delivered with a protective cap
         installed in the factory prior to packaging.


Intelligent Ready Patch Panels for Optical Fiber
     The patch panel shall be standard flush and made from black powder-coated steel,
        AMPTRAC design and accommodate 4 pieces of front loadable jack-housing
        modules per 1U height.
     The jack-housing module shall be polyphenylene oxide, 94V-0 rated. It shall
        accommodate 6 individual pieces of MTRJ or LC duplex multi-mode or single-
        mode fiber connectors.
     Individual connector must support a cable strain relief for cable retention and
        enhanced performance.
     The jack-housing module shall incorporate solid contacts sensor pad (pin contact
        area) for enhanced durability and reliability.
     The front of the jack-housing shall feature numeric labeling above each port and
        provide additional labeling area at the top of the housing.
     The sensor pad shall be constructed from phosphor bronze, 8mm by 3mm wide
        and gold plated.
     Connections shall be made to the sensor pads via 110 IDC punch down or 110
        plug & play adaptor in the rear of panel.
     Individual jack must also support a cable strain relief for cable retention and
        enhanced performance.
     Panel shall be designed to maintain continuity of the connector pin and contact
        point under vertical and horizontal loading of the AMPTRAC patch cord.


Intelligent Ready Patch Panels for SC Optical Fiber
     The patch panel shall be Tyco design and accommodate 4 pieces of front loadable
        AMPTRAC ready SC duplex adapters per 2U height.
     Each AMPTRAC ready SC duplex adapters shall accommodate 6 individual
        pieces of SC duplex multi-mode or single-mode fiber connectors.



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        The AMPTRAC ready SC adapter plate shall incorporate the sensor pad (pin
         contact area) for the AMPTRAC patch cable to be used.
        Connections shall be made to the sensor pads via IO cable attached to the front of
         the adapter plate.
        Panel shall be designed to maintain continuity of the connector pin and contact
         point under vertical and horizontal loading of the AMPTRAC patch cord.


Intelligent Ready Fiber Patch Cable
     The intelligent ready fiber optical cable assemblies shall be AMPTRAC design
        and industry standard compliant.
     Intelligent ready fiber optical cable assemblies shall be available for different
        types of optical fiber and connector combinations.
     Each combination shall be available in multiple different standard lengths.
     The intelligent ready fiber optical cable assemblies shall incorporate a copper
        conductor that is connected to an external probe attached to the fiber connectors.
     The cable shall be a mini-tri-zip design for flexibility and small size.



Sensor Strips
    The sensor Strips shall be flex or PCB type construction.
    The PCB sensor strip shall be equipped with a 2.0mm MODU.
    Sensor pads shall be gold plated.
    Adhesive on strip shall be minimum industrial strength level 3.
    The backing strip added to the sensor strip shall be the correct thickness to
       maintain contact with the connector pin of the AMPTRAC ready patch cord.
    To ensure good contact between the sensor pad on the strip and the sensor pin on
       the connector, the distance between the edge of the connector boot and the surface
       of the sensor pad should be less than 2mm and not to exceed 2.5mm.
    The sensor strip and backing shall be designed to maintain continuity of the
       connector pin and sensor strip pad under vertical and horizontal loading of the
       AMPTRAC patch cord.


Input/Output Cables
    I/O cables shall provide the connection from the Sensor pads to the Analyzer IO
       ports via DB-25 connectors. Various versions of I/O cable shall be available:
        Analyzer to IDC 110 Punch down – (used with AMPTRAC Patch Panel)
        Analyzer to IDC 110 Plug & Play connector – (used with AMPTRAC Patch
           Panel)
        Analyzer to HD-22 connector – (used with AMPTRAC Patch Panel)
        Analyzer to 2.0mm MODU connector – (used with PCB style sensor strips)
        Analyzer to 6 position, RJ-11 modular plug – (used with fan-out cassettes)
        Analyzer to 6 position, 2.54mm MTE connector – (Duplex SC adapter plates)
    All I/O cable shall be factory terminated.


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        All I/O cable shall come with molded boots at the analyzer connector end.
        All 24 conductor I/O cable shall come with molded boots at both connector ends.
        The I/O cables shall be CM rated and listed.
        The I/O cables shall be available in various standard lengths.


Monitoring Analyzer
   The proposed “Intelligent Infrastructure Management” solution shall be extremely
      flexible and scalable in design.
   The analyzer design shall be universal design and can be configured as a master
      or slave unit.
   Any analyzer shall be able to connect directly to the network or cascaded via
      another analyzer for communication to the database server.
   The different models of analyzer available shall include the following:
       Analyzer with LCD Panel (336-Ports version)
       Analyzer with LCD Panel (168-Ports version)
   The LCD Panel on the analyzer shall feature a 4 line graphical LCD display
      providing interactive communications with the database.
   The analyzer shall incorporate a speaker that will emit different tone for different
      alert purposes.
   The analyzer shall incorporate a USB port on the front to support connection of
      PDA, electronics tablet or computer.
   The analyzer shall incorporate three RJ-45 Ethernet switch ports (1 in front, 2 in
      the rear). The three Ethernet ports shall be 10/100Mbps, MDI/MDX, Half/Full
      Duplex auto-negotiable.
   The analyzer shall incorporate secured, keyed and reliable DB25 connection for
      I/O cables at the rear.
   The analyzer shall have a depth of no more than 160mm and is suitable for
      mounting in a 19’ rack or cabinet.
   The analyzer shall generate little heat so as not cause concern over heat
      management in rack or cabinet.
   The analyzer shall provide Work Order information on the graphical LCD screen.
      Technicians shall be able to login into the analyzer and view work actions
      assigned to them.




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