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					                                                          Blind Micro-vias

                 Embedded Resistors




         Multi-Tier Boards                      Chip-on-flex


                                                                               RF Product

                                      Multi-chip Modules




Embedded Capacitance                                                         Fine-line Technology
                             Capabilities Overview
2/8/08                                Compunetics, Inc.
                      Agenda
         • Corporate Overview
         • Compunetics, Inc. Company Profile
         • Current Capabilities
         • Technology Roadmap
         • Future Plans
         • Samples




2/8/08                Compunetics, Inc.
                     Corporate Overview

        30+ Years
         Experience in
         Design,
         Development and
         Manufacture of
         Highly-sophisticated Electronic Systems
        Telecommunications, Medical, Industrial, Transportation
         and Government Markets
        Internal Control over Manufacturing
        330+ Employees


2/8/08                         Compunetics, Inc.
                                Corporate Overview

         Compunetix, Inc.              Compunetics, Inc.              Chorus Call, Inc.


                        Instrumentation                                               Chorus Call, Inc.
                        Systems Division                                                   USA



                        Communication               Printed Circuit Board
                        Systems Division                   Group



                             Video                                                        Chorus Call
                        Systems Division                                                  International
                                                                                           Switzerland
                                                                                            Germany
                                                                                              Italy
                            Federal                                                           India
                        Systems Division                                                   South Africa
                                                                                             Greece
                                                                                              Brazil
                                                                                             Canada
                                                                                            Australia



2/8/08                                          Compunetics, Inc.
                                    Company Profile

                                                Compunetics, Inc.




      Manufacturing                Sales / Marketing                Quality                Services



                                                                                     Global     Engineering
 Engineering   Production
                                                                                    Products     Services




 Engineering Group Consisting                                                  PCB Layout & Design To
 Of 8 Engineers Dedicated To                                                  Handle Customer Design
 Managing / Fabricating Critical   Company Differentiators                    Overflow And To Give Support
 Or Technologically Challenging                                               To Customer’s Design Group
 Projects




2/8/08                                          Compunetics, Inc.
                         Company Profile
            SBA/FAR 19 Small Business
            38 Years Experience Producing Complex Interconnect
             Systems
            Customers in Commercial, Education,
             Telecommunication, and Government Markets
            Independent Internal R&D
            ESOP
            2007 Revenues: $11.0 Million
            70+ Employees
            25+ Engineers and Professionals
            ISO9001:2000 Registered and MIL Spec Certified


2/8/08                          Compunetics, Inc.
                    Company Profile
         Quality Certifications
         • ISO 9001:2000 Registered
         • UL Certified for Single / Double Sided and
           Multilayer Boards
         • ITAR Registered
         • MIL-P-55110 Certified for FR4, Polyimide
         • General Dynamics Land Systems Certified for
           Prototypes and Production
         • Hamilton Sundstrand Space Certification
         • JPL / NASA Flight Certified
         • General Dynamics UK Award For “Best Overall
           Business Performance 2004 / 2005”
2/8/08                    Compunetics, Inc.
                     Company Profile
         Types of Business
     • Prototypes, Quick Turn & Small To Medium Production
     • Military Spec PCBs
     • Backplanes
     • Rigid, Flex & Rigid/Flex (Class 2, 3 & Mil Spec)
     • High Layer Count – Up to 52 Layers, High Density PCBs
     • Independent Design/Drafting Group
     • Buried Passives
     • High Density Interconnects
     • Multi Chip Modules, Chip-On-Board
     • Engineering / Design Assistance




2/8/08                       Compunetics, Inc.
                        Company Profile
         Customer Base
         •   General Dynamics               •       Orbital
                Land Systems               •       DRS
                United Kingdom             •       Northrop Grumman
                AIS                        •       Terumo
                ATP                        •       Raytheon
         •   Lockheed Martin                •       L3 Communications
         •   DoD / DoE                      •       Philips Medical
         •   IBM                            •       Maxtek
         •   ITT / EDO                      •       David Sarnoff
         •   Intel                          •       Bombardier
         •   Tektronix                      •       Kadflex


2/8/08                          Compunetics, Inc.
                         Capabilities
     •   Engineering Services
     •   PCBs With 35 Micron Lines And Spaces
     •   Multilayer PCBs 52 Layers +
     •   Buried Resistors to  10%, Laser Trimmed to +/- 1%
     •   Embedded Capacitors
     •   Controlled Impedance to  2%
     •   Blind and Buried Vias, Laser Micro Vias Including
         Stacked and Stepped Via Technology
     •   4 mil Mechanically Drilled Holes
     •   Drafting and Design From Netlist (Gerber Generation)
     •   Special Selective Plating
     •   High Density Flex and Rigid Flex Circuits

