Detailed MEMS Fabrication Capabilities List
(150mm toolset)
LPCVD Films Lithography Thermal Processing
Low Stress Nitride (70-130MPa) (Features down to 1.5µm) Silicon Oxidation
Near-Zero Stress Nitride (5-30MPa) Projection Alignment Anneals
Low Stress Polysilicon (5-30MPa) Contact Alignment
Low Temperature Oxide Front/Back Alignment(1µm
PSG alignment)
Metalization Methods and Targets
Cr Au Ti Cu Pt Ni Al Pd PdCo Rh
Dome Evaporation* X X X X X X X
Planetary Evaporation* X X X X X X X
Sputtering X X X X
Electroplating X X X X X X X
*Etched, Liftoff, or Blanket
Dry Etching Wet Processing Post-Processing
Deep RIE – Silicon Wet Anisotropic Silicon Dicing
RIE Polysilicon Wet Oxide Die Bond
RIE Dielectrics Wet Metal Wire Bond
Plasma Cleans Immersion Cleans HF Vapor Release
Spray Cleans HF Liquid Release
Solvent Cleans Supercritical CO2 Dry
Pick and Place
Testing Reliability Metrology
Wafer Probing Static Life Testing SEM Measurement and Analysis
Dynamic MEMS Motion Analysis Cyclic Life Testing Film Stress, Thickness
White Light Interferometer Thermal Characterization and Resistivity
Optical Measurements Shock Profilometer
Doppler Bond Pull Interferometer
Die Shear Infrared Inspection
OMIS(Optical Measurement
Inspection System)
Wafer Bonding Design Services
Fusion Photomask Layout and Verification
Anodic Modeling and Simulation
Process Flow Design
Design Verification and Viability Report
For more detailed information, please contact MEMSCAP at 919-314-2200