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					Types of IC in the phone there are 2:

• The first is IC BGA (ball-ball tin)
• and the second is the IC SMD (centipede)

I. IC PA (Power Amplifier)

The types of IC PA
• IC cans PA
• IC ceramic PA
• PA SMD IC (legs)
• IC PA similar synthetic / rubber (highly flammable if heated)

Literature damage caused by IC PA:
• No signal
• The signal is not stable
• Call ended / failed phone
• The signal disappeared suddenly (when the first ON appears on the bar sinayl looks full but
suddenly disappears total)
• Signal is intermittent
• Power of sending (died while making a call)
• Power Off Receive (dead when received a call)
• Looks at the operator side display an exclamation point (!)
• wasteful batteries
• Total death in case of short

PA IC characteristics:
• There are arrows on the IC
• The location of the position of IC are usually found at the top of the phone PCB
• The location of the position of IC are usually side by side with the antenna switch

2.Switch Antenna

Characteristics of Antenna Switch:
• A small box berkaleng without feet on the bottom and side
• Usually has always co-exist with IC PA
• The location of the position of IC are usually found at the top of the phone PCB

Literature damage caused by the switch Antenna:
• No signal
• Signal is weak (weak signal appears at the bar)
• Only the operator can be specified.

3. IC RF (radio frequency) / IF IC

Characteristics of the RF IC
To type Nokia
- For the DCT series Hagar -3 inscribed on the top of the IC
- For the new series are written or Helga M jolner
- Location of IC is usually in the middle position on the phone PCB
- Location of the position generally adjacent to the IC crystals
For other type
- Usually this is the IC SMD IC (foot centipede)

Literature damage caused by the RF IC
-No signal
- Weak Signal
- Signal is not stable
- Signal lost suddenly (when the first ON signal full bar appears at the sudden loss of total)
- Power Of sending (died when used for phone calls)
- Power off receive (when received telephone death)
- Hank
- Total death if there is no system clock 13MHz

4. CRYSTAL
Characteristics of Crystals
- Location of the position generally adjacent to the RF IC
- This component is usually small cans berplat

Literature damage caused by KRISTAL
- No signal
- Signal is not stable
- Restart the phone
- Phone totally dead if this component is damaged

5. TX and RX filters

Characteristics of the TX and RX filters
- A small box can usually yellow
- Location of position is usually at the top center on the phone PCB

Literature damage caused by the TX and RX filters
- The voice cut off - break during use to communicate
- Can also result in no signal, especially in the rx filter 1800

6. VCO (Voltage Control Oscillator)

Characteristics of the VCO
- The box can have a foot below berplat
For nokia type usually found at the top of the FDK writing component
Literature damage caused by the VCO
- No signal
- Failed to find network
Article Source: Indonesia Phone Technicians Forum http://www.forum-
handphone.com/showthread.php?t=1561

7. IC AUDIO FREQUENCY

IC AUDIO CHARACTERISTIC Frequency
- Location of the position of IC is usually at the center of the PCB phones
- Location of the position of IC is usually adjacent to the IC POWER
- Audio IC is usually an IC BGA but the old phone is still SMD series
- The trademark NOKIA for the duration of the series are written COBBA so-called technicians
among the IC COBBA

Literature damage caused by the IC AUDIO frequencies
- There is no signal
- Weak Signal
- Signal is not stable (down - up)
- Switch ON signal is full but suddenly lost a total of
- No sound sent
- There is no audible sound
- Blank LCD
- Hank
- CONTACT SERVICE
- Sim card rejected

8. IC POWER
IC POWER CHARACTERISTICS
- Location of the position of IC is usually at the center of the PCB
- Location of the position generally adjacent to the IC IC Audio frequency
- POWER IC is usually an IC BGA but the old phone is still SMD series
- The trademark NOKIA for the duration of the series are among technicians and writings
CCONT CCONT called IC, for his new series occurred blend of power IC, audio IC and IC
charging so-called UEM
Article Source: Indonesia Phone Technicians Forum http://www.forum-
handphone.com/showthread.php?t=1561
- On the technicians trademark SIEMENS IC call to DIALOG

Literature damage caused by IC POWER

- Phone totally dead
- Low standby (phone off in standby)
- There is no signal
- Restart (auto and off)
- Insert the sim card (although the sim card has been inserted)
- Unable to charge
- Automatic Charge
- Replenishment
- Boros batteray
- Power of when it is used for telephone
- Power of when it is used to receive incoming calls

9. CPU (Central Processing Unit)
Characteristics of the CPU:
- Usually the largest IC and serrated
- Location of IC are usually found at the bottom of the phone PCB
- Location of IC is usually adjacent to the IC eeprom / memory
- In the series of new mobile CPU is BGA IC

Literature damage caused by the CPU
- The keypad is not working or hank
- Hank on the phone menu
- Blink on the screen (LCD) phone
- No signal
- There is no ring on your phone
- LED lights are not lit
- Phone totally dead
- And most of the damage to the phone comes down to the IC CPU

10. EEPROM (electrically erasable programmable read only memory) / MEMORY

Characteristics of EEPROM
- Location of IC are usually found at the bottom of the phone PCB
- Location of IC is usually adjacent to the CPU
- Form IC is usually more flat or thin
- In a series of new phones EEPROM IC BGA

Literature damage caused by EEPROM
- Hank on the phone menu
- Missing one of the menus on the phone
- Blink on the phone LCD screen
- Start up a long time on the phone
- Restart (auto live)
- No signal due to missing data
- Total death and destruction caused by missing data IC

11. UI (user interface)
Characteristics of IC UI
- This form is usually an IC SMD IC (legs)
- Location of IC is usually on the bottom PCB phones.

Literature IC damage caused by UI:
- LED lights on lcd dead
- LED lights on the keypad off
- Vibrate does not work
- Ring not working

12. Charging IC
Charging Characteristics of IC
- A small box-shaped BGA IC
- Where the IC is usually at the bottom of the phone PCB and adjacent to the Plug in charging.

Literature damage caused by the charging IC:
- Unable to charge
- Automatic Charge
- Replenishment (reconnect charging)
- Drop the battery in the event of koslet
- Charge for too long but did not charge the battery.

				
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