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Personal and Portable: The technology that is
making it happen
Gene A Frantz
Principal Fellow
Texas Instruments
Decades of
Digital Signal Processing
Decade Characteristic $/MIPS
’60s University Curiosity $100 - $1,000
’70s Military Advantage $10 - $100
’80s Commercial Success $1- $10
’90s Consumer Enabler 10¢ - $1
Beyond Expected Part of 1¢ - 10¢
Daily Life
Generations of DSP
Processing Processors
1980 1990
Technology Product Technology
What is DSP? How do I create How do I solve
a product? problems?
Early DSP’ing Milestones
Before 1965: First tentative steps
1965: Rediscovery of the FFT
1965 to 1970: The potential becomes clear
1970 to 1980: Tools are developed
1980: VLSI makes it practical
Now: Incredible computational power
opens up many new applications
Courtesy of Ron Schafer
Some Early Contributors
Bishnu Atal John Markel, Steen Gray
John Makhoul
Manfred Schroeder Courtesy of Ron Schafer
The TX-2 Computer, Circa 1967
Courtesy of Ron Schafer
Another Contributor
Jack Kilby
1st Integrated Circuit
One View of DSP, Circa 1976
“That discipline which has allowed us to replace a
circuit previously composed of a capacitor and a
resistor with two anti-aliasing filters, an A-to-D and a D-
to-A converter, and a general purpose computer (or
array processor) so long as the signal we are interested
in does not vary too quickly.”
Thomas P. Barnwell, III
=
IN Filter A/D DSP D/A Filter OUT
$50 $50 $500 $50 $50
Courtesy of Ron Schafer
Early DSP’or Milestones
1978: TI “Speak and Spell” DSP synthesizer
1979: Intel 2920 “Analog Signal Processor”
1979: American Microsystems International S28211
1980: NEC µPD7720
1980: AT&T Bell Labs DSP-1 (captive)
1982: TI TMS32010
Courtesy of Will Strauss
The Key Drivers
“Smaller Features Lower Cost/Function
Larger Market”
100 1000
Plotted
"Minimum Feature Size" (µm)
Annually
Global IC Sales ($B)
10
100
1 History Forecast
10
0.1
0.01 1
1960 1970 1980 1990 2000 2010
Lithography Advancements
Fuel Growth
Nano-
meter 400nm 350nm 250nm 180nm 130nm 90nm
6" 6" 6" 8" 12" 12"
Die size
(mm2) 80.7 46.6 19.2 10.7 6.7 4.2
Dies per
wafer 310 558 1435 2626 12,186 18,667
5922% increase in dpw
Shrinking Process: The Benefits
Device Year Transistors Process
32010 1983 50,000 3.0um NMOS
32020 1984 100,000 2.4um NMOS
320C30 1988 500,000 1.0um CMOS
320C50 1990 1,200,000 0.8um
320C5510 2000 22,000,000 0.18um
320C556x 2002 180,000,000 0.13um
Wafer Fabs
Wafer size: 300mm
Final capacity: 35K+ wafers/
month
Technology: 130nm copper
90nm copper
# Tools on floor: 320
1st full flow silicon: 2-15-01
130nm qualification: 2Q02
90nm customer
prototypes: 2H02
90nm qualification: 2H03
Fab Space
Waffle table: 118K sq. ft.
Greater than 10K wafers per month Total mfg: 150K sq. ft.
130 nm Copper Technology Today
Wireless Wired
Infrastructure Infrastructure
WiredInfrastructure Wireless Client
Performance Audio
Wireless Camera
Digital Still Client
600 MHz Wireless Infrastructure
6 DSP CPU DSP+GPP
@ 300MHz CPU
DSP
6225 MHz
Viterbi DSP+GPP
3MB 300MHz
24Mb Low power
Viterbi
and Turbo DSP+GPP
@ consumption
integrated
and Turbo
hardware Imaging
600 MHz
Floating
memory integrated
hardware Low power
3MB Voice, data,
accelerators accelerators
180Mpoint video
accelerators consumption
memory
transistors
Viterbi
Voice, data,
TMS320C6416 TMS320C5561180M transistors OMAP5910
and Turbo
video
hardware
Digital Still Camera accelerators
Performance Audio
225 MHz
DSP+GPP
TMS320C5561
Imaging Floating
TMS320DM310
TMS320DA610
accelerators point
OMAP5910
TMS320C6416
TMS320DM310 TMS320DA610
90 nm
Transistor
Over 400 million transistors
on a single chip
Functional integration to create entire
system on one chip
37 nm
Delivery
Initial test chips in 90 nm process – 1H02
First device – 2H02
Fully qualified production – 2H03
Result 12" 6"
Cost-effective, system-on-a-chip
Unprecedented performance levels
Significant power savings
What will it cost?
10000 100
Exposure Tool Cost [$M]
Polished Wafer Cost [$]
1000 EUV
450 ? 10
157-nm
100 300-mm 193-nm
248-nm
200-mm 1
10 i-line
150-mm
100-mm g-line
1 1x scan
0.1
1975 1980 1985 1990 1995 2000 2005 2010
1975 1980 1985 1990 1995 2000 2005 2010
100 100
10
Transistor Cost [m¢]
Wafer Fab Cost [$B]
10
1
?
1
0.1
0.1
0.01
0.01 0.001
1975 1980 1985 1990 1995 2000 2005 2010 1980 1985 1990 1995 2000 2005 2010
The Future of Integration
DEVICE CAPABILITIES
1982 1992 2002 2012
Technology (uM) 3 0.8 0.1 0.02
Transistors 50K 500K 180M 1B
MIPS 5 40 5,000 50,000
RAM (bytes) 256 2K 3M 20M
Power (mW/MIPS) 250 12.5 0.1 0.001
Price/MIPS $30.00 $0.38 $0.02 $0.003
The Greatest DSP Products Haven’t
Been Invented Yet
Trends In Technology
Transistors moving from microns to nanometers
Gates per square millimeter going from tens of
thousands to hundreds of thousands
Die sizes shrinking from tens of square millimeters
to units of square millimeters
Wafer size moving to 300 millimeter
Dies per wafer increasing from thousands per wafer
to tens of thousands per wafer
Tooling costs going from hundreds of thousands of
dollars to millions of dollars
Fab cycles increasing from weeks to months
The Age of Computing ????
TAM
Internet
$500B DSP & Analog
$100B PC
Microprocessor
$10B
Minicomputer
TTL/Logic
$1B
Mainframe
Transistors
1960s 1970s 1980s 1990s 2000s 2010s
The Perfect Roadmap
One
Device
Even
Fewer
Devices
Fewer
Devices
Lots of
Devices
Time
Quiz
Who is the only DSP Guru with their picture
on a Nation’s Currency?
Quiz
Who is the only DSP Guru with their picture
on a Nation’s Currency?
