High Reliability Solving Problems with Reliability in the Lead-Free .pdf by censhunay

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									               High Reliability: Solving Problems with Reliability in the Lead-Free Era

Authors:
Cheryl Tulkoff, Senior Member of the Technical Staff, DfR Solutions
Randy Schueller, Senior Member of the Technical Staff, DfR Solutions

Abstract:
This tutorial provides a focused but comprehensive discussion on potential reliability issues that can arise
within Pb-free processes. Targeted areas of potential risk are examined in detail including the latest PCB
surface finishes, CAF and pad cratering, cleanliness, and new solder alloys. For each reliability concern,
a brief description is provided, followed by the current state of industry knowledge and an opportunity for
risk mitigation based upon the product design, materials, complexity, volumes, and customer
expectations of reliability. A final summary provides the attendees a roadmap for ensuring the reliability of
Pb-free product.

Who Should Attend:
Recommended attendees include personnel responsible for or managers of new product introduction
(NPI), component engineering, quality control, design and packaging, product and technology
qualification, manufacturing processes, and failure analysis.

What will be covered:
Quick Refresher:
       SAC background & alternative alloys
       Why did SAC305 become the standard LF alloy?

The Current State of Lead Free:
       PCBs
              Surface Finishes
              Laminate Cracking & Delamination
              PTH Barrel Cracking & CAF (Conductive Anodic Filament)
              Pad Cratering
              Electro-Chemical Migration (ECM)

        Components
              Suppliers
              Concerns
                      Robustness
                      Temperature Sensitivity
                      Moisture Sensitivity
              Drivers
              Components of specific interest

        Solders
               Discussion of 2nd gen alloys
               Intermetallic formation
               Copper Dissolution
               Mixed Assembly
       Wave and Rework
               LF Solder Fountain
               Hole Fill Challenges
Reliability Results
               Shock/Drop Test Results
               Vibration Results
               Results of alternative alloys
               Fatigue (Shock & Vibration)
               Microstructural Stability
               HALT/HASS
Conclusions
Instructor Biography
Cheryl Tulkoff has over 15 years of experience in electronics manufacturing with an emphasis on failure
analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with
semiconductor fabrication processes, into printed circuit board fabrication and assembly, through
functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has
also managed no clean and RoHS-compliant conversion programs and has developed and managed
comprehensive reliability programs.

Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published
author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She holds
leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE
ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR
workshop for four years and is also an ASQ Certified Reliability Engineer.

She has a strong passion for pre-college STEM (Science, Technology, Engineering, and Math) outreach
and volunteers with several organizations that specialize in encouraging pre-college students to pursue
careers in these fields.




 

								
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