PLX TECHNOLOGY QUARTERLY MONITOR REPORT RELIABILITY TEST Q1, 2009: Rev. 1
PROCESS TECHNOLOGY MATRIX
FOUNDRY FAB TSMC, Taiwan Seiko Epson, Japan NEC, Japan PROCESS TECHNOLOGIES 0.09, 0.13, 0.18, 0.25, 0.35, 0.50 μm CMOS 0.35 and 0.6 μm, CMOS 0.15, 0.25, 0.35 μm CMOS
DIE RELIABILITY DATA OUTLINE HTOL (IFR/EFR) ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC, Japan Seiko-Epson, Japan STATS ChiPAC, Korea STATS ChiPAC, Singapore UTAC, Singapore PACKAGE TECHNOLOGIES PBGA, HSBGA, FCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA HSBGA PQFP PQFP, EPQFP
PACKAGE RELIABILITY DATA OUTLINE TCT THBT/HAST PCT
RELIABILITY HTOL DATA @125 °C
FOUNDRY: TSMC Taiwan, Process: 0.09 µm Low-K CMOS
EFR (Early Fail Rate,=< 168 Hours) YEAR Sample # Failure PPM FITs @ 60% CL, 55C, Ea = 0.7eV Sample Cum Dev # Failure FITs
Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
120 120 120 120 120
0 0 0 0 0
0 0 0 0 0
120 120 120 120 120
60,000 210,000 330,000 450,000 570,000
0 0 1* 0 0
196 56 79 58 46
Note: *=1 unit damaged during failure analysis, root cause could not be determined, random failure.
EFR(Early Fail Rate, =<168 Hours)
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
IFR(Intrinsic Fail Rate,>168 Hours) Cumulative
250 200 FIT 150 100 50 0 Q1,08 Q2,08 Q3,08 Year Q4,08 Q1,09
PPM
Year
RELIABILITY HTOL DATA @125 °C
FOUNDRY: TSMC Taiwan, Process: 0.13 µm LVCMOS
EFR (Early Fail Rate,=< 168 Hours) YEAR Sample # Failure PPM FITs @ 60% CL, 55C, Ea = 0.7eV Sample Cum Dev # Failure FITs
2005 2006 Q1,07 Q2,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
499 1200 360 240 120 120 120 119 120 120
1* 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0
499 1199 360 240 120 120 120 119 120 120
359,500 1,107,800 1,467,800 1,607,960 1,727,960 1,787,960 1,847,960 1,966,960 2,086,960 2,206,960
0 1** 0 0 0 0 0 1*** 0 0
25 11 8 7 7 7 6 13 12 12
Note: * = invalid reject at 168 hrs due to EOS ** = invalid reject due to mechanical damage after 1000 hrs ***=1 unit functional failure, root cause could not be determined, random failure.
EFR(Early Fail Rate, =<168 Hours)
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
IFR(Intrinsic Fail Rate,>168 Hours) Cumulative
14 12 10 8 6 4 2 0
Q2,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
PPM PM
FIT T
Year
Year
RELIABILITY HTOL DATA @125 °C
FOUNDRY: NEC Japan, Process: 0.15 µm CMOS
EFR (Early Fail Rate,=< 168 Hours) YEAR Sample # Failure PPM FITs @ 60% CL, 55C, Ea = 0.7eV Sample Cum Dev # Failure FITs
2000-2007 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
Note:
1366 120 120 96 96 72
0 0 0 0 0 0
0 0 0 0 0 0
1366 120 120 96 96 72
1366000 1486000 1606000 1654000 1702000 1774000
0 0 0 0 0 0
9 8 7 7 7 7
EFR(Early Fail Rate, =<168 Hours)
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
IFR(Intrinsic Fail Rate,>168 Hours) Cumulative
8.2 8 7.8 7.6 7.4 7.2 7 6.8 6.6 6.4 Q1,08 Q2,08 Q3,08 Year Q4,08 Q1,09
PPM
Year
FIT
RELIABILITY HTOL DATA @125 °C
FOUNDRY: TSMC Taiwan, Process: 0.18 µm CMOS
EFR (Early Fail Rate,=< 168 Hours) YEAR Sample # Failure PPM FITs @ 60% CL, 55C, Ea = 0.7eV Sample Cum Dev # Failure FITs
2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
480 480 120 120 119 120 120 120 120 120 120
0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0
480 479 120 120 119 120 120 120 120 120 120
838,168 1,314,668 1,434,668 1,554,668 1,653,676 1,773,676 1,833,676 2,013,676 2,133,676 2,253,676 2,373,676
0 1* 0 0 0 0 0 0 0 0 0
14 20 18 17 16 15 14 13 12 12 11
Note: * =1 unit functional failure, root cause could not be determined, random failure.
