Flexible Hybrid Electronic Systems

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					 Flexible Hybrid Electronic Systems

                  Ananth Dodabalapur

               The University of Texas at Austin




3 Dec., 2008
                 Panelists
• Ana Arias
  – Manager, PARC, Palo Alto, CA
• Tobin Marks
  – Prof. of Chemistry and Materials,
    Northwestern Univ.
• Dan Frisbie
  – Prof. of Chemical Engineering, U of Minn.
• Ananth Dodabalapur
  – Prof. of ECE, The Univ. of Texas at Austin
        Additional Panelists
• George Malliaras (Cornell)
• Shelby Nelson (Kodak)
• Others
  Some key highlights/areas in the
  field of hybrid flexible electronics
• Electronic paper
  – Plastic Logic, Polymer vision, E-Ink
• Printed RFID Tags
  – Poly IC, Philips, Nano---, Weyerhaeuser
• Printed electronics for displays
  – Philips, Merck (Covion), CDT,…
• Printed Bioelectronics
  – Nanoindent, Accreo,
     Case I Electronic Paper
• Original Proposal
  (with organic
  transistor backplanes)
  – 1996 (Bell Labs)
• First demonstration
  – 2000/2001(Lucent/E-
    Ink)
• Commercial
  prototypes
  – Mid 2000
   Case II - OFET based RFID
• First proposal
  (organic FET based
  RFID
  – 1995 (Philips)
• Working prototypes
  – 2005 to 2008
• Commercial
  production
  – Beyond 2010
       Hybrid Flexible System
               Design
• Communication
   – Wireless, wired
• Circuit design
• Semiconductor technology
   – Lumped silicon
   – Thin film semiconductors
       • Materials
       • Insulators, conductors
• Other components and devices
   – Sensors, Actuators, display elements, etc..
• Fabrication
   – Roll-to-roll (RTR) or other
   Thin-Film Semiconductors
• Organic and Polymer
   – Easiest to print
   – Proven compatibility with R2R
   – Mobilities limited to near 1 cm2/V-s*
• Carbon Nanotube films
   – Can possess higher mobilities (near 80 cm2/V-s) for L = 100
     micron devices (Rogers et al., Nature 2008)
   – Issues of metallic nanotubes
   – Separation of semiconducting nanotubes yielded 0.5-0.6 cm2/V-
     s. (Bao et al, Science 2008)
• Inorganic Semiconductors/Nanowires
   – High mobilities with Indium oxide (Marks et al., Nature Materials
     2006)
    Fabrication methods for Flexible
               Electronics
•   Ink-jet printing
•   Gravure
•   Flexo
•   Screen Printing
•   Nano-imprinting
•   Laser-based approaches
•   Photolithography for R2R
Technical Themes for the Study
• Circuit and system design
• Device physics
• Inorganic and organic semiconductor
  materials for transistors
• Dielectrics and conductors
• Functional devices and materials (for
  sensors etc)
• Fabrication processes
Tasks
                Timetable
• Dec. 08 Kickoff meeting (All panelists meet
  with sponsors and WTEC staff at NSF)
• Mar. 09 Baseline workshop at NSF (optional--
  this surveys US research in the field)
• May. 09 Site visits in Europe
  – Possible week identified…
• June 09 Site Visits in Asia (Optional)
• Jul. 09 Final Workshop at NSF
• Aug 09 Draft Final Report goal
        Proposed Visit Locations
• England
   –   Cambridge Univ
   –   CDT
   –   Plastic Logic
   –   Imperial College
• Netherlands
   – Holst Inst., Paul Blom Group
   – Philips, Eindhoven
   – Polymer Vision, Eindhoven
• Germany
   –   Dresden – OLED Company
   –   Dresden – Plastic Logic
   –   Poly IC
   –   Nano Ident
   –   Max Planck, Mainz
   –   Fraunhofer Inst.
Proposed Visit Locations (cont’d)
• Italy
   – CNR Bolognia
   – Annalisa Bonfiglio(?), Sardinia
• Austria
   – Linz, Sariciftci group
   – TU Graz, Guenther Leising
• Belgium
   – IMEC (Heremans)
• Sweden
   – Linkoping (Inganas)
   – Norkoping (Berggren)
 Possible Additional Visits - Ananth
        (No airfare needed)
• China
   – Beijing conference (June 2009). International Conference on Optical
     Probes in conjugated polymers. Will try and visit 1-2 labs.

• Singapore
   – IMRE, A*Star (several visits)

• S Korea
   – Samsung Adv. Inst of Technology (Jan 2009)
   – LG Chemical (Possibly Jan 2009)
   – Samsung main place(?)

• Japan
   –   U of Tokyo (T Someya)
   –   Mitsubishi Chemical Group
   –   SONY (????)
   –   Yamagata (Kido)?
             Report Outline
• Introduction: Duane
• Materials 1 : Tobin
• Devices and hybrid integration: Ananth +
            New panelist (Shelby Nelson?)
• Fabrication methods : Dan
• Circuits and applications : Ana
• Bioelectronics        George Malliaras(?)
• Travel report: several
        Planning Schedule
• Monday afternoon 2 Feb (Arizona meet)
• June 29, 30 Workshop
• Conf call 8 Jan 2 PM EST

				
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posted:12/8/2011
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