CSCE 932, Spring 2007 Fault Tolerance: Testing and Testable Design - PowerPoint
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CSCE 932, Spring 2009
Syllabus
1
Contact Information
My web page: cse.unl.edu/~seth
AvH 359, seth@cse.unl.edu, 472-5003
Office Hours: Flexible
2
Required Background
Logic design, Boolean algebra
Basic math background: probability
theory, discrete math
CSE courses: Computer architecture,
perhaps OS
3
Sources of Information
Listed on a separate sheet.
4
Course Format
Part 1: Background in VLSI testing:
Lectures by me + class discussion
Knowledge tested by HW assignments
Part 2: Advance topics
Lectures by every one + class discussion
Graded on technical and presentation qualities
Part 3: Semester project:
Identification (Preproposal – 2-3 pages)
Full proposal (8-10 single-spaced pages + oral presentation)
Literature review, problem formulation, solution and evaluation plan,
expected outcomes
Final Report (c. 25 double-spaced pages + oral
presentation)
5
Grading
Homework 40%
Topical Presentations 25%
Project
Proposal & Presentation 15%
Final Report & Presentation 20%
Percentage vs letter grade:
6
Course Overview
7
Outline
Fault Tolerance
Technological Context
Course Topics and Organization
8
Fault Tolerance
Ability of a system to function in the event of
a failure
Sources of Failure
Permanent (hard) component failures causing
system malfunction
Transient failures due to internal or external
causes
Unreliable components
Buggy software
Radiation, Noise, Crosstalk
...
9
Fault Tolerance Methods
Redundancy Techniques
Component (HW or SW) Level
Information Level
Frequent Testing and Possible Repair
Online testing
Offline testing
This course will focus on fault
tolerance through testing of digital
components
10
Types of Testing
During Design & Manufacturing
Design Verification (Validation)
Process Characterization
Silicon Debug
Production (Go/No-Go)
Beyond Manufacturing
Acceptance
Power-on
Field test and repair
We will focus on design & manufacturing
testing
11
Technological Context
12
Trends of Interest to Us
Embedded systems and chip or core
multiprocessors (CMPs)
Importance of low power in high-
volume and high-performance devices
and systems
Feature Size Reduction
Design productivity and time-to-market
Wiring delays dominate gate delays
13
Prevalance of Mobile Devices
Cell phones sales exceeded
PCs by only a factor of 1.4 in
1997, but the ratio grew to
4.5 in 2007.
In 2004, there were
approximately one PC, 2.2
cell phones, and 2.5
televisions for every eight
people on the planet
14
Power Trends
In CMOS IC technology
Power Capacitive load Voltage 2 Frequency
15
The Power Wall
We can’t reduce voltage further
We can’t remove more heat
Hence the move to chip multiprocessors (CMPs)
Constrained by power, instruction-level parallelism, memory latency
16
IC Types and Requirements Determined
by Portable/Consumer Market
Three major types (as identified by ITRS
2005)
SOC
Low-power paramount
Need SOC integration (DSP, MPU, I/O Cores, NoC, etc.)
Analog/Mixed Signal
Migrating on-chip for voice processing, A/D sampling,
and some RF transceiver functions
MPU
Specialized cores to optimize performance for low-power
use.
17
Course Topics and
Organization
Background in VLSI Testing (first part of the
course – by me)
Basics
Fault Modeling
Coverage Analysis
Test Generation
Design for Testability
Current topics (presentations and discussions
by all) (second half of the course)
Individual Research Projects (second half of
the course)
18
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