EFR(Early Fail Rate, =<168 Hours)
1 0.9 0.8 0.7 0.6 05 0.5 0.4 0.3 0.2 0.1 0
IFR(Intrinsic Fail Rate,>168 Hours) Cumulative
18 16 14 12 10 8 6 4 2 0
Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
PPM M
FIT T
Year
Year
RELIABILITY HTOL DATA @125 °C
FOUNDRY: TSMC Taiwan, Process: 0.25 µm CMOS
EFR (Early Fail Rate,=< 168 Hours) YEAR Sample # Failure PPM FITs @ 60% CL, 55C, Ea = 0.7eV Sample Cum Dev # Failure FITs
2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q1,08
480 480 120 119 120 120 120 120 100 100
0 0 0 0 0 0 0 0 0**** 0****
0 0 0 0 0 0 0 0 0 0
477 480 120 119 111 120 120 120 100 100
1,138,096 1,528,096 1,587,764 1,675,264 1,786,246 1,906,264 1,966,264 2,026,264 2,126,264 2,226,264
3* 0 0 1* 9** 0 0 1*** 0**** 0****
10 7 7 7 7 6 6 13 12 12
Note: * = mechanical damage after 500 hrs ** = 9 mechanical damage after 1KH ***= 1 unit functional failure after 1000 hrs, root cause could not be determined, random failure. ****= TSMC Process HTOL Reliability Data.
EFR(Early Fail Rate, =<168 Hours)
1 0.9 0.8 07 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
IFR(Intrinsic Fail Rate,>168 Hours) Cumulative
14 12 10 8 6 4 2 0
Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q1,08
PPM
FIT
Year
Year
RELIABILITY HTOL DATA @125 °C
FOUNDRY: Seiko-Epson Japan, Process: 0.35 µm CMOS
EFR (Early Fail Rate,=< 168 Hours) YEAR Sample # Failure PPM FITs @ 60% CL, 55C, Ea = 0.7eV Sample Cum Dev # Failure FITs
2003 2004 2005 2006 Q1,07 Q2,07 Q1,08 Q2,08 Q3,08 Q4,08
Note:
315 450 225 225 45 66 44 132 22 44
0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0
315 450 225 225 45 66 44 132 22 44
240,120 734,230 914,240 1,071,240 1,093,740 1,104,740 1,126,740 1,214,740 1,225,740 1,269,740
0 0 0 0 0 0 0 0 0 0
24 16 13 11 11 11 10 10 10 9
EFR(Early Fail Rate, =<168 Hours)
1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
IFR(Intrinsic Fail Rate,>168 Hours) Cumulative
12 10 8 6 4 2 0
Q2,07 Q1,08 Q2,08 Q3,08 Q4,08
PPM
FIT
Year
Year
RELIABILITY STRESS DATA
Temperature Cycle Test >=500 Cycles, -65/+150 ˚C
YEAR PKG TYPE SAMPLE SIZE 500 cycles FAILURE RATE (%) FINAL RESULT (PASS/FAIL)
Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 2004 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 2004 2005 2006 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
Note:
H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA HSBGA HSBGA HSBGA HSBGA HSBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
45 45 90 90 180 135 120 120 90 270 993 1158 1347 390 270 270 405 480 525 480 300 270 318 428 375 180 132 150 252 140 184 75 120
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS
ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC Seiko-Epson, Japan STATSChiPAC, Korea STATSChiPAC, Singapore UTAC, Singapore
PACKAGE TECHNOLOGIES PBGA, HSBGA, FCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA HSBGA PQFP PQFP, EPQFP
RELIABILITY STRESS DATA
Temperature Humidity Test 85/85 or HAST
YEAR PKG TYPE SAMPLE SIZE FAILURE RATE (%) FINAL RESULT (PASS/FAIL)
Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 2004 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 2004 2005 2006 Q2,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
H/FCBGA H/FCBGA H/FCBGA H/FCBGA H/FCBGA HSBGA HSBGA HSBGA HSBGA HSBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA QFP Q QFP QFP QFP QFP QFP QFP QFP QFP
45 45 90 90 180 135 120 120 90 270 983 1114 1870 90 270 360 360 480 525 480 300 270 245 1324 706 30 186 96 118 75 75
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS
Note: Conditions for 85/85 are 1000 Hours, 85C, 85%RH. HAST is an alternative stress with conditions of 96 Hours, 130C, 85%RH.
ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC Seiko-Epson, Japan STATSChiPAC, Korea STATSChiPAC, Singapore UTAC, Singapore
PACKAGE TECHNOLOGIES PBGA, HSBGA, FCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA HSBGA PQFP PQFP, EPQFP
RELIABILITY STRESS DATA
Pressure Cooker Test: 168 Hours, 121 ˚C/ 100% RH
YEAR PKG TYPE SAMPLE SIZE 96 Hours ( Ref ) 168 Hours ( Accep ) FAILURE RATE (%) FINAL RESULT (PASS/FAIL)
Q1,08 Q2,08 Q3,08 2004 2005 2006 Q2,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09 2004 2005 2006 Q1,07 Q2,07 Q3,07 Q4,07 Q1,08 Q2,08 Q3,08 Q4,08 Q1,09
Note:
HSBGA HSBGA HSBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA PBGA QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
90 30 30 128 830 142 30 30 30 30 30 30 623 980 3794 150 360 390 495 120 140 184 30 75
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS
ASSEMBLY SUBCON ASE, Kaohsiung ASE, Malaysia NEC Seiko-Epson, Japan STATSChiPAC, Korea STATSChiPAC, Singapore UTAC, Singapore
PACKAGE TECHNOLOGIES PBGA, HSBGA, FCBGA PQFP, PBGA, HSBGA PQFP, PBGA, FBGA PQFP, PBGA HSBGA PQFP PQFP, EPQFP