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					                                                                                                             91/XXX/INF
                                                                         For IEC use only
                                                                                                                             2005-06



INTERNATIONAL ELECTROTECHNICAL COMMISSION

TECHNICAL COMMITTEE No. 91: ELECTRONICS ASSEMBLY TECHNOLOGY
TECHNICAL COMMITTEE No. 93: DESIGN AUTOMATION

Draft PUBLICATION PLAN FOR PRINTED BOARDS, PRINTED BOARD ASSEMBLIES and EDA STANDARDS


This publication plan has been revised.

These suggestions are a result of the deliberations of the delegates of the working groups of:
         IEC/TC52 at their meeting in Providence, October 1995; Norrköping October 1996; Guangzhou, May 1997; and
        Houston, October 1998; All actions of TC52 have been taken over by TC91.
         IEC/TC93 at their meeting in Copenhagen, October 1996; Tokyo, September 1997; London, September 1998; and
        Arlington VA,USA; September 1999; Frankfurt, October 2000; Florence, October 2001; Beijing, October 2002;
        Piscataway, NJ, November 2003
         IEC/TC91 at their meeting in San Diego, November 1996; Frankfurt, October 1997; Kista, September, 1998; and Kyoto
        October 1999; London November 2000; Orlando October 2001; Helsinki, October 2002; Singapore, November 2003
         Review at ACET meeting by Secretaries/Chairmen of TC52/TC91/TC93, April, 2001, April 2002; April 2003
         Working group meetings held in May 2005 in Herndon, VA, USA, and in June 2005 in Tokyo, Japan

                                                         Central Office Note


National committees are requested to consult their experts of TC91, and TC93 when considering this document and send their
comments to the secretary of TC 91

PROPOSED PUBLICATION PLAN FOR PRINTED BOARDS AND PRINTED BOARDS ASSEMBLIES

The following is a proposal for a co-ordinated publication plan of documents being reviewed by working groups and members of
TC91: Electronics Assembly Technology; and TC93: Design Automation.

This coordinated plan is intended to provide the IEC with documents that are in the spirit of the scope statements of TC91, and
TC93. These two IEC technical committees share the interrelationship that when a rigid board is being designed, either manually
or using automation tools, it is really a printed board assembly that is being considered.

Design for manufacturability is the key phrase in the industry today. This leads to the following conclusion:

The rapid technology advances in new electronic components, equipment, and surface mount processes, as well as the design
tools being used by the industry requires an aggressive technique for a harmonized approach to provide the industry with
publications that are clear and non-conflicting.

In order to meet these objectives, it is suggested that a set of publication numbers be reserved by the Central Office of the IEC and
these numbers and documents become the "shopping list" of TC91, and TC93 in order to accomplish the goals of an orderly set of
international documentation. Identification numbers have been assigned to the major publication sets identified below.

It is recognised that some of the information to be covered in this new publication set may already be contained in existing IEC
published material. Nevertheless, in the interest of a co-ordinated effort, it would be in the best interest of the world organizations
to promote these concepts.

It is not intended that the activities of TC91, and TC93 should be controlled via this plan. The content of the plan will vary to
accommodate the needs and decisions of TC91, and TC93. No priorities have been assigned, or are implied, by the publication
plan
1   Proposed organizational structure (based on the DCC major topics of IEC 60194)

*   Administration (Section 2 and 3)

                         +      IEC 60194 - Terms and definitions for printed boards and printed board assemblies
                         +      IEC 61193 - Guidance on the use of the IEC/ISO publications for quality assessment of
                                       printed boards and printed board assemblies
                         +      IEC 6XXXX - Marking and Symbols

*   Engineering and design for electronic packaging (Section 4 through 14)

                                +      IEC 60097 - Grid systems for printed boards
                         +      IEC 61182 - Printed board electronic data description and transfer
                         +      IEC 61188 - Design of printed boards and printed board assemblies
                                       IEC 61523    Application Specific Integrated Circuits (ASIC)
                                       IEC 61690    Electronic design interchange formats
                                       IEC 61691    High speed behavioural Languages
                                       IEC 61692    Interoperability models
                                       IEC 61693    Test, validation, conformance, and qualification support
                                       IEC 61926    Standard test languages
                                +      IEC QC 210 012-      Process assessment schedule for printed board design facilities

*   Materials for electronic packaging (Section 15 and 16)

                         +      IEC 61249 - Materials for interconnection structures
                         +      IEC 61190 - Materials used in manufacture and assembly of printed board assemblies
                                +      IEC QC 200 xxx Process assessment schedule for printed board base materials

*   Fabrication of printed boards (and other interconnection structures) Section )

                         +      IEC XXX-        (Under consideration)

*   Types & performance of printed boards and other interconnection structures (Section 17)

                         +      IEC 62326-   Printed board performance for capability approvals
                                +      IEC QC 210 003-      Technology approval schedule for printed boards

*   Printed board assembly (Section 18 and 19)

                         +      IEC 61191 -     Printed board assembly techniques

     Types and performance of assemblies (Section 20 and 21)

    + IEC 61760          Electronic assembly Characterization
                         +       IEC 61192 - Assembly performance requirements

*   Quality   (Section 22)

                         +     IEC 61189 -      Test methods for printed boards and printed board materials and printed board
                         assemblies

*   Components for electronic packaging

       + see publication of other committees (TC47, TC48, etc.)

