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Mercury Laser Diode Arrays









Mercury









Barry Freitas, Dave Van Lue, Joe Satariano, Everett Utterbach,

Larain DeMercurio, Kurt Cutter,

Terry Delima, Ray Beach

HAPL Review

Crowne Plaza Hotel

Pleasanton, CA

November 13, 2001

RJB/VG Mercury Laser IFE Meeting 6

We have completed the V-BASIS packages for three

entire backplanes (>240 kW peak optical pump power)



Split backplane holds 36 V-BASIS tiles









3 backplanes are complete, 4 th backplane by December









RJB/VG Mercury Laser IFE Meeting 6

.



V-BASIS package components 23-bar V-BASIS: etched Si heatsink





Si lens

frame





micr olens









spr ing









ng

p ri

v-s

diode



Si submount notch





AlN sheet





Mo block









- Mo-base expansion-matched to Si

Molybdenum

- Thin AIN layer for electrical isolation

base

- V-Spring adhesion-enhanced with epoxy

AlN

layer

Metalized

silicon

Microlens

array and

frame







RJB/VG Mercury Laser IFE Meeting 6

V-BASIS diode tile and plating specifications



Micro Lens Array

AR Coated V-Contacts

1000 to 1200 Å Au,

After Si, ALN & Mo parts 6 to 8 µ In, (Bottom only)

are assembled

3 to 6 µ In, is deposited

Diode Bars

on V-Groove side of Si.

V-Groove side of Si,

Top and Bottom of ALN, 100 to 200 Å Ti,

1000 to 1200 Å Ti, 10 to 12 µ Ag,

1000 to 1200 Å Ni, 1000 to 1200 Å Ni,

1000 to 1200 Å Au, 1000 to 1200 Å Au,

6 to 8 µ In, (Top only)



Top of Mo Block

Bottom side of Si,

1000 to 1200 Å Ti,

100 to 200 Å Ti,

1000 to 1200 Å Ni,

1000 to 1200 Å Ni,

1000 to 1200 Å Au,

1000 to 1200 Å Au,

6 to 8 µ In,



Shorting Clamp

1000 to 1200 Å Au,









RJB/VG Mercury Laser IFE Meeting 6

V-BASIS current flow path



N-Side P-Side to N-Side P-Side

Shorting Clamp Jumper Connector Paddle









Water

Flow









Heat Sink

Clamping Screws





N-Side P-Side

Connector Connector









RJB/VG Mercury Laser IFE Meeting 6

The diode backplane has the required brightness

and thermal performance

1.0 1.0





Fast axis 1 Tile

Slow axis 1 Tile

0.8 0.8

10 Tiles

brightness 10 Tiles brightness

0.6 0.6









Intensity

Intensity









0.4 0.4









0.2 0.2









0.0 0.0

-0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3



Radians Radians





1.0 1Hz

0.8 5Hz

10Hz The diode backplane provides

Intensity









0.6 suitable mechanical tolerance

A.U. 0.4

and cooling

0.2



0.0

890 895 900 905 910

Wavelength (nm)



RJB/VG Mercury Laser IFE Meeting 6

Histogram of center wavelengths of 80 fabricated V-

BASIS packages

Wavelength Distribution of 80 V-BASIS Packages









20

Number of V-BASIS Packages









15









10









5









0

897 898 899 900 901 902

nm



Remember, our original modeling specified a gaussian spread with a FWHM of ~

8 nm. While this distribution is not gaussian it is narrower overall than we had

originally anticipated.



RJB/VG Mercury Laser IFE Meeting 6

The V-BASIS packaged diode bars meet the optical

specifications of the Mercury Laser System

0.5



0.4



0.3 44%

Efficiency

0.2



0.1



0.0

0 20 40 60 80 100 120 140

Current (A)

3000

3000

2500

2.75 kW Mercury requirement 2500

2000 (23 bars)

Power 2000

Power 100 W 115 W

(W) 1500

(W) 1500 peak/bar peak/bar

1000

1000

500

500

0

0 20 40 60 80 100 120 140 0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

Current (A)

Shots (10^8)

RJB/VG Mercury Laser IFE Meeting 6

Summary

Requirement Status







100 Wpeak/bar 115 Wpeak/bar 





Fabrication of 120 tiles Completed 

(144 tiles per amplifier head)

45% electrical to optical 44% demonstrated almost

efficiency



1.4x10 8 shots without problems

Reliability of > 2x108 shots Every package is burned in for almost

5x10 6 shots (75 Hz for 18+

hours)

Power droop during pulse 5% droop demonstrated 

< 15%

Assemble tiles on split 3 backplanes have been 

backplane completed, the 4 th will be

completed by the end of the

calendar year

Pulse-integrated linewidth Demonstrated 4.7 nm FWHM 

< 8.5 nm FWHM on tiles for backplane

RJB/VG Mercury Laser IFE Meeting 6



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