2/8/08                       Compunetics, Inc.
                        Capabilities
  •   Conductive Epoxy w/ Dupont CB100
  •   High Tolerance Laser Routing with Optical Alignment
  •   Flex on Frames
  •   Mechanical Routing with Optical Alignment
  •   Controlled Depth Route to  2 mils
  •   Panel Sizes to 28”x 26”
  •   3-Dimensional Plating
  •   Sequential Build (Build-up Technology)
  •   RF / Microwave Product
  •   Heat Sink Boards
  •   High Speed Laminates Including: Rogers, Taconic
      Arlon and High Speed FR4 (Isola, Nelco)

2/8/08                     Compunetics, Inc.
                     Technology Road Map
   Plating
  Aspect Ratio                         Current        12 Months     24 Months
            Production                 9:1            10:1          11:1
            Engineering                12:1           13:1          14:1

  PTH Tolerance (finished hole size)   Current        12 Months     24 Months
            Production                 +/- 0.0030”    +/- 0.0025”   +/- 0.0020”
            Engineering                +/- 0.0015”    +/- 0.0012”   +/- 0.0010”




2/8/08                            Compunetics, Inc.
                     Technology Road Map
   Soldermask And
   Screening
  Minimum Soldermask Web                Current           12 Months         24 Months
            Production                  0.0035”           0.0030”           0.0030”
            Engineering                 0.0030”           0.0025”           0.0025”

  Minimum Soldermask Clearance          Current           12 Months         24 Months
            Production                  0.0030”           0.0025”           0.0025”
            Engineering                 0.0025”           0.0020”           0.0020”

  Legend Min Height / Line Width        Current           12 Months         24 Months
            Production                  0.050” / 0.006”   0.030” / 0.006”   0.035” / 0.005”
            Engineering                 0.040” / 0.005”   0.035” / 0.005”   0.030” / 0.004”




2/8/08                             Compunetics, Inc.
                     Technology Road Map
                                                               *.0.062” thick board
   Mechanical                                                  ** 0.125 thick board

  Number of Layers                    Current        12 Months         24 Months
           Production                 26             28                32
           Engineering                52             56                60

  Smallest Mechanical Drilled Holes* Current         12 Months         24 Months
           Production                 0.0060”        0.0060”           0.0050”
           Engineering                0.0040”        0.0040”           0.0030”




2/8/08                           Compunetics, Inc.
                     Technology Road Map
   Laser Drilled Microvias
  Minimum Hole to Capture Pad            Current           12 Months         24 Months
            Production                   0.006” / 0.010”   0.005” / 0.009”   0.004” / 0.008”
            Engineering                  0.003” / 0.006”   0.002” / 0.006”   0.002” / 0.005”


  Aspect Ratio of Blind Microvia         Current           12 Months         24 Months
            Production                   0.5:1             0.6:1             0.7:1
            Engineering                  0.7:1             0.8:1             1:1

  Copper Filled Microvias                Current           12 Months         24 Months
            Production                   No                No                Yes
            Engineering                  Evaluation        Yes               Yes


  Multi-Level Microvias (Stacked)        Current           12 Months         24 Months
            Production                   No                Yes               Yes
            Engineering                  Yes               Yes               Yes



2/8/08                              Compunetics, Inc.
                     Technology Road Map
   Imaging And Mechanical
  Layer-to-Layer Registration           Current        12 Months     24 Months
            Production                  +/- 0.0030”    +/- 0.0030”   +/- 0.0025”
            Engineering                 +/- 0.0020”    +/- 0.0020”   +/- 0.0014”

  Signal Pad Annular Ring Inners        Current        12 Months     24 Months
            Production                  0.0040”        0.0035”       0.0030”
            Engineering                 0.0030”        0.0025”       0.0020”

  Plane Clearance Inners                Current        12 Months     24 Months
            Production                  0.016”         0.014”        0.012”
            Engineering                 0.011”         0.010”        0.008”


  Copper Feature to Board Edge          Current        12 Months     24 Months
            Production                  0.0050”        0.0045”       0.0040”
            Engineering                 0.0030”        0.0025”       0.0020”



2/8/08                             Compunetics, Inc.
                     Technology Road Map
   Imaging And Etching                                               * Half Ounce Copper

