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威雅利電子 (集團) 有限公司

Willas-Array Electronics (Holdings) Limited





Training on RoHS









Prepared by: Hector Ng

June 2005

1

RoHS and WEEE

(Directive in Europe)

• RoHS - The Restriction of Hazardous

Substances in Electrical and Electronic

Equipment

– Directive (2002/95/EC)



• WEEE – Waste Electrical & Electronic

Equipment

– Directive (202/96/EC)

WEEE Symbol



2

RoHS - Hazardous Substances

• Lead (Pb) – 0.1% by weight of homogeneous material

– Mainly used in solder, active and passive electric components, electronic contacts

and BGA balls, ceramics, glass



• Cadmium (Cd) - 0.01% by weight of homogeneous material

– Ni-Cd rechargeable batteries, galvanic coatings, polymers, electric contacts,

sensors



• Mercury (Hg) - 0.1% by weight of homogeneous material

– Batteries, light sources, switches, relays, sensors,



• Hexavalent Chromium - 0.1% by weight of homogeneous material

– Coatings on metals, corrosion protection, metal coated plastics





• PBB and PBDE - 0.1% by weight of homogeneous material

– polybrominated biphenyls and polybrominated diphenyl ethers: Flame resistant

material for cables, etc.



Pb-free ≠ RoHS compliant

Especially in passive components



3

Categories of Electrical & Electronic

Equipment Covered by RoHS & WEEE

• RoHS • WEEE

– Large household appliances; – Large household appliances;

– Small household appliances; – Small household appliances;

– IT and telecommunications – IT and telecommunications

equipment; equipment;

– Consumer equipment; – Consumer equipment;

– Lighting equipment; (with the – Lighting equipment; (with the

exception of filament light bulbs & exception of filament light bulbs &

household luminaries); household luminaries);

– Electrical and electronic tools – Electrical and electronic tools

(with the exception of large-scale (with the exception of large-scale

stationary industrial tools); stationary industrial tools);

– Toys, leisure and sport equipment; – Toys, leisure and sport equipment;

– Medical device (with the exception

of all implanted and infected

products);

– Monitoring and control

instruments;

– Automatic dispensers. – Automatic dispensers.







4

Timetable of RoHS & WEEE

13 Feb 2003 RoHS and WEEE Directives came into effect





13 Aug 2004 Transposition of RoHS and WEEE by Member States



Producers have systems in place to take back and manage electrical &

electronic waste free of charge to end users.

13 Aug 2005

Producers put on the market after this date are classified as “new” and

are labeled accordingly.



Member States ensure that all electrical and electronic equipment put

1 Jul 2006

on the market does not contain Cd, Pb, Hg, Cr(VI), PBBs & PBDEs



Member States shall ensure that a rate of separate collection of as least

31 Dec 2006 4kg on average per inhabitant per year of WEEE from private

households is achieved.







5

Situation in other

part of the world









6

Producer Responsibilities

• RoHS

– Not use banned substances in products

– Provide evidence of conformity

• WEEE

– Finance the extended product responsibility

– Provide guarantee by join in WEEE compliance

Scheme or Operating Individual Scheme

– Ensure easy disassemble of products

– Explain product recyclability and recoverability

– Provide recycle / recovery information





7

Substitute of Pb



• What material will be used to replace lead-

finish plating?

– 100% Sn, "Matte Tin"

• What material will be used for BGA solder

balls?

– Tin/Silver/Copper (Sn/Ag/Cu)









8

Solder Reflow profile between

Pb-free and Sn-Pb product









9

Forward and Backward Compatibility

• Lead containing lead finishes are forward

compatible. Forward compatibility refers to the

ability of current Lead containing lead finishes to

be used with Lead Free solder pastes (and a 30 ~

40°C higher soldering temperature).



• Virtually all semiconductor's new Lead-Free lead

finishes are Backward compatible with a few

exceptions(SnBi). Backward compatibility refers

to the ability of the new Lead-Free lead finishes to

be used with lead containing solder pastes.



10

Our policy on RoHS and Pb-free

• All front end staff and warehouse staff should clearly

know what is RoHS and its impact.

• From now on, we will only purchase Pb-free products from

principals. Purchase of non-Pb-free product is treated as

exceptional case and must be approved by GM of CPM.

• To provide evidence on Pb-free and RoHS compliancy is

the responsibility of our principals, we will not pay for test

offered by certify body. (Handling of Willas-Array brand

products will be announced later.)

• Some products from principal do not have part number

differentiation between Pb-free and non-Pb-free device.

Internal part number will be created for differentiation.

(suffix “E” is added for Pb-free products and suffix “R1” is

added for RoHS compliant products.)



11

How to handle order of Pb Product

Inventory Order Actions

(Lead Product)



Clear the inventory and migrate customer to

YES YES

RoHS



YES NO Find customer and sell them all



1. If RoHS product ready; Force customer

to migrate

NO YES

2. If RoHS product NOT ready; Back to

back order handling



NO NO Block this P/N; No order is accepted







12

What we need to know from

customers?

• Which is the end markets of their products?

• Do they need RoHS compliant products?

• If no, do they have plan to take RoHS

compliant products in the future and when?



A RoHS policy letter with questionnaire (Chinese and

English version) is available







13

What we need to advise customers?



• Inform customers about our RoHS policy.

• Advise customers to study Pb-free

production if they have not started.





A RoHS policy letter with questionnaire (Chinese and

English version) is available









14

Letter of Conformance

• 确认函

• 兹证明,依贵司订单自我司仓库发运之产品,符合原

厂产品规格。有关符合证明及检测数据或证明产品符

合上述要求的其他适当证据,将可从产品原厂处获得。



• Letter of Conformance

• It is hereby certified that the product shipped, against your

P.O., from our warehouse meet the original vendor product

specification. It is further declared that the certificate of

compliance and test data or other suitable evidence of

compliance with the requirements of your purchase order

can be obtained from the original vendor.





15

AKE

• All part are compliance with RoHS, except

EM-6672 until AKE's stock finish.

• No part number differentiation between

leaded and lead-free parts.









16

AKM

• All parts are lead free now.

• No part number differentiation between

leaded and lead-free parts.









17

AMS

Pb-free labeling

Assembly lot code will be changed for Pb-free to AYWWIXX (0335MAA

→ A335MAA)

A…Pb-free identifier

Y... last digit of the current year

WW...manufacturing week

I...plant identifier

XX...traceability code

Pb-free label in reels, trays or boxes









18

AMS

Pb-free package Roadmap







•Pb-free conversion

plan is done package

by package



•Download Pb-free

package roadmap

from here









http://www.austriamicrosystems.com/01aboutus/pb_faq.htm#7

19

Intersil

• Lead free parts are distinguished by "Z" or

"ZA" suffix.

• Intersil’s RoHS/Pb-free/Green Solutions Page:

http://www.intersil.com/pbfree/

• Lead free part list:

http://www.intersil.com/pbfree/lead_free.asp









20

Intersil

Lead Free Reflow Profