Mr. Duke Lee Research Leader, Component and Materials Division, Displaybank Co, Ltd. Orbotech PCB Executive Forum 2011
Mr. Duke Lee joined Displaybank Co, Ltd., a leading Korean display research company in 2000. He is currently
Research Leader for its Component and Materials Division. Mr. Lee has been responsible for numerous company
reports including: “Large-size BLU/LED BLU Industry Trend and Analysis”, “TFT LCD Core Component Industry
Speaker Biographies
Trends – CCFL, Glass Substrate”, “Optical Films for BLU - Market & Industry Forecast”, “Light Guide Plate (LGP) for
LED LCD TV”, “Touchscreen Panel Market and Issue Analysis”, “Embedded Touchscreen Technology and Market”,
“Capacitive Touch Panel Structure and Manufacturing Process Analysis”.
Mr. J. Philip Plonski Managing Partner, Prismark Partners, LLC
Mr. Philip Plonski is responsible for providing tactical and strategic advice to worldwide clients involved in the design,
fabrication, and assembly of printed circuit boards. He is also responsible for researching and editing the ‘Printed
Circuit Report’. Prior to joining Prismark, Mr. Plonski served as Vice President of Technology at several corporations
in the field of advanced interconnection,circuit board manufacturing and machine desing.
He has also served as the General Manager in charge of high volume commodity printed circuit operations, as well
as General Manager for an automated printed circuit fabrication equipment maker.
Mr. Plonski has a B.Sc. in Electrical Engineering,a Master’s degree in Business Administration,and holds several
patents in high-speed electronic circuit board design.
Mr. Xiong Zhen CMKC
Mr. Xiong Zhen has served at CMKC Dongguan, since 2007. He holds the position of Section Manager for the
Manufacturing Department.
Mr. RunChuan Chang Fastprint
Mr. RunChuan Chang joined Fastprint in 2008,having responsibility for plate application,resin filling holes,impedance
control and fine solder mask.He is also in charge of the research and development of many technology projects.Today,
Mr. Chang is mainly engaged in the introduction of new materials and the acceptance of new equipment in Fastprint.
Mr. Chang graduated from South China University of Technology in 2006 with a major in Physical Electronics Technology.
Mr. Han Tingwei Director of Electronic-Business Division, Far Eastern International
Leasing Co., Ltd.
Mr. Tingwei is one of the main founders of Far Eastern International Leasing Co., Ltd. and is a leading consultant in
both investments and financing business for the electronics industry.
Mr. Han has spent many years holding executive positions in the banking,securities,and leasing industries and brings
significant professional experience to the financial industry.
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www.orbotech.com/pcb
Mr. Rani Cohen President and Chief Executive Officer, Orbotech Ltd. Mr. Martin Yang Senior Vice President,PCB Business, Orbotech Pacific Ltd.
Mr. Rani Cohen has served as Chief Executive Officer of the company since 2006.He is a 30-year veteran in the Mr. Yang has been Senior Vice President,PCB Business for Orbotech Pacific Ltd.since 2010. A 12 year veteran
development and commercialization of enabling technologies for specialized applications in the electronics industry of Orbotech, Mr. Yang has extensive sales and customer relations experience from management level positions
supply chain. Under his management, Orbotech has continued to introduce leading yield enhancing and production including previous roles as Account Manager for Taiwan, Greater China Sales Director, and North China Branch
solutins,including many first-ever innovations,and has achieved record annual revenues of over half a billion dollars General Manager. Mr. Yang has recruited and coached a large part of Orbotech’s sales force in the region and has
through organic and non-organic growth. been instrumental in the development and growth of Orbotech’s businesss in Asia Pacific.
Prior to becoming CEO, Mr. Cohen served in various R&D, sales, marketing and management roles at Orbotech
including: Executive Vice President and President of the Printed Circuit Board Division, and President and Chief
Executive Officer of Orbotech,Inc. Mr. Yair Alcobi Vice President,PCB Business at Orbotech Pacific Ltd.
Mr. Cohen began his career at the company in 1984 when he joined Orbot and held various programming and product
management positions until the consummation of the merger. Prior to joining Orbot, he was as a programmer
customer support, technical product line management and marketing throughout the region. Before joining Orbotech’s
at Telrad Networks Ltd.
Mr. Cohen holds a Bachelors degree in computer science from the Hebrew University.
Prior to Orbotech, Yair worked for 8 years in various positions in the K&S Bonding Tools marketing group. Yair holds
a B.Sc. degree in Mechanical Engineering from the Technion Israel Institute of Technology and an MBA degree
Mr. Asher Levy President Global Business, Orbotech Ltd. from Haifa University, Israel. He also successfully completed an Executive Program in Strategy and Organization at
Stanford University.
Mr. Asher Levy took responsibility as President Global Business at Orbotech Ltd. in 2010. Prior to that, Mr. Levy
held senior level management positions as part of the company’s executive management team including Deputy
Chief Executive Officer-Global Business,Executive Vice President for Business and Strategy and Corporate Vice Dr. Hamid R. Azimi Director, Substrate & Die Embedding Technology Development
President and President of the Printed Circuit Board Division. With Orbotech for more than 20 years, Mr. Levy Intel Assembly and Test Technology Development, Intel Corporation
has also served as Managing Director of Orbotech Technology Ventures,President of Orbotech Pacific Ltd.and
Vice President for Sales and Marketing at Orbotech, Inc. Prior to joining the company, Mr. Levy worked for Apple As the director of Substrate & Die Embedding Technology Development (TD) at Intel, Dr. Azimi is responsible for
Computer, Inc. and Digital Equipment Corporation. substrate research and development and early ramp-up at more than a dozen supplier factories that serve all Intel
Mr. Levy holds a Bachelors degree in industrial engineering and management from Ben-Gurion University and an products.In addition to enabling many firsts in the substrate industry,his team has advanced Intel’s environmental
MBA from Tel Aviv University. He is a graduate of the advanced management program at Harvard Business School. leadership by being the first to certify lead free and halogen free substrates.As part of a new initiative,Dr. Azimi is
also responsible for establishing a pilot line for die embedded technology development and certification to support
Intel next generation solder-less and ultra-thin processor packaging.
Mr. Richard Klapholz Corporate VP and President, PCB Division, Orbotech Ltd. Dr. Azimi has published many papers in science and engineering journals and holds multiple patents in substrate
technology and architecture including the original patent for Flip Chip Pin Grid Array (FCPGA) technology based on
Mr. Klapholz currently serves as the Corporate Vice President and PCB Division President at Orbotech Ltd. He is a laser microvia and ABF dielectric.
20-year veteran in international sales, marketing, and customer support of high technology production equipment. Dr. Azimi has a PhD in Materials Science and Engineering.
Over the last 13 years at Orbotech,Mr. Klapholz has held various senior positions including Vive President of
Sales and Marketing at Orbotech Ltd., Vice President of Customer Support at Orbotech, Inc., General Manager of
Orbotech’s Taiwan brahch office and President of Orbotech Pacific Ltd.
Dr. Hayao Nakahara President, N.T. Information, Ltd.
He has co-authored two books: “The Cash Machine” (2004) and “Release the Hostages” (2007), that address issues Dr. Nakahara is a pioneer and well-respected expert in the printed circuit board (PCB) industry with more than 35
associated with sales and customer support management using Theory of Constraints (TOC) analysis. years of experience in the field of PCB manufacturing,including 25 years at Photocircuits.In 1989,he formed his own
Mr. Klapholz holds a B.Sc. degree in Electronics Engineering from the Tel-Aviv University and an MBA from INSEAD, PCB consulting firm and for more than 20 years has been engaged in consulting for all aspects of PCB business.
Fontainebleau. Dr. Nakahara has published over 300 academic and commercial articles and is a contributing author to the “Printed
Circuit Handbook”. He is best known for his work, “World Top PCB Makers”, which he has been authoring annually
for the past fifteen years.
Mr. Eli Mahal Vice President of Sales and Marketing, PCB Division, Orbotech Ltd. Dr. Nakahara holds a B.Sc. in Electrical Engineering from Waseda University in Tokyo, an MSEE from the University
of Washington in Seattle and a PhD in Electrical Engineering from Columbia University, New York.
In his role as Vice President of Sales and Marketing for the PCB Divesion at Orbotech Ltd.,Mr. Eli Mahal has corporate
responsibility for sales of the company’s PCB solutions, supporting Orbotech’s three distribution entities in Asia
Pacific,West and Japan,as well as for product,market and business development activities. Mr. Kissinger Lee Chief of ICT Business Promotion Division, Chongqing Foreign Trade &
Joining the company in 2011, Eli brings to Orbotech 15 years of high-tech experience in marketing, product strategy Economic Relations Commission
and business development with a focus on business-to-business software products in the telecommunications
and mobile Internet sectors. Prior to Orbotech, Eli held senior marketing positions at several companies including Mr. Kissinger Lee has been Chief of the ICT Business Promotion Division for the Chongqing Foreign Trade & Economic
Microsoft, Comverse and Flash Networks. Relations Commission since 2010. Prior to this, he served for 4 years as Deputy Chief of the Commission’s ICT
Mr. Mahal holds an engineering degree in Industrial Management from Ben Gurion University and an MBA from the Business Promotion Division.
Tel Aviv University. Mr. Lee holds a Bachelor of Law and Bachelor of British Language and Literature degrees as well as a Master of Law
degree from Southwest University of Political Science and Law.
Mr. Arik Gordon President , Orbotech Pacific Ltd.
Mr. Arik Gordon was appointed to the position of President,Orbotech Pacific Ltd,in 2010.Beginning with the company Mr. WenQiang (Johnny) Huang Director, PCB Design Research Center, Board Design
in 2002, he has held several management positions including Vice President of Sales and Marketing, PCB Division Engineering Dept. CRDU President, China Chapter of the IPC Designer Council, Huawei
at Orbotech Ltd., General Manager of Orbotech Taiwan and Representative Director and Vice President of Finance
and Operations of Orbotech Japan Co. Ltd. Prior to Orbotech, Mr. Gordon served in other senior positions in business Mr. Johnny Huang currently works for Interconnect Design Department at Huawei and is in charge of PCB capability
development and marketing in the high-tech industry. research and planning. He was engaged in the development of monitor systems and wireless devices for 3 years.
Mr. Gordon holds a B.Sc. degree and a M.Sc. degree in Electrical Engineering from Tel Aviv University and an MBA Since 2000, Mr. Huang has been in charge of PCB design and analysis of signal integrity for products of Huawei.
from the INSEAD business school in France. He has extensive experience from working as Project Leader with responsibility for project management for high
complexity PCB miniature design. Mr. Huang graduated from Xi’an Electronics Sciences & Technology University in1997.
Mr. Huang is also the President of the IPC Designers Council China Chapter which was organized in 2009.