Date
10/17/2006
Qualification Plan # 2205-10-17-2006-548
Mask Rev Mold Cmpd: YM-V1R3 G770H Package Pkg Suppl: Burn-in Ckt: 3 3 LQ44-16 (CS,CM) BI2205LQ 4 4
Group Definition
1
New Device Design Device Die Attach Lead Finish: Lot Number Date Code 1 1 2205 QMI 519 Matte Tin (Sn) ESGD1088-R1 0639C Process Pretest Pgm: Posttest Pgm: 5 5 Hynix 0.5um S2205B_FT S2205B_QA 6 6 BondWire Au 1.3
Bond Diagram BD2205/YM-LQ 2 2 ESGD1089-R1 0637K
ESGD1090-R1B 0639C
Life Test
Qual Num
2006-RM-183 2006-RM-184 2006-RM-185
Lot
ESGD1088-R1 ESGD1089-R1 ESGD1090-R1B
Condition
135 135 135
Hrs/Cycles Plan Actual
500hrs 500hrs 500hrs 500 500 500
Start
11/8/2006 12/15/2006 11/8/2006
End
12/15/2006 1/8/2007 12/14/2006
S/S
50 50 50
Rej Notes:
0 Passed 0 Passed 0 Passed
Thermal Shock
Qual Num
2006-RM-184
Lot
ESGD1089-R1
Condition
-55C to +125C
Hrs/Cycles Plan Actual
100 cycles 100
Start
1/26/2007
End
1/29/2007
S/S
50
Rej Notes:
0 Passed
Temperature Cycle
Qual Num
2006-RM-184
Lot
ESGD1089-R1
Condition
-65C to +150C
Hrs/Cycles Plan Actual
100 cycles 100
Start
1/9/2007
End
1/20/2007
S/S
50
Rej Notes:
0 Passed
Autoclave
Qual Num
2006-RM-184
Lot
ESGD1089-R1
Condition
121C, 15 psig
Hrs/Cycles Plan Actual
96 hours 97
Start
1/16/2007
End
1/22/2007
S/S
50
Rej Notes:
0 Passed
ESD
Qual Num
Latchup
Lot
SGDO869
ESD Model
HBM
Pass Volt
2500V
Fail Volt
N/A
Start
6/22/06
End
6/22/06
S/S
3
Rej
0
Qual Num
Physical Dimensions
Lot
SGDO869
Condition
JESD78
Start
6/22/06
End
6/22/06
S/S
6
Rej Notes:
0 Passed
Qual Num
2006-RM-184
Lot
ESGD1089-R1
Condition
SGQ1044
Start
1/23/2007
End
1/25/2007
S/S
3
Rej Notes:
0 Passed
Marking Permanency
Qual Num
2006-RM-184
Lot
ESGD1089-R1
Condition
SGQ1038
Start
11/8/2006
End
11/8/2006
S/S
Rej Notes
Laser marked
Solderability
Qual Num
2006-RM-184
Lot
ESGD1089-R1
Condition
SGQ1041
Start
11/8/2006
End
12/29/2006
S/S
22
Rej Notes:
0 Passed
Date
10/17/2006
Qualification Plan # 2205-10-17-2006-548
Group Definition
1
New Device Design
Moisture Sensitivity
Qual Num
2006-RM-184
Lot
ESGD1089-R1
Condition
JSTD-020B
Start
11/10/2006
End
1/9/2007
S/S
12
Rej Notes:
0 Passed Pb free MSL level 1
Construction Analysis
Qual Num
2006-RM-184
Condition
SGQ1343
CA Report #
40297
CA By
Photometrics
Start
11/8/2006
End
11/28/2006
S/S
Rej Notes:
Approved by Michelle Hazard
Supporting Data:
1701-3-24-2004-165QualificationReport LX2205_Carsem_16Ld_MLPQ_4x4_PbFree (Construction Analysis Report)
Comments:
New design in a qualified package.
Signatures:
Digitally signed by Dat Nguyen DN: cn=Dat Nguyen, c=US, o=Microsemi Corporation Date: 2007.01.29 13:44:35 -08'00'
Digitally signed by Andy Nguyen DN: cn=Andy Nguyen, c=US, o=Microsemi Corporation Date: 2007.01.29 17:20:13 -08'00'
Jonathan Tong 2007.01.29 13:16:26 -08'00'
Reliability Manager
Responsible Engineer
Responsible Engineering Manager