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VIEWS: 4 PAGES: 12

									                           Outline
 MUCH Layout and Pad sizes

 Estimation of Readout Channels

 Readout PCBs for GEMs

 PCB for FEB with two NXYTERS

 Estimation of Readout PCBs, GEM PCBs, FEBS,ROCs

 Estimation of LV/HV Channels
MUCH Layout with GEM for SIS 300
                             Readout channels-1
                                        Stn #   Layer    R1     R2       Area    Pad Size   # Of
                                                #        cm     cm       Sq mt   mm         Channels

              R2
                                        1       1       13.25   66.25    1.32    4          82500
                   R1
                                                2       14.25   71.25    1.53    4          95625
          ONE LAYER                             3       15.25   76.25    1.75    4          109375

                                        2       1       18.75   93.75    2.65    10         26500

A is area(shaded) for Electronics               2       19.75   98.75    2.94    10         29400

Area A = π (R2*R2 – R1*R1)                      3       20.75   103.75   3.24    10         32400

                                        3       1       24.25   121.25   4.43    10         44300

                                                2       25.25   126.25   4.80    10         48000

                                                3       26.75   131.25   5.19    10         51900




                          Pad sizes of 4 sq mm for station 1(layers1, 2, 3)
                          Pad sizes of 10 sq mm for stations 2 and 3,
                          Number of channels for station1 =287500
                          Number of channels stations 2, 3 it is 232500.
                                            Total =520000
                                  Readout channels –2
Pad size 5 sq mm:
                  Number of Readout channels for station1 =184,000 (52800+61200+70000)
Pad size =10mm:
                 Number of channels for station 2,3 =232,500
                 Total is 184000+ 232500=416500
                 35% Reduction Compared to 4 sq mm and 10 sq mm pads
Pad sizes of 4.5 sq mm and 9 sq mm:
                 Reduction of 21% compared to pad size of 4 sq mm for station 1
                 Increase of 23 % in channels for 9 sq mm compared to 10 sq mm for station 2,3
                 Total no of readout channels=226889+287036=513925
                 2 % reduction in total compared to 4 sq mm and 10 sq mm pads See below.

         Stn #    Layer     R1       R2      Area     Pad Size   # Of
                  #         cm       cm      Sq mt     mm        Channels
         1        1       13.25     66.25    1.32     4.5        65185
                  2       14.25     71.25    1.53     4.5        75555
                  3       15.25     76.25    1.75     4.5        86419
         2        1       18.75     93.75    2.65     9          32716
                  2       19.75     98.75    2.94     9          36296
                  3       20.75     103.75   3.24     9          40000
         3        1       24.25     121.25   4.43     9          54691
                  2       25.25     126.25   4.80     9          59259
                  3       26.75     131.25   5.19     9          64074
          Readout PCB –Modular design




                                                                 300 pin connector
                                                                   for signals
                                                                 1.27 mm pitch


  Top Copper      Inner 1 layer   Inner2 layer   Bottom copper

4 layer PCB with 256 pads.
      32* 8 array. Size is 135 *33.4 sq m
      Read by one FEB(Front End Board)
      One FEB has 2 N-XYTER chips each reading 128 channels
      Can be duplicated to larger arrays. 0.2 mm gap between pads
      4 such blocks to have an array of 1024 channels
             Readout PCB –Modular design

                                              PCB Size is 135 *135 sq mm
     32*32 array =1024 pads
                                              To be read by 4 FEBS.

                              Bottom copper          GND Plane




       Top copper




                                              4 NO -300 Pin
Inner layers not shown                          connectors
                       FEB with 2 N-XYTERS




                               300 pin connector
      Chip1



ADC




      Chip2
         ROC
         Connector




                                                           3D View
Top Copper           Bottom copper
                                                   PCB size =112*31 sq mm
            Chamber with 4 FEBs
                                       FEB 2 FEB 3
                               FEB 1                   FEB 4




Top view with 4 sq mm pads   Bottom view –Connectors for FEBs
                        GEM Chambers - Building blocks


                                                                           Basic components of GEM chambers
 2 types of modules. One with pad size 4 sq mm and other with 10 sq mm
                                                                                       Drift PCB
 For 32×32 array of 4 sq mm pads, GEM size is 135 ×135 sq mm.

 For 32×32 array with 10 sq mm pads , GEM size is 326.2×326.2 sq mm.
                                                                           GEM PCBS

 Both the PCBs will connected to 1024 pads

 Will be read by 4 FEBS with each FEB reading 256 channels.
                                                                          Readout PCB
                                                                                                     Pads
.
         No of Readout Channels, Readout PCB s

For station 1:
·     No of readout channels =       82500+95625+109375 = 287,500
·     No of PCBs required = 281 each reading 1024 channels with 4 sq mm
For Stations 2, 3:
·     No of read out channels = 26500+29400+32400+44300+48000+51900=232,500
·     Number of PCBs required = 228each reading 1024 channels 10 sq mm pads.
Requirements for GEM PCBS:
·   The minimum size for station 1 = 135 ×135 sq mm for 281 modules
·   GEM foils required =281×3(for triple GEMS) =          843
·   The minimum size for station 2 and 3 = 326.2×326.2 sq mm for 228 modules
·   GEM foils required for station 2 and 3= 228 ×3=        684
    Total GEM foils = 843+684= 1527
Requirements of Drift PCBS:
·     No of drift PCBs for Station 1= 281 (135×135 sq mm)
      No of drift PCBs for Station2 and3 = 228 (326.2×326.2 sq mm
No of FEB s, ROCS required:
·   No of read out PCBs with 4 and 10 sq mm pads= 281+228= 509
·   No of FEBS required each reading 256 channels=509×4= 2036
·   No of ROC s required (each ROC reading 2 FEB s) = 2036÷2=1018
                                HV/LV channels
HV Channels:

     For station 1 (one for each 135*135 GEMs) , we need 281 channels. Is it OK ??
     For station 2,3 ( 3 for each 326*326 GEM), we need 3 HV channels. So 684*3=2052 channels
                  Total HV Channels= 2052+281=2333

LV Channels:

           With separate channels for FEB and ROC we need 2036 +1018 =3054 LV channels

Power Requirements:
                2chip Feb With 3.3 v supply the power dissipation =10watts.
                2000 FEBs consume =2000x 10Watts =20KW.
                One ROC need -3.5A @5V ( one FEB ). With two FEBs it is 4A
               1000 ROC s consume = 1000x5Vx4A=20KW.
        Power consumption for 2000FEBs +1000 ROCs = 40KW
              Power consumption expected to come down

								
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