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Automated Flatness Inspection Akrometrix Surface Characterization Solutions and Competitive Analysis Presentation To Flextronics April 25, 2008 Automated Flatness Inspection Akrometrix Mission To deliver innovative flatness measurement software solutions, hardware, analysis capabilities and test services to the microelectronics industry supply chain... Automated Flatness Inspection Company Overview Akrometrix was founded in 1994 in Atlanta, Georgia, USA, based on applied research by Professor Charles Ume at the Georgia Institute of Technology. Innovation Milestones: • 1994 – Started delivering test services • 1997 – Introduced the TherMoiré PS88 • 2000 – Introduced the LineMoiré PS16 • 2003 – Introduced the TherMoiré PS400 • 2004 – Introduced the Convective Module • 2005 – Introduced the PS600 and next generation PS200 • 2006 – Introduced the J5000, CoolBoost Module • 2007 – Introduced the LineMoiré PS16M, XL , DIC Module and MP10 Module • 2008 – Worldwide sales, service and support in the Americas, APAC and EMEA Akrometrix has over 170 installations worldwide, as well as local China service/support. 95% of the top 20 OEMs in the world have Akrometrix equipment. Automated Flatness Inspection Value Proposition Akrometrix provides the microelectronics industry with unique and enabling metrology solutions to address yield loss and reliability related field failures… Akrometrix Flatness Characterization techniques can identify and reduce common flatness related defects such as: • Solder joint opens, bridges, cracking • Package delamination • Silicon chip cracking • Solder paste misprints • Component placement errors Automated Flatness Inspection Core Competencies • Modular Metrology • Advanced Thermal Profiling • Application Specific Analysis Algorithms • Comprehensive Data Management • Global Service and Support Automated Flatness Inspection Applications • Research and Development – Prototyping • Performance Validation – Stress and strain • Reliability Modeling • Product Development – NPI line • Manufacturing QA/QC – Defect/failure analysis • Manufacturing Process Optimization – New materials Automated Flatness Inspection Modular Metrology Platform: HHCM DIC - Shadow Moiré - Convective Module (HHCM) TherMoiré Platform - Digital Image Correlation (DIC) - Micro Fringe Projection (MP10) MP10 CoolBoost - CoolBoost Automated Flatness Inspection Current TherMoiré Product Line Specifications • Sample Size: PS200 - up to 200 x 200 mm PS400 - up to 400 x 400 mm PS600 - up to 600 x 600 mm • Vertical Resolution: ± 0.8 µm • Lateral Resolution: 1392 x 1080 pixels • Data Acquisition Time: 1 second • Temperature Range: Room Temperature to 300 C • Automated heating, cooling and exhaust Automated Flatness Inspection Recent TherMoiré PS400 Improvements • 1.4 MP camera allows for 4x higher pixel density • Windows XP-compatible software • Convective Module is 4x larger (200 x 200 mm) • Capable of being integrated with DIC and MP10 Modules Automated Flatness Inspection CoolBoost Module Delivers 50% higher throughput Productivity with Refrigerated Boost - 250 to 30 C Profile 300 250 Temperature (C) 200 150 100 50 0 1 60 119 178 237 296 355 414 473 532 591 650 709 768 827 886 945 1004 1063 1122 1181 1240 1299 Time (seconds) Refrigerated Boost Room Temperature Air Automated Flatness Inspection Batch Processing and Statistical Analysis Automated Flatness Inspection Spider Frame with Quartz Insert: Enables further increases in throughput Automated Flatness Inspection Digital Image Correlation fully integrated with the TherMoiré PS400 • Exclusive, global partnership with Correlated Solutions (Columbia, SC USA) for the distribution of DIC equipment into the microelectronics industry • CS was founded in 1998 and has over 150 installations worldwide • Their engineering staff has over 80 combined years of DIC experience • DIC software is robust, versatile, highly automated and fully integrated into the TherMoiré platform • Camera mounts integrated into PS400 oven • Designed for simple installation/removal • Can be used with Convective Module • Features remote control movement of calibration sample for ease of use • Together, Akrometrix and Correlated Solutions deliver 25 combined years of optical, non-contact metrology expertise Automated Flatness Inspection DIC Module: Camera Configuration Automated Flatness Inspection DIC Module: Data Output U Strain measurement V strain measurement (26°C to Z-axis displacement at 260°C. 3D plot. (26°C to 210°C). 3D 260°C). 2D plot overlayed on sample plot. MP10 Module - Micro Fringe Projection Automated Flatness Inspection The MP10 Module for the TherMoiré PS400 • Ability to measure small samples down to 1 x 1 mm and below • Finer XY imaging resolution • No grating adjacent to the sample • Higher tolerance for measuring discontinuous surfaces • Analysis almost identical to shadow moiré Automated Flatness Inspection Fringe Projection Technique • Non-contact, non-destructive • Full field, high data density • High speed • Combined with Phase Shifting Technique Automated Flatness Inspection The MP10 in the TherMoiré PS400 Specifications Region of Interest: 17 x 13 mm Vertical Resolution: ± 2.5 µm Lateral Resolution: 1392 x 1040 pixels Temperature Range: Room Temperature to 300 ºC (continuous) Air cooling and exhaust Time per Measurement: 3 seconds (data acquisition), 3-10 seconds total Automated Flatness Inspection MP10 Configuration Light Bundle Holder Collimated Lens Camera Grating Micro-motor Projection Controller Lens Camera Lens Automated Flatness