  Trace / Space Outers *              Current             12 Months         24 Months
            Production                0.0040” / 0.0040”   0.0035” / 0.0035” 0.0030” / 0.0035”
            Engineering               0.0015” / 0.0015”   0.0012” / 0.0012” 0.0010” / 0.0010”


  Trace / Space Inners *              Current             12 Months         24 Months
            Production                0.0035” / 0.0035”   0.0030” / 0.0030” 0.0025” / 0.0030”
            Engineering               0.0015” / 0.0015”   0.0012” / 0.0012” 0.0010” / 0.0010”

  Trace Width Tol. Inners*            Current             12 Months         24 Months
            Production                +/- 0.0005”         +/- 0.0004”       +/- 0.0003”
            Engineering               +/- 0.0003”         +/- 0.00025”      +/- 0.0002”


  Controlled Impedance Tolerance *    Current             12 Months         24 Months
            Production                +/- 10%             +/- 7%            +/- 5%
            Engineering               +/- 2%              +/- 2%            +/- 2%



2/8/08                           Compunetics, Inc.
                           Future Plans

        Investigating Laser Direct Imaging Equipment
        Working With Dielectric Solutions On Reducing Fiber Weave
         Effect Using Proprietary Fiberglass Weave In PCB Materials
        Evaluating Factory Relocation And Expansion
        Sub-mil High Density Product
        Multi-Layer LCP Packages
        Investigating Large Panel Production Equipment




2/8/08                         Compunetics, Inc.
                                       Samples
  Embedded Passives
  (Resistors)
   A True Thin-Film, Nickel-Phosphorous (NiP) Alloy.
        About 0.1 To 0.4 Microns Of The Alloy Is Electro-Deposited
         On To The Rough, Or Tooth Side Of Copper Foil During
         Manufacturing
        Typical Tolerance Of 10 – 20%
        Resistors Tested At Final Test And During Inner Layer
             OHMEGA-PLY LAMINATE
                                              copper
             resistive material (0.1-0.4 micron thick)
                                 dielectric substrate
                                             copper

                                                     (EXAMPLE OF AVAILABLE CORE)
2/8/08                                 Compunetics, Inc.
                                     Samples
   Embedded Passives
   (Capacitors)
    Bulk Capacitance Formed By Placing Power And Ground

         Layers Close Together
        Thin Dielectrics Separate Power And Ground To Create
         Parallel Plate Capacitor

  C = keA/t                                                              Cu
                                                                     Film Core

  Where:                                                                 Cu

  C = Capacitance
                                                                Copper clad laminate
  e = Dielectric Constant of Material
  A = Board Area in Square Inches                         Double sided (power and ground)

  k = Permittivity of Free Space – Constant of            Dielectric is a Polyimide and BaTiO
                                                                        composite.
  225
  t = Dielectric Thickness in inches                  Thickness of dielectric is key…thinner is
                                                                       better

2/8/08                                Compunetics, Inc.
                               Samples
  Embedded Passives
  (Capacitors) SMT Caps Needed On PCB
   Reduction In
        Closely Spaced Planes Have Lower Inherent Inductance
         Therefore Supply Current On A Very Short Time Scale Thus
         Damping Fluctuations Of Voltage At Device Input
        Low Inductance Planes Reduces EMI
        Initial Data Indicates That Surface Mounted Capacitance
         Can Be Effectively Replaced By Embedded Capacitance
         With Only A Small Fraction Of The Total Discrete
         Capacitance




2/8/08                         Compunetics, Inc.
                                                  Samples
   Embedded Passives (Capacitors)

  Products
         Properties     Product Dupont Interra HK 04 Dupont Interra HK 10 Dupont Interra HK 11        3M C-Ply

 Capacitance/Area       nF/in2           0.8                  2.2                  4.5                    5
 Dielectric Constant                     3.5                  10                   11                    16
 Thickness              microns           25                  25                   14                    16
 Breakdown Voltage      Volts           6000                 3100                 2500                  >100
 Material                             Polyimide         Poyimide w/filler    Poyimide w/filler   Ceramic filled Epoxy
 Dissipation Factor                     0.003                0.01                 0.02                 0.005
 UL Listed                               Yes                 Yes                Pending                 Yes
 Sequential Lam Process                  No                  Yes                  Yes                   Yes




2/8/08                                            Compunetics, Inc.
                                        Samples
   Embedded Passives (Capacitors)
  Applicatio
  n • Before Embedded Capacitance
              18 Layers
              Blind vias: 1-2, 18-17
              Buried vias 2-17
              Over 2000 Caps



         • After Embedded Capacitance
                18 Layers
                No Blind Vias
                Buried vias 2-17
                Removed 800+ Caps




