High Reliability: Solving Problems with Reliability in the Lead-Free Era Authors: Cheryl Tulkoff, Senior Member of the Technical Staff, DfR Solutions Randy Schueller, Senior Member of the Technical Staff, DfR Solutions Abstract: This tutorial provides a focused but comprehensive discussion on potential reliability issues that can arise within Pb-free processes. Targeted areas of potential risk are examined in detail including the latest PCB surface finishes, CAF and pad cratering, cleanliness, and new solder alloys. For each reliability concern, a brief description is provided, followed by the current state of industry knowledge and an opportunity for risk mitigation based upon the product design, materials, complexity, volumes, and customer expectations of reliability. A final summary provides the attendees a roadmap for ensuring the reliability of Pb-free product. Who Should Attend: Recommended attendees include personnel responsible for or managers of new product introduction (NPI), component engineering, quality control, design and packaging, product and technology qualification, manufacturing processes, and failure analysis. What will be covered: Quick Refresher: SAC background & alternative alloys Why did SAC305 become the standard LF alloy? The Current State of Lead Free: PCBs Surface Finishes Laminate Cracking & Delamination PTH Barrel Cracking & CAF (Conductive Anodic Filament) Pad Cratering Electro-Chemical Migration (ECM) Components Suppliers Concerns Robustness Temperature Sensitivity Moisture Sensitivity Drivers Components of specific interest Solders Discussion of 2nd gen alloys Intermetallic formation Copper Dissolution Mixed Assembly Wave and Rework LF Solder Fountain Hole Fill Challenges Reliability Results Shock/Drop Test Results Vibration Results Results of alternative alloys Fatigue (Shock & Vibration) Microstructural Stability HALT/HASS Conclusions Instructor Biography Cheryl Tulkoff has over 15 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs. Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She holds leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years and is also an ASQ Certified Reliability Engineer. She has a strong passion for pre-college STEM (Science, Technology, Engineering, and Math) outreach and volunteers with several organizations that specialize in encouraging pre-college students to pursue careers in these fields.
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