       Optoelectronics Assembly (with TC86)

       + IEC 6XXXX
The previously defined structure is proposed as a method for the co-ordinated development of standards and specifications related
to the electronic packaging industry. Future development of new IEC publications should be easily fit within one of the categories
identified.

Specific Technical Committees of the IEC including TC91 and TC93 are encouraged to find the appropriate fit within the strategy
for IEC publications that cover their particular work items.

A new format has been developed that provides a table for each of the subject document sets. Each table indicates the basic IEC
number, the description, and the TC that has the main responsibility. In addition, the last column indicates the status as of the date
of this INF document using the following code designations:

PUB        - Published                                        CDS         - Committee draft stage
MOD        - Modifying a published document                   CDV         - Committee draft for voting
WRK        - Working draft in progress                        DIS         - Final draft international standard
NST        - Not started                                      PAS         - Publicly available specification
CNL        - Cancelled                                        NWP         - New Work Item Proposal
DLP        - Dual Logo Procedure                              WDN         - Withdrawn
Clause   IEC Number      Description                                               TC Responsible: TC91/TC93               Status

2        IEC 60194       Terms and Definitions

2.1      IEC 60194       Terms and Definitions for Printed Boards and Printed Board Assemblies                              MOD



Clause   IEC Number      Description                                                        TC Responsible: TC91           Status

3        IEC 61193       Quality assessment systems

3.1      IEC 61193-1     Part 1: Registration and analysis of defects on printed board assemblies.                          PUB
3.2      IEC 61193-2     Part 2: Guide to the selection and use of sampling plans for end-product and in-process            NWP
                         auditing
3.3.1    IEC 61193-3     Part 3: Guide to the implementation and use of Statistical Process Control (SPC) for printed       WRK
                         boards and printed board assemblies
3.3.2    IEC 61193-4     Selection and use of sampling plans for electronic modules                                         WRK

3.3.3    IEC 61193-5     Selection and use of sampling plans for electronic assemblies                                      WRK



Clause   IEC Number      Description                                                  TC Responsible: TC91/TC93            Status

4        IEC 61182       Printed board electronic data description and transfer

4.1      IEC 61182-1     Part 1: Printed board description in digital form                                                  PUB
4.2      IEC 61182-2     Part 2: Guide for digital description (XML)                                                        CDV
4.3      IEC 61182-3     Part 3: Printed board drawing(s) in digital form                                                   NST
4.4      IEC 61182-4     Part 4: Electrical description records and parts list                                              NST
4.5      IEC 61182-5     Part 5: Library description records                                                                NST
4.6      IEC 61182-6     Part 6: Assembly description records                                                               NST
4.7      IEC 61182-7     Part 7: Bare board electrical test description                                                     PUB
4.8      IEC 61182-8     Part 8: Automatic test records                                                                     NST
4.9      IEC 61182-9     Part 9: Automatic optical inspection records                                                       NST
4.10     IEC 61182-10    Part 10: Electronic data Hierarchy (EDH)                                                           PUB
4.11     IEC 61182-11    Part 11: Generic Computer Aided Manufacture (GenCAM) IEC/PAS 62119                                 PAS



Clause   IEC Number         Description                                                         TC Responsible: TC93       Status

5        IEC 61926          Standard test languages

5.1      IEC 61926-1        Part 1: Common/Abbreviated Test Language for All Systems (C/ATLAS)                              PUB
         IEC 61926-1-1      Part 1-1: Harmonisation between two similar test language standards                             PUB



Clause   IEC Number          Description                                              TC Responsible: TC93                 Status

6        IEC 6XXXX           Diagnostic of Electronic Products

6.1      IEC 62243           Standard for Artificial Intelligence Exchange and Service tie to All Test Environments (AI-   DIS/DLP
                             ESTATE) (IEEE Std 1232)
6.2
6.3
Clause   IEC Number        Description                                             TC Responsible: TC93              Status

7        IEC 6XXXX         Test Information

7.1      IEC 6XXXX-1       Part 1: Test information flow through product life cycles (TR)                            WRK



Clause   IEC Number        Description                                             TC Responsible: TC93              Status

8        IEC 61523         Delay and Power Calculation Standards

8.1      IEC-61523-1       Part 1: Integrated Circuit (IC) delay and power calculation systems                       PUB
8.2      IEC-61523-2       Part 2: Prelayout delay calculation model specification for CMOS ASIC libraries           PUB
8.3      IEC-61523-3       Part 3: Standard Delay Format (SDF) for the Electronic Design Process (IEEE 1497)        PUB/DLP



Clause   IEC Number        Description                                             TC Responsible: TC93              Status

9        IEC 61690         Electronic Design Interchange Formats

9.1      IEC 61690-1       Part 1: Electronic design interchange format (EDIF) 3 0 0                                 PUB
9.2      IEC 61690-2       Part 2: Electronic design interchange format (EDIF) 4 0 0                                 PUB
9.3      IEC 61690-3       Part 3: Electronic design interchange format (EDIF) 5 x x                                  NST



Clause   IEC Number        Description                                                       TC Responsible: TC93    Status

10       IEC 61691         Behavioural Languages

10.1     IEC 61691-1       Part 1: VHSIC Hardware description language VHDL 1076a                                    PUB
         IEC 61691-1-1     Part 1-1: VHDL language reference manual (IEEE 1076-2002)                                PUB/DLP
10.2     IEC 61691-2       Part 2: VHDL multilogic system for model interoperability                                 PUB
10.3     IEC 61691-3       Part 3: VHDL utilities                                                                    WRK
           IEC 61691-3-1   Part 3-1: Analog description in VHDL                                                      WRK
           IEC 61691-3-2   Part 3-2: Mathematical operation in VHDL                                                  PUB
           IEC 61691-3-3   Part 3-3: Synthesis in VHDL                                                               PUB
           IEC 61691-3-4   Part 3-4: Timing expressions in VHDL                                                       NST
           IEC 61691-3-5   Part 3-5: Library utilities in VHDL                                                        NST
10.4     IEC 61691-4       Part 4: Verilog® hardware description language (IEEE 1364-2001)                          PUB/DLP
10.5     IEC 61691-5       Part 5: VITAL ASIC (application specific integrated circuit) modeling                    PUB/DLP
                           specification (IEEE 1076.4 2000)
10.6     IEC 62050         Standard for VHDL Register Transfer Level (RTL) Synthesis (IEEE Std                      DIS/DLP
                           1076.6)
10.7     IEC 62142         Standard for Verilog Register Transfer Level Synthesis (IEEE Std 1364.1)                 DIS/DLP



Clause   IEC Number        Description                                             TC Responsible: TC93              Status

11       IEC 6XXXX         Test, validation conformance and qualification support

11.1     IEC 6XXXX-1       Part 1: Guidelines for Test, Validation, Conformance and Qualification for Standards      WRK



Clause   IEC Number        Description                                             TC Responsible: TC93              Status
12       IEC 62014         Electronic Design Automation Libraries

12.1     IEC 62014-1       Part 1: I/O buffer information specification (IBIS, version 2.1)                         PUB
12.2     IEC 62014-2       Part 2: Library standard architectures (TR)                                              NST
12.3     IEC 62014-3       Part 3: Modules of integrated circuits for EMI behavioural simulation                    PUB
12.4     IEC 62265         IStandard for an Advanced Library Format (ALF) Describing Integrated                    DIS/DLP
                           Circuit (IC) Technology, Cells, and Blocks (IEEE Std 1603)



Clause   IEC Number        Description                                               TC Responsible: TC93          Status

13       IEC 62015         Electronic Design exchange by software interface

13.1     IEC 62015-1       Part 1: Chip hierarchical design systems technical data (CHD Std)                        WRK
13.2     IEC 62015-2       Part 2: Advanced intermediate representation with extensibility common environment       WRK
                           (AIRECE)



Clause   IEC Number        Description                                                TC Responsible: TC93         Status

14       IEC ……..          Documentation on Design Automation subjects

14.1     IEC 62016         Core Model of the Electronics Domain (CMED)                                              PUB
14.2     IEC 62017-1       EDA industry standard roadmap for design and test                                        PUB
14.3     IEC 62017-2       EIAJ - EDA Technology Roadmap Toward 2002                                                PUB
14.4     IEC/TR 61908      The technology roadmap for industry data dictionary structure, utilization               PUB
                           and implementation
14.5     IEC/TR 62248      Approaches to conformance and certification testing for automation                       PUB
                           standards



Clause   IEC Number        Description                                                TC Responsible: TC91         Status

15       IEC 61188         Design and use of printed boards and printed board assemblies

15.1     IEC 61188-1       Part 1: Generic design and use requirements for printed boards and printed board         NST
                           assemblies
           IEC 61188-1-1   Part 1-1: Flatness considerations for electronic assemblies                              PUB
           IEC 61188-1-2   Part 1-2: Controlled impedance                                                           PUB
15.2     IEC 61188-2       Part 2: Sectional design and use requirements - Engineering considerations               NST
15.3     IEC 61188-3       Part 3: Sectional design and use requirements - Computer technology integration          NST
15.4     IEC 61188-4       Part 4: Sectional design and use requirements - Documentation and capability             NST
                           assessment
15.5     IEC 61188-5       Part 5: Sectional design and use requirements - Attachment (land/joint) Consideration
           IEC 61188-5-1   Part 5-1: Generic requirements                                                           MOD
           IEC 61188-5-2   Part 5-2: Discrete components                                                            MOD
           IEC 61188-5-3   Part 5-3: Components with Gull-wing leads on two sides                                   CDV
           IEC 61188-5-4   Part 5-4: Components with J leads on two sides                                           CDV
           IEC 61188-5-5   Part 5-5: Components with Gull-wing leads on four sides                                  CDV
           IEC 61188-5-6   Part 5-6: Components with J leads on four sides                                          MOD
           IEC 61188-5-7   Part 5-7: Components with Post (DIP) mounting leads, two sides                           NWP
           IEC 61188-5-8   Part 5-8: Components with Array Output terminations (BGA, FBGA, LGA)                     CDV
15.6     IEC 61188-6       Part 6: Sectional design and use requirements - Printed Boards and Interconnecting       NST
                           Structures
15.7    IEC 61188-7      Part 7: Sectional design and use requirements - Component mounting and attachment      CDS
15.8    IEC 61188-8      Part 8: Sectional design and use requirements - Evaluation and testing                 NST
15.9    IEC 61188-9      Part 9: Sectional design rules and use requirements - Flexible circuits                NST
15.10   IEC 61188-10     Part 10: Sectional design rules and use requirements - HDI layers and printed boards   NST
15.11   IEC QC 200 012   Process assessment schedule for printed board design facilities                        PUB
Clause   IEC Number         Description                                              TC Responsible: TC91                 Status