2/8/08                                  Compunetics, Inc.
                                           Samples
  Controlled Impedance
  Flex Signals with Faster Rise/Fall Times Require
   Faster
         Controlled Impedance Flex Cables
        In Order To Have Cable Flexible, Need To Etch Traces Near
         3 mils (Larger Traces Require Thicker Dielectrics For Same
         Impedance, Making Board Less Flexible)


            • Controlled Impedance Flex
                  8 Layers
                  Trace / Space – 3.0 / 3.0
                  DuPont AP & LF Flex Material
                  Differential Controlled Impedance




2/8/08                                     Compunetics, Inc.
                                             Samples
   Rigid-Flex
        Common Application To Add Reliability And/Or To
         Reduce Assembly Costs Through Removal Of
         Connectors And Cabling
        More Common Due To Tight Spaces And Need For
         Increased Reliability In Products, Especially In Military


         • Military Avionics Rigid Flex
                 8 Layers
                 2 oz. Copper
                 Loose-leaf Design for Increase Flexibility
                 3 Double Sided Flex Cores w/Coverlay
                 Military Specification




2/8/08                                        Compunetics, Inc.
                                              Samples
   Rigid-Flex
         • Satellite Systems
                12 Layers
                Flight Certified Product
                Polyimide / DuPont AP Flex
                Immersion Gold




                                                        • Military
                                                                22 Layers
                                                                6 Layer Loose-leaf Flex
                                                                Polyimide / DuPont AP Flex
                                                                HAL Finish




2/8/08                                        Compunetics, Inc.
                                            Samples
  High Speed – Mixed Material
  Boards Low Df/Dk Materials for Today’s Technology
   Need For
        Mix Low Df/Dk, High Cost Material with Higher Df/Dk Low
         Cost Material
        Keep Critical Signals on/with Low Df/Dk Material
        Some Materials can not be Mixed with Certain Other
         Materials

          • Mixed Material 10Gb Ethernet
                 8 Layers
                 Blind Vias – 1-4 For Stub Control
                 Conductive Epoxy Filled Vias
                 Rogers 4003 / FR4 Material
                 Cavity Construction at Gold Fingers



2/8/08                                      Compunetics, Inc.
                      Samples
   High Speed – Mixed Material
   Boards

                                          • FR4 Material
                                          (Glass Bundles)




                                          • Rogers 4000
                                          (Ceramic Filled)




2/8/08                Compunetics, Inc.
                                    Samples
   Heat Dissipation Boards
        Smaller Spaces and Hotter Running Parts Require Design
         Consideration for Heat Dissipation
        Need To Provide Thermal Path Away From Components
        Several Design Changes Can be Made To Minimize Thermal
         Impact to Components
         –   Place Heat Generating Part Near Heat Sink or Board Edge
         –   Provide Thermal Path In Copper Including Using Edge Plating
         –   Use Thermal Vias to Connect to Internal Planes or Heat Sink
         –   Use of CB100 for Thermal Vias
         –   Heat Sinks
         –   Thinner Board Materials Place Component Closer To Heat Sink



2/8/08                              Compunetics, Inc.
                                          Samples
   Heat Dissipation Boards


         • Heat Dissipation Board
               4 Layers
               Thin Core FR4
               Conductive Epoxy
               Heat Spreader Attached w/ Thermagon
               HASL Finish




2/8/08                                    Compunetics, Inc.
                                Samples
   RF Boards
        Boards Typically Made on Teflon or Teflon Blend Products
        Etching Tolerance of +/- .0003”
        Several Areas of Tight Tolerance Routing +/- .002 (Requires
         Laser Routing w/Vision System
        Some Designs Require Metal Backing
        Most Require Wirebondable Gold




2/8/08                           Compunetics, Inc.
                                            Samples
   RF Boards




         •Commercial RF                                         • Military RF
              2 Layers                                                 4 Layers
              Rogers 3003                                              Rogers 6002, 4350, 4403
              Laser Routed Slots                                       Blind 1-2, 4-3; Buried 2-3
              Trace Tolerance +/- .0003”                               Cavity 4 to 3
              Wirebondable Gold                                        Trace Tolerance +/- .0003”
                                                                        Wirebondable Gold




2/8/08                                      Compunetics, Inc.
                                Samples
   Laser Drilled Blind Micro-vias
        Typically .004” to .006” Laser Drilled Hole From Layers 1 to
         2 and/or From N to (N-1)
        Dielectric Distance .003” to .004”
        Aspect Ratios less than .50:1
        Material Typically RCC (Resin Coated Copper) or Flat Glass
         FR4
        Enables Pin Escaping Small Pitch BGAs or BGAs on Thick
         PCBs
        Used to Conserve Routing Channels on Inner Layers
        Enables Double Sided Assembly in Some Cases


2/8/08                          Compunetics, Inc.
                       Samples
   Laser Drilled Blind Micro-vias




2/8/08                 Compunetics, Inc.
                                      Samples
   Chip On Flex (Direct Die Attach)

         • Chip On Flex
                2 Layers
                Trace / Space – 2 / 2
                2 mil Laser Drilled Vias
                Wirebondable Gold
                2 mil Adhesiveless Pyralux




2/8/08                                Compunetics, Inc.
                                     Samples
   Buried Resistors on Flex

         • Buried Resistor on Flex
                2 Layers
                Ohmega Ply Resistor
                Resistor Covered By Kapton
                Immersion Silver Finish
                2 mil Adhesiveless Pyralux




2/8/08                               Compunetics, Inc.
                                          Samples
   Laser Trimmed Embedded
   Resistors
         • Laser Trimmed Resistors
               Resistor Laser Trimmed Under Measurement
               Resistor Trimmed to +/- 1%
               Final Resistor Tolerance +/- 3%
               Application: High Speed Testing




2/8/08                                    Compunetics, Inc.
                              Samples
   Copper Filled Micro-vias
        Via-in-pad Provides Flat Pad Surface for BGA Attach
        Flat Surface Optimal For Stacked Micro-vias
        Need For Special Plating Chemistry
        Need For Special Plating Equipment
        Enables Pin Escaping High Pin Count .5 mm Pitch BGAs
        Technology Under Development at Several US Shops




2/8/08                        Compunetics, Inc.
                      Samples
   Copper Filled Micro-vias

  Current Plating
  Technology




2/8/08                Compunetics, Inc.
                                Samples
   Copper Filled Micro-vias
        Test Vehicles Manufactured and
         Evaluated
        Technology Approved for
         Production Using In-house
         Equipment
        The Smaller The Hole, The More
         Flat the Plating
        Plating of Close to 1:1 on Blind
         Microvias




2/8/08                          Compunetics, Inc.
                      Samples
   Copper Filled Micro-vias
  Stacked Micro-
  vias




2/8/08                Compunetics, Inc.
                               Samples
   DuPont PF Material
        All Polyimide Adhesive
        Flex “prepreg” Without Acrylic
        Lower Z-axis Expansion Without Acrylic
        Increase Reliability
        Much Lower Df (.02 vs. .004)
        Product Withstands MIL-Spec Thermal Shock Testing
        Product Still In Beta-Test at Several Shops Including
         Compunetics, Inc.
        Evaluations On-going at Several Large OEMs



2/8/08                          Compunetics, Inc.
                                             Samples
   DuPont PF Material




         • Multi-Layer Flex w/ PF Material                       • Multi-Layer Flex w/ LF Bondply




2/8/08                                       Compunetics, Inc.
                              Samples
   Fine Line Technology (2 mil Trace/Space &
   Down)
    Required for High Pin Count Fine Pitch BGA Routing
         (<= 0.5 mm Pitch)
        Chip On Board / Chip On Flex
        Used To Reduce Layer Count – More Tracks per Channel
        Seen with Laser Drilled Micro-vias
        Typically on Boards with Small Annular Rings
        Can be Combined with Embedded Passives




2/8/08                        Compunetics, Inc.
                                      Samples
   Fine Line Technology (2 mil Trace/Space &
   Down) Chip Package
     • Multi-Level
          6 Layer FR4
          2 / 2 Trace / Space
          Embedded Resistors for Termination
          Multi-Level Cavity Construction
          Wirebondable Gold




                                      • Fine Line Package
                                             1.5 / 1.5 (35 / 35 um) Trace / Space
                                             Wirebondable Gold
                                             4 Layers FR4
                                             31 mil Thick +/- 1 mil




2/8/08                                Compunetics, Inc.
                              Samples
   Laser Ablation Of Soldermask
   Proble
   m Tighter Pitch Parts Require Better Soldermask
   

         Registration
        Conventional Mask Annular Rings Leave Insufficient Mask
         Dams
   Solutio
   n BGA Area Covered With Soldermask
   

        YAG Laser Used To Remove Mask From BGA Pads
        Mask Annular Ring Less Than 1 mil
        Mask Dams Remain Aiding Assembly


2/8/08                        Compunetics, Inc.

				
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