METHOD FOR MONITORING ENVIRONMENTAL DEGRADATION OF ADHESIVE BONDS

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METHOD FOR MONITORING ENVIRONMENTAL DEGRADATION OF ADHESIVE BONDS Powered By Docstoc
					Number:      615

Title:       METHOD FOR MONITORING ENVIRONMENTAL
             DEGRADATION OF ADHESIVE BONDS
Author:      S.I. Rokhlin, A. Ba1tazar, B. Xie, J. Chen and R. Reuven
Citation:    Materials Evaluation, Vol. 60/Number 6, pp 795-801, June 2002
Keywords:    adhesive joints, environmental degradation, adhesive bond strength

Abstract:    A contact, dual channel angle beam ultrasonic spectroscopy system was
             developed for monitoring the environmental degradation of adhesive ends. Using
             different surface pretreatments, bonded samples were prepared and exposed to an
             accelerated environmental degradation process immersion in a saturated NaC1
             solution at 341 K (154 oF) and 4.5 kN (1000 lbf) load. Simultaneous normal and
             angle beam ultrasonic scans were made over the bonded area and reconstruction
             was performed to estimate the bondline properties’ degradation. The
             reconstructed properties are effective shear and longitudinal moduli, density,
             thickness and wave attenuations. It is shown that the ultrasonic results provide
             information on damage evolution prior to failure. Specifically, adhesive creep and
             bondline property variation are identified as failure precursors measurable by this
             method.

Pros/Cons:   This technique allows quantification of the degradation process by providing
             effective bond parameters such as thickness, effective longitudinal and shear
             moduli, density and ultrasonic longitudinal and shear wave attenuations. By
             measuring the variations of these parameters, one can determine environmentally
             degraded areas on the bonded structure.

				
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