16       IEC 61249          Materials for printed boards and other interconnecting structures

16.1     IEC 61249-1        Part 1: Generic specification for materials for interconnecting structures                   PAS/WDN
         IEC 61249-1-1      Part 1-1: Safety assessment of rigid base materials                                           WRK
         IEC 61249-1-2      Part 1-2: Safety assessment of flexible base materials                                        NWP
16.2     IEC 61249-2        Part 2: Sectional specification set for reinforced base materials, clad and unclad            NWP
           IEC 61249-2-1    Part 2-1: Phenolic cellulose paper laminate, economic grade                                   PUB
           IEC 61249-2-2    Part 2-2: Phenolic cellulose paper laminate, high electrical grade                            PUB
           IEC 61249-2-3    Part 2-3: Epoxide cellulose paper laminate                                                     NST
           IEC 61249-2-4    Part 2-4: Polyester non-woven/ woven glass laminate                                           PUB
           IEC 61249-2-5    Part 2-5: Epoxide cellulose paper core/epoxide woven glass surface laminate                   PUB
           IEC 61249-2-6    Part 2-6: Epoxide non-woven/woven glass laminate                                              PUB
           IEC 61249-2-7    Part 2-7: Epoxide woven glass laminate of defined flammability                                PUB
           IEC 61249-2-8    Part 2-8: Multifunctional epoxide woven glass laminate                                        PUB
           IEC 61249-2-9    Part 2-9: Bismaleimide/triazine modified epoxide woven glass laminate                         PUB
           IEC 61249-2-10   Part 2-10: Cyanate ester woven glass laminate                                                 PUB
           IEC 61249-2-11   Part 2-11: Polyimide woven glass laminate                                                     PUB
           IEC 61249-2-12   Part 2-12: Epoxide non-woven aramid laminate                                                  PUB
           IEC 61249-2-13   Part 2-13: Cyanate ester non-woven aramid laminate                                            PUB
           IEC 61249-2-14   Part 2-14: Epoxide woven aramid laminate                                                       NST
           IEC 61249-2-15   Part 2-15: Polyimide woven aramid laminate                                                     NST
           IEC 61249-2-16   Part 2-16: Polyimide woven quartz laminate                                                     NST
           IEC 61249-2-17   Part 2-17: PTFE wiskers/PTFE laminate                                                          NST
           IEC 61249-2-18   Part 2-18: Polyester non woven glass laminate                                                 PUB
           IEC 61249-2-19   Part 2-19: Epoxide cross-plied linear fiberglass laminate                                     PUB
           IEC 61249-2-20   Part 2-20: Epoxide woven glass laminate, general purpose                                       NST
           IEC 61249-2-21   Part 2-21: Nonhalogenated epoxide woven glass laminate of defined flammability                PUB
           IEC 61249-2-22   Part 2-22: Nonhalogenated multifunctional epoxide woven glass laminate                        PUB
           IEC 61249-2-23   Part 2-23: Nonhalogenated phenolic cellulose paper laminate purpose, economic grade           PUB
           IEC 61249-2-24   Part 2-24: Nonhalogenated phenolic cellulose paper laminate purpose, high electrical grade     NST
           IEC 61249-2-25   Part 2-25: Nonhalogenated epoxide cellulose paper core/nonhalogenated epoxide woven            NST
                            glass laminate
           IEC 61249-2-26   Part 2-26: Nonhalogenated epoxide nonwoven/woven glass laminate                               PUB
           IEC 61249-2-27   Part 2-27: Part 2-26: Bismaleimide/triazine modified with nonhalogenated epoxide woven         NST
                            glass laminate
           IEC 61249-2-28   Part 2-28: Polyimide modified with nonhalogenated epoxide woven glass laminate                 NST
           IEC 61249-2-29   Part 2-29: Nonhalogenated epoxide nonwoven aramid laminate of defined flammability             NST
           IEC 61249-2-30   Part 2-30: Nonhalogenated epoxide modified cyanate ester laminate of defined                   NST
                            flammability
           IEC 61249-2-31   Part 2-31: Board materials for high frequency applications – 1                                 NST
           IEC 61249-2-32   Part 2-32: Board materials for high frequency applications – 2                                 NST
           IEC 61249-2-33   Part 2-33: Board materials for high frequency applications – 3                                 NST
           IEC 61249-2-34   Part 2-34: Epoxide woven glass laminate for lead-free assembly
           IEC 61249-2-35   Part 2-35: Multifunctional epoxide woven glass laminate for lead-free assembly
16.3     IEC 61249-3        Part 3: Sectional specification set for unreinforced base materials, clad and unclad
                            (intended for flexible printed boards)
           IEC 61249-3-1    Part 3-1: Flexible copper-clad polyester film, single and double sided                         NST
           IEC 61249-3-2    Part 3-2: Flexible copper-clad polyimide film, single and double sided                         NST
         IEC 61249-3-3    Part 3-3: Adhesive coated flexible polyester film                                             PUB
         IEC 61249-3-4    Part 3-4: Adhesive coated flexible polyimide film                                             PUB
         IEC 61249-3-5    Part 3-5: Transfer adhesive film for flexible printed boards                                  PUB
16.4   IEC 61249-4        Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of
                          multilayer boards)
         IEC 61249-4-1    Part 4-1: Epoxide woven E-glass prepreg                                                       CDV
         IEC 61249-4-2    Part 4-2: Multi functional epoxide woven E-glass prepreg                                      FDIS
         IEC 61249-4-3    Part 4-3: Bismaleimide/triazine modified epoxide woven E-glass prepreg                        NST
         IEC 61249-4-4    Part 4-4: Cyanate ester woven E-glass prepreg                                                 NST
         IEC 61249-4-5    Part 4-5: Polyimide woven E-glass prepreg                                                     FDIS
         IEC 61249-4-6    Part 4-6: Epoxide non-woven aramid prepreg                                                    NST
         IEC 61249-4-7    Part 4-7: Cyanate ester non-woven aramid prepreg                                              NST
         IEC 61249-4-8    Part 4-8: Polyimide woven aramid prepreg                                                      NST
         IEC 61249-4-9    Part 4-9: Polyimide woven S-glass prepreg                                                     NST
         IEC 61249-4-10   Part 4-10: Polyimide woven quartz glass prepreg                                               NST
         IEC 61249-4-11   Part 4-11: Nonhalogenated epoxide woven E-glass prepreg                                       FDIS
         IEC 61249-4-12   Part 4-12: Nonhalogenated multi-functional epoxide woven E-glass prepreg                      FDIS
         IEC 61249-4-13   Part 4-13: Nonhalogenated epoxide non-woven aramid prepreg                                    NST
         IEC 61249-4-14   Part 4-14: Epoxide woven glass for lead-free assembly
         IEC 61249-4-15   Part 4-15: Multifunctional epoxide woven glass for lead-free assembly
16.5   IEC 61249-5        Part 5: Sectional specification set for conductive foils and films with or without coatings

