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Obj91891-Spec_DNS_SD-W60A-AVP_Reconditioned_Developer

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					                       SPEC CONFIRMATION 12/15/09
                           DNS SD-W60A-AVP DEVELOPER

                     55700-6848 Asset # A24561 (Reconditioned)

   Wafer size: Semi standard 150mm in diameter with orientation flat
   Cassette standard: PA182-60MB
   Indexer unit: 1Χ4 formation carrier stages, side loading
   Configuration
               HP                                HP                     HP




                                                                             ID
               HP                                CP                     CP


                                            TR




                SD                                    SD


     ID: indexer unit
     HP: hot plate
     CP: cooling plate
     TR: transfer unit
     SD: spin developer



   COMPONENT(S):
       o Main body frame
       o Loader/Un-loader
       o Spin developer head Χ2
       o Function for one developer head
               Developer nozzle Χ2
              
   Chemical Cabinet for Developer:
               For Developer 1
                        One set of canisters for Developer 1
                        One set of canisters for Developer 2
                             Each canister is to be connected with bulk system, three way valve
                              allows to supply developer from canister or bulk system.

   Developer Temperature Control:
                Circulating temperature controlled water from electric thermostatic units.
   Cooling Plate
                     Temperature control
                     By circulating temperature controlled water from electric thermostatic unit
   Others:
                     Tower lamp
                     Manual(s)
                     Down transformer
                          1-Phase 220V
                           3-Phase 380V
                     Data floppy disc




wafer centering:
     Wafer centering within each process station must be made by centering guide on the main arm
     with ±0.3 mm accuracy excluding deviation of diameter in each wafer itself
Spin developer unit:
     1) Spin speed: 0-6000rpm (when 150mm silicon wafer is loaded) with 10rpm increment
     2) Acceleration: 0-50000rpm/sec (when 150mm silicon wafer is loaded) with 1000rpm/sec
        increment
     3) Accuracy: ±1.0rpm for 0-6000rpm
HP:
      1) temperature range:50-180℃ with 0.1℃ increment
     2) accuracy: 50.0-110.0℃ R≤0.6℃
                              110.1-150.0℃ R≤1.0℃
                              150.1-200.0℃ R≤1.5℃
                              201.0-250.0℃ R≤2.0℃
          Conditions: Measure one temperature per plate. Set plate temperature required by
        customer. Measurement method: Using digital surface temperature meter (contact
        measurement probe, not thermocouple wafer) measure five locations on the plate.
        (Top, center, bottom, left and right.
        3) Mode: proximity heating
Cool Plate:
        1) temperature control: 15-30℃ with 0.1℃ increment
        2) temperature tolerance range: 0.1to 25.0℃(set in units of 0.1℃)
        3) accuracy :within a range of 0.4℃ for 15 to 30 ℃
        4) mode :proximity cooling

        Conditions:   Measure one temperature per plate.
                     Set plate temperature required by customer.
                   Measurement method: Using digital surface temperature meter (contact
                   measurement probe, not thermocouple wafer) measure five locations on
                   the plate. (Top, center, bottom, left and right.)
Developer temperature control unit
     1) temperature range :room temperature (21-25℃) ±3℃ with 0.1℃ increment
     2)accuracy :set temperature ±0.2℃
Thermostatic unit
     1) accuracy :set point ±0.1℃
     2) temperature range:18-25℃

				
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