Inspection Principle of Fringe Projection I4 I3 I2 I1 Phase Automated Flatness Inspection MP10 Module: Measurement Capabilities • Based on fringe projection • Full-field, non-contact optical technique • Time per measurement - 3 seconds • Temperature-dependent z-axis measurement (-55C to 300C) • 2.5 micron resolution • Sample sizes as small as 1 x 1 mm • Pixel size of 12 x 12 micron Automated Flatness Inspection Calibration • MP10 comes with a metal calibration standard (NIST- traceable certification) and white flat reference plane. • Measured heights from the MP10 system are compared with known heights from the standard certificate to verify system calibration. • Fringe value (the height-per-fringe-change) is the calibration constant. • The AkroDAQ software has a special calibration wizard for measuring the calibration sample and recalibrating the system. Automated Flatness Inspection Applications (12×12mm area on a coin) PS400, 300lpi PS400, 100lpi MP10 Automated Flatness Inspection Applications (14×14mm PCB BGA Site) PS400, 300lpi MP10 Automated Flatness Inspection Applications (14mm PCB BGA Site, Zoomed View) Automated Flatness Inspection Applications (14 × 14 mm PoP) Automated Flatness Inspection Applications 4.5×4.5mm area with solder bumps Ball pitch ~= 0.56mm Automated Flatness Inspection Applications (14 × 14 mm PoP) PS400, 100lpi MP10 Automated Flatness Inspection Applications (13mm PBGA) Automated Flatness Inspection Applications (13mm PBGA) Automated Flatness Inspection 2nd/3rd Order Surface Fit 3D surface plot 2nd order surface fit Automated Flatness Inspection New Features in MP10 Fringe Analysis Software • Multiple phase images and display windows may be open at the same time • Commands are available by right-mouse clicking on the image • Phase image filtering is applied as a command, not an option during analysis, and can be applied multiple times • 2nd order and 3rd order surface fit functions added Automated Flatness Inspection Convective Module for the TherMoiré PS400 • Convectively heated and cooled chamber • Modular design for simple installation/removal (<2 minute switchover) • Sample sizes up to 200 x 200 mm • -55 C to 300 C temperature range • 30 minutes from room temperature to –55 C to 150 C Automated Flatness Inspection Case Study: BGA Temperature Cycling Using Convective Module for the TherMoiré PS400 •Sample: 37.5mm BGA •Temperature profile: RT -> –40C -> 125C •Equipment: TherMoiré with Convective Module •Data collection every 10 degrees Automated Flatness Inspection Automated Flatness Inspection Akrometrix TherMoiré PS400 vs. Direct Projection Technique Automated Flatness Inspection Akrometrix PS400 vs. DPT Akrometrix PS400 Direct Projection Technique Principle Shadow Moiré technique Direct projection technique Real-time inspection Yes (<1 sec data acquisition time) No (4 sec data acquisition time) Depth of field (DOF) 5 mm fixed (with 100 lpi grating) Variable from 4 – 32 mm (dependent on FOV) 20 mm fixed (with 50 lpi grating) Larger DOF possible with DIC module Step height measurement? Yes (with DIC module) Yes Sample size 5 mm to 400 mm (base PS400) 10 mm to 200 mm <1 mm to 13 mm (with MP10 module) Field of view (FOV) Min: 13 x 17 mm (with MP10 module) Min: 25 x 25 mm Max: 400 x 400 mm (base PS400) Max: 200 x 200 mm Z-axis resolution FOV up to 400 x 400 mm: 2.5 um (with 100 lpi grating) FOV of 25 x 25 mm: 2.5 um FOV up to 100 x 100 mm: 0.8 um (with 300 lpi grating) FOV of 200 x 200 mm: 20 um Z-axis resolution No Yes dependent on FOV? Simultaneous X-Y-Z Yes (with DIC module) Yes deformation measurement (warpage, CTE, strain, etc.)? Max temperature variation <2.5 C Up to 12 C during data acquisition Automated Flatness Inspection Compliance - JEDEC JESD22B112 Akrometrix PS400 Direct Projection Technique Measuring Parameters Total warpage magnitude as function of Yes Yes reflow temperature Sign convention Yes No 3D and 2D plots Yes Yes Diagonal line scan Yes Yes Measurement Setup Number of thermocouples available for 8 Unknown sample temperature monitoring Driving thermocouple placement Bottom only Top and bottom of sample (can result in loss of data) Temperature range -55 C to 300 C -40 to 300 C Disclaimer: Information on direct projection equipment obtained from published literature, 3rd party evaluators and technical publications. CONFIDENTIAL Automated Flatness Inspection Akrometrix Customer List (Partial) >170 Installations Worldwide • Siemens AG • ChipPac • Shinko • HP • TI • Fujikara • Flextronics • IBM • Micron Technologies • Alcatel Lucent • Cisco • Sanyo • ASE • Fujitsu • Shinko Electric • Samsung • 3M Corporation • Infineon • Henkel • Sony Semiconductor • Philips CFT • ISE Labs • Canon • EMC • Altera • CMK • Research In Motion • Nitto Denko • Intel • Sony Japan • Sony • Cookson Electronics • Toshiba Japan • IZM Fraunhofer Institute • Denso • NEC • Nippon CMK • Shiima Electronics • Amkor • Agere • Namics Corporation • STMicroelectronics • Freescale Semiconductor • Hynix • Renesas • Mitsubishi Gas Chemical • Kyocera SLC • Seagate • Spansion • Sun Micro • OSE • Skyworks Automated Flatness Inspection Summary • Innovative solutions provider for flatness measurement and analysis • The industry leader in temperature dependent metrology • Vendor committed to innovation through software development • An Industry leader in standards for methodology Automated Flatness Inspection Questions? Contact Joe Thomas in the USA email@example.com Or HT Poh in Asia firstname.lastname@example.org Automated Flatness Inspection Thank You!
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