Latent Catalyst For Epoxy Resin, Epoxy Resin Composition, And Semiconductor Device - Patent 8148831

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Latent Catalyst For Epoxy Resin, Epoxy Resin Composition, And Semiconductor Device - Patent 8148831 Powered By Docstoc
					
				
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Description: The present invention relates to a latent catalyst for epoxy resin, an epoxy resin composition, and a semiconductor device.BACKGROUND OF THE INVENTION For a method of producing semiconductor devices by encapsulating semiconductor chips, such as IC or LSI, transfer molding with an epoxy resin composition is suitable as it is inexpensive and applicable to industrial mass production of thedevices, and is widely employed in the art. The properties and the reliability of semiconductor devices are being improved by improving epoxy resin and its curing agent, phenolic resin. However, with the recent market tendency toward small-sized, lightweight and high-performance electronic appliances, the degree of integration of semiconductors for such appliances is increasing year by year, and surface mounting ofsemiconductor devices is promoted. Given that situation, the prerequisites for the epoxy resin composition for use in encapsulating semiconductor chips are being much severer. Accordingly, there have occurred some problems that could not be solved byconventional epoxy resin compositions. These days the materials for encapsulating semiconductor chips are required to have high flowability that is not detracted from by the inorganic filler to be added thereto in a large amount for improving the rapid curability thereof so as toimprove the production efficiency and for improving the heat resistance and the reliability of encapsulated semiconductors. An addition reaction product of a tertiary phosphine and a quinone that has good rapid curability is added as a curing accelerator to epoxy resin compositions for use in the filed of electric and electronic materials, for the purpose ofaccelerating the curing reaction of the curing resins (see, e.g., Patent Document 1). Regarding the temperature range thereof, the curing accelerator of such a type may exhibit its curing acceleration effect even at relatively low temperatures. Therefore, though slightly, the curing reaction is ac