         IEC 61249-5-1    : Part 5-1: Copper Foil (for the manufacture of copper-clad base materials)                   PUB
         IEC 61249-5-2    Part 5-2: Copper/Aluminum Foil                                                                NST
         IEC 61249-5-3    Part 5-3: Coated Conductive Foils                                                             NST
         IEC 61249-5-4    Part 5-4: Conductive Inks                                                                     PUB
         IEC 61249-5-5    Part 5-5: Nickel Foil                                                                         NST
         IEC 61249-5-6    Part 5-6: Iron Foil                                                                           NST
16.6   IEC 61249-6        Part 6: Sectional specification set for reinforcement materials

         IEC 61249-6-1    Part 6-1: Cellulose paper                                                                     NST
         IEC 61249-6-2    Part 6-2: Nonwoven E-glass                                                                    NST
         IEC 61249-6-3    Part 6-3: Woven E-glass                                                                       CDV
         IEC 61249-6-4    Part 6-4: Woven S-glass                                                                       NST
         IEC 61249-6-5    Part 6-5: Nonwoven aramid                                                                     NST
         IEC 61249-6-6    Part 6-6: Woven aramid                                                                        NST
         IEC 61249-6-7    Part 6-7: Woven quartz                                                                        NST
         IEC 61249-6-8    Part 6-8: Woven PTFE                                                                          NST
         IEC 61249-6-9    Part 6-9: PTFE fibres                                                                         NST
         IEC 61249-6-10   Part 6-10: Carbon fibres                                                                      NST
16.7   IEC 61249-7        Part 7: Sectional specification set for restraining core materials

         IEC 61249-7-1    Part 7-1: Copper invar copper                                                                 PUB
         IEC 61249-7-2    Part 7-2: Copper molybdenum copper                                                            NST
         IEC 61249-7-3    Part 7-3: Oxidized aluminum                                                                   NST
         IEC 61249-7-4    Part 7-4: Oxidized copper                                                                     NST
16.8   IEC 61249-8        Part 8: Sectional specification set for nonconductive films and coatings

         IEC 61249-8-1    Part 8-1: Polyurethane coatings                                                               NST
         IEC 61249-8-2    Part 8-2: Silicon coatings                                                                    NST
         IEC 61249-8-3    Part 8-3: Acrylic coatings                                                                    NST
            IEC 61249-8-4      Part 8-4: Epoxide coatings                                                                       NST
            IEC 61249-8-5      Part 8-5: Permanent polymer coatings and films (solder mask)                                     NST
            IEC 61249-8-6      Part 8-6: Paraxylene coatings, vacuum deposited                                                  NST
            IEC 61249-8-7      Part 8-7: Marking legend inks                                                                    PUB
            IEC 61249-8-8      Part 8-8: Temporary polymer coatings and films (solder mask)                                     PUB
16.9     IEC 61249-9           Part 9: Sectional specification set for ceramic materials                                        NST

16.10    IEC 61249-10          Part 10: Sectional specification set for auxiliary materials                                     NST

16.11    IEC QC 200 xxx        Process assessment schedule for printed board base material                                      NST



Clause   IEC Number            Description                                                          TC Responsible: TC91       Status

17       IEC 62326             Printed board performance for capability approval

17.1     IEC 62326-1           Printed boards - Part 1: Generic specification                                                   PUB
17.2     IEC 62326-2(62158)    Part 2: Quality assessment of printed board fabrication capability (PAS 62158)                 PAS/WDN
17.3     IEC 62326-3           Part 3: Safety certification of printed boards (based on UL 796)                                 CDV
                               To be separate documents for test methods and performance indices
17.4     IEC 62326-4           Part 4: Rigid multilayer printed boards with interlayer connections; Sectional specification     PUB
           IEC 62326-4-1       Part 4-1: Rigid multilayer printed boards with interlayer connections; Capability detail         PUB
                               specification. Performance levels A, B and C
17.5     IEC 62326-5(62213)    Part 5: Generic performance specification for printed boards (IPC-6011)                        PAS?WDN
17.6     IEC 62326-6(62214)    Part 6: Quality and performance specification for rigid printed boards (IPC-6012) PAS          PAS/WDN
17.7     IEC 62326-7(62249)    Part 7: Quality and performance specification for flexible printed boards (IPC-6013) PAS       PAS/WDN
17.8     IEC 62326-8           Part 8: Quality and performance specification for PC card printed boards (IPC-6014)              NST
17.9     IEC 62326-9           Part 9: Quality and performance specification for organic multichip modules (MCML) (IPC-         NST
                               6015)
17.10    IEC 62326-10(62293)   Part 10: Quality and performance specification for High Density interconnect layers and          PAS
                               printed boards (IPC-6016)
17.11    IEC 62326-11          Part 11: Safety certification for flexible printed boards (based on UL 796F)                     NST
17.12    IEC 62326-12          Part 12: Qualification and performance for high density interconnect HDI layers or boards        NST
                               (based on IEC/PAS 62293)
17.13    IEC 62326-13          Part 13: Build-up materials and processes (JIEP)                                                 NST



Clause   IEC Number            Description                                                           TC Responsible: TC91      Status

18       IEC 61190             Materials used in the manufacture and assembly of printed board electronic
                               assemblies
18.1     IEC 61190-1           Part 1: Attachment materials for electronic assemblies
            IEC 61190-1-1      Part 1-1 Attachment materials; Requirements for soldering fluxes                                 PUB
            IEC 61190-1-2      Part 1-2 Attachment materials; Requirements for soldering pastes                                 CDS
            IEC 61190-1-3      Part 1-3 Attachment materials; Requirements for electrical grade solder alloys and fluxed        CDS
                               and non-fluxed solid solder
            IEC 61190-1-4      Part 1-4 Attachment materials; Requirements for conductive adhesives                             NST
            IEC 61190-1-5      Part 1-5 Attachment materials; Requirements for non-conductive adhesives                         NST
            IEC 61190-1-6      Part 1-6 Requirements for electronic grade lead free solder alloys and fluxed and non-           CNL
                               fluxed
            IEC 61190-1-7      Part 1-7: Requirements for lead free solder pastes for high quality interconnections             CNL
18.2     IEC 61190-2           Part 2: Cleaning materials                                                                       NST
Clause   IEC Number       Description                                             TC Responsible: TC91                   Status

19       IEC 61191        Printed board assembly requirements

19.1     IEC 61191-1      Part 1: Generic standard, requirements for soldered electrical and electronic assemblies       MOD
                          standard, using surface mount and related assembly technologies
19.2     IEC 61191-2      Part 2: Sectional standard, requirements for surface mount assembly                            MOD
19.3     IEC 61191-3      Part 3: Sectional standard, requirements for pin and hole solder connections                   MOD
19.4     IEC 61191-4      Part 4: Sectional standard, requirements for terminal solder connections                       MOD
19.5     IEC 61191-5      Part 5: Sectional standard, requirements for Laser Soldering or Welding                         NST



Clause   IEC Number       Description                                             TC Responsible: TC91                   Status

20       IEC 61192        Product performance requirements

20.1     IEC 61192-1      Part 1: Generic standard; workmanship requirements and guidelines for soldered electrical      MOD
                          and electronic assemblies
20.2     IEC 61192-2      Part 2: Sectional Standard; workmanship requirements and guidelines for soldered surface       MOD
                          mount assembly
20.3     IEC 61192-3      Part 3: Sectional standard; workmanship requirements and guidelines for through-hole           MOD
                          soldered assembly
20.4     IEC 61192-4      Part 4: Sectional standard; workmanship requirements and guidelines for terminal and wire      MOD
                          soldered assembly
20.5     IEC 61192-5      Part 5: Sectional standard; workmanship requirements for modification and repair of            CDV
                          electronic assemblies
20.5     IEC 61192-6      Part 6: Guide to the rework of unassembled boards                                              NPW



Clause   IEC Number       Description                                             TC Responsible: TC91                   Status

         IEC 6XXXX        Marking, Symbols,

         IEC 6XXXX-1      Marking, Symbols and Labels for identification of led-free and other reportable materials in   NWP
                          lead-free assemblies, components and devices
         IEC 6XXXX-2




Clause   IEC Number       Description                                             TC Responsible: TC91                   Status

21       IEC XXXXX        Electronic assembly component characterisation and guidelines

21.1     IEC 61760        Surface mount component specification requirements
            IEC 61760-1   Part 1: Standard method for the specification for surface mounting components (SMDs)           MOD
            IEC 61760-2   Part 2: Transportation and storage conditions of surface mounting devices (SMDs) -             MOD
                          Application Guide
21.2     IEC 61761        Generic Specification - Capability approval of surface mount technologies                      CDS
21.3     IEC 62090        Bar code label marking for packaging of electronic components                                  MOD



Clause   IEC Number       Description                                             TC Responsible: TC91                   Status

21       IEC XXXXX        Electronic assembly component characterisation and guidelines

21.2     IEC 62421        Electronic Modules – Generic standards                                                         NWP
Clause   IEC Number           Description                                             TC Responsible: TC91       Status

22       IEC XXXXX            Test Methods and Quality Assessment

22.1     IEC 61189            Test methods for electrical materials, interconnection structures and assemblies

            IEC 61189-1       Part 1: General test methods and methodology                                       MOD
            IEC 61189-2       Part 2: Test methods for printed board and assembly materials (IEC 249-1)          MOD
            IEC 61189-3       Part 3: Test methods for printed boards (IEC 326-2)                                MOD
            IEC 61189-4       Part 4: Test methods for electronic components assembling characteristics           NST
            IEC 61189-5       Part 5: Test methods for printed board assemblies                                  CDV
            IEC 61189-6       Part 6: Test methods for materials used in electronic assemblies                   CDV
            IEC 61189-7-1     Part 7-1: Test methods for software implementation of EDA and EMA standards        NPW
            IEC 61189-7-2     Part 7-2: Testing of mechanical characteristics                                    NPW
            IEC 61189-8       Part 8: Test methods for printed board flammability                                 NST
            IEC 61189-9       Part 9: High Frequency test methods for printed board                               NST
            IEC 61189-10      Part 10: Technical Report on Test Methods of Ion Migration in Boards                NST
22.2     IEC 62137            Surface mount technology – Environmental and endurance test methods                WRK
                              for area array packages and bare die on mounting conditions
         IEC 62137-1-1        Part 1-1: Test x - Methods of peel strength test                                   CDS
         IEC 62137-1-2        Part 1-2 Test x Method of shear type strength test                                 CDS
         IEC 62137-1-3        Part1- 3: cyclic drop test                                                         NPW
         IEC 62137-1-4        test methods for bare dies / bumped dies                                           NPW
         IEC 62137-2-1        Fillet lifting evaluation                                                           NST
         IEC 62137-2-2        Pull strength                                                                       NST
         IEC 62137-2-3        Creep strength                                                                      NST
         IEC 62137-3          Environmental and endurance tests for FBGA, BGA, LGA, SON, QFN                      NST
         IEC 62137-4          Environmental and endurance tests for bare die                                     VDV



Clause   IEC Number           Description                                             TC Responsible: TC91       Status

         IEC 60068            Environmental testing

         IEC 60068-2-         Environmental testing

            IEC 60068-2-20    Solderability and resistance to soldering heat of leaded devices                   MOD
            IEC 60068-2-21    Test U : Robustness of terminations and integral mounting devices                  MOD
            IEC 60068-2-44    Test T : Soldering                                                                 PUB
            IEC 60068-2-54    Test Ta –Solderability testing of electronic components by the wetting             MOD
            IEC 60068-2-58    Test Td - Test methods for solderability, resistance to dissolution of             MOD
                              metallization and to soldering heat of surface mounting devices (SMD)
            IEC 60068-2-69    Test Te - Solderability of electronic components for surface mount                 MOD
                              technology by the wetting balance method
            IEC 60068-2-77                                                                                       PUB
            IEC 60068-2-82    Test Tx- Whisker test methods for electronic and electric components               CDS
                              terminals
            IEC 60068-2-XX    Part x: test x Test methods for electrochemical migration for using                NWP
                              lead free terminals
            IEC 60068-2-XX    New soldering test method                                                           NST
            IEC 60068-2-580   TR: Method to evaluate a possible lead-free reflow temperature profile             WRK
Clause   IEC Number         Description                                                TC Responsible: TC91/TC86   Status

         IEC 6XXXX          Optoelectronic Assembly Technology

         IEC 6XXXX-1-       Optical boards

            IEC 6XXXX-1-1   Detail Specification for Flexible Optical Board using Glass Fiber                      NWP
            IEC 6XXXX-1-2   Detail Specification for Rigid Optical Board using Planar Waveguide                    NWP
            IEC 6XXXX-1-3   2nd ed. Optical Connector for Rigid Optical Board using Planar Waveguide                NST
            IEC 6XXXX-1-4
         IEC 6XXXX-2        Connectors used for Optical boards assembly

            IEC 6XXXX-2-1   Detail Specification for Optical Board Connector type SF using glass                   NWP
                            Fibers
            IEC 6XXXX-2-2   Detail Specification for Right-angled Optical Board Connector using                    NWP
                            Glass Fibers
            IEC 6XXXX-2-3   Detail Specification for Optical Board Connector type MF using Glass                    NST
                            Fibres
            IEC 6XXXX-2-4   Detail Specification for Optical Board Connector type PT using Glass Fibres             NST
            IEC 6XXXX-2-5
         IEC 6XXXX-3        Test methods related to Optical boards

            IEC 6XXXX-3-1   Test Methods for Polymeric Optical Waveguides                                           NST
            IEC 6XXXX-3-2   Sectional Specification of Test Method for Rigid        Optical Board using Planar      NST
                            Waveguide
            IEC 6XXXX-3-3   Test Method for Rigid Optical Board using Polymeric     Optical Waveguide               NST
            IEC 6XXXX-3-4
         IEC 6XXXX-4        Optoelectronic modules for optoelectronic assembly

            IEC 6XXXX-4-1   Generic Specification for OE-Module Substrates                                          NST
            IEC 6XXXX-4-2   Generic Specification for Packaging Interface of OE-Modules                             NST
            IEC 6XXXX-4-3   Generic rules for Optoelectronic Modules                                                NST
            IEC 6XXXX-4-4   Detail Specification for OE-module with PT Optical Connector Interface                  NST
            IEC 6XXXX-4-5   Guidance for Thermal Management of OE Module using Comb-style Parallel Plate Fin        NST
                            Heat Sink
            IEC 6XXXX-4-6
         IEC 6XXXX-5        Optoelectronic assembly and related technology

            IEC 6XXXX-5-1   Cleaning Methods and Contamination Assessment for Optical Assembly、                    WRK
                            IPC/JPCA 8497-1
            IEC 6XXXX-5-2   Attachment Materials for Optoelectronic Assembly Level 1, IPC-8414-1                    NST
            IEC 6XXXX-5-3   Attachment Materials for Optoelectronic Assembly Level 2, IPC-8414-2                    NST
            IEC 6XXXX-5-4   Adhesive Attachment Materials for Optoelectronic Assembly, IPC-8494-1                   NST
            IEC 6XXXX-5-5   Epoxy Attachment Materials for Optoelectronic Assembly, IPC-8494-2                      NST
            IEC 6XXXX-5-6   Solder Attachment Materials for Optoelectronic Assembly, IPC-8494-3                     NST
            IEC 6XXXX-5-7   Primer Attachment Materials for Optoelectronic Assembly, IPC-8494-4                     NST
            IEC 6XXXX-5-8   Coating Materials for Optoelectronic Assembly, IPC-8494-5                               NST
            IEC 6XXXX-5-9

                                                                               Reproduced in Switzerland
                                                                               Central Office of the IEC
                                                                               3, rue de varembé
                                                                               GENEVA
Connector type PT using Glass Fibres             NST
            IEC 6XXXX-2-5
         IEC 6XXXX-3        Test methods related to Optical boards

            IEC 6XXXX-3-1   Test Methods for Polymeric Optical Waveguides                                           NST
            IEC 6XXXX-3-2   Sectional Specification of Test Method for Rigid        Optical Board using Planar      NST
                            Waveguide
            IEC 6XXXX-3-3   Test Method for Rigid Optical Board using Polymeric     Optical Waveguide               NST
            IEC 6XXXX-3-4
         IEC 6XXXX-4        Optoelectronic modules for optoelectronic assembly

            IEC 6XXXX-4-1   Generic Specification for OE-Module Substrates                                          NST
            IEC 6XXXX-4-2   Generic Specification for Packaging Interface of OE-Modules                             NST
            IEC 6XXXX-4-3   Generic rules for Optoelectronic Modules                                                NST
            IEC 6XXXX-4-4   Detail Specification for OE-module with PT Optical Connector Interface                  NST
            IEC 6XXXX-4-5   Guidance for Thermal Management of OE Module using Comb-style Parallel Plate Fin        NST
                            Heat Sink
            IEC 6XXXX-4-6
         IEC 6XXXX-5        Optoelectronic assembly and related technology

            IEC 6XXXX-5-1   Cleaning Methods and Contamination Assessment for Optical Assembly、                    WRK
                            IPC/JPCA 8497-1
            IEC 6XXXX-5-2   Attachment Materials for Optoelectronic Assembly Level 1, IPC-8414-1                    NST
            IEC 6XXXX-5-3   Attachment Materials for Optoelectronic Assembly Level 2, IPC-8414-2                    NST
            IEC 6XXXX-5-4   Adhesive Attachment Materials for Optoelectronic Assembly, IPC-8494-1                   NST
            IEC 6XXXX-5-5   Epoxy Attachment Materials for Optoelectronic Assembly, IPC-8494-2                      NST
            IEC 6XXXX-5-6   Solder Attachment Materials for Optoelectronic Assembly, IPC-8494-3                     NST
            IEC 6XXXX-5-7   Primer Attachment Materials for Optoelectronic Assembly, IPC-8494-4                     NST
            IEC 6XXXX-5-8   Coating Materials for Optoelectronic Assembly, IPC-8494-5                               NST
            IEC 6XXXX-5-9

                                                                               Reproduced in Switzerland
                                                                               Central Office of the IEC
                                                                               3, rue de varembé
                                                                               GENEVA

				
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