IITC 2010 lead release Final

							    June 7-9, 2010 Hyatt Regency San Francisco Airport Hotel Burlingame, CA
                          http://www.ieee.org/conference/iitc

Editor Contacts:
Chris Burke or Garth Miller
BtB Marketing Communications
919.872.8172
cburke@btbmarketing.com or
gmiller@btbmarketing.com                                     For Immediate Release


Intel’s Mark Bohr to deliver keynote address on system scaling. . .

       IEEE International Interconnect Technology Conference
      To Showcase Advances in Integrated Circuit Connectivity;
   Special Focus on 3D, Memories and Advanced CMOS Technology
BURLINGAME, CA (March 25, 2010) -- The 13th annual IEEE International
Interconnect Technology Conference (IITC) and product exhibition will present one of
the conference’s strongest technical programs in years, with 70 papers addressing all
major developments in the field. Although the design and engineering of interconnections
on integrated circuits is a specialized discipline, advances such as those to be reported on
at IITC are critical to the continuing progress of the overall electronics industry.

        The conference will be held June 7-9 at the Hyatt Regency San Francisco Airport
Hotel in Burlingame, CA. It will be preceded by a day-long Short Course on leading-
edge interconnect technologies on Sunday, June 6. The popular supplier seminar series
will continue on the first two nights of the conference.

        Mark Bohr, Intel Senior Fellow and the company’s Director of Process
Architecture and Integration, will give the keynote presentation on the topic System
Scaling: The Real Goal. He will address a recent shift in the goals for the semiconductor
industry, from simply making ever-smaller transistors or chips with higher transistor
counts, to integrating more and different systems into small packages for overall
increased performance and power efficiency.

        “We are extremely gratified with the response to our Call for Papers seeking high-
quality work in all areas of the interconnect field, with a special focus on 3D
architectures, memories and new materials. These will be presented in addition to papers
on core interconnect topics, from the best and the brightest people in the field,” said
Michael Armacost, IITC 2010 Publicity Chair and Managing Director at Applied
Materials, Inc. “The IITC conference is a premier forum for specialists and suppliers
globally to come together to discuss, demonstrate and exhibit advanced interconnect
techniques, materials, architectures and processes that shed light on the best ways
forward.”
IITC 2010 Lead Release
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        The conference attracts professionals in semiconductor processing, interconnect
design, academia and equipment development. The traditional U.S. venue is now one of
three international locations for the technology conference, which now alternates between
a US location and Asia or Europe. IITC 2009 was held in Sapporo, Japan, while next year
IITC will take place in Dresden, Germany, from May 9-13, 2011 in conjunction with the
Materials for Advanced Metallization (MAM) conference.

       The IITC conference’s website is http://www.ieee.org/conference/iitc. For
additional information and inquiries, interested persons may contact Wendy Walker at
Widerkehr & Associates, 19803 Laurel Valley Place, Montgomery Village, MD 20886
USA; tel. +1-301-527-0900 ext 3; fax. +1-301-527-0994; e-mail iitc@his.com

About the IEEE
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than 850 conferences worldwide. Learn how the IEEE fosters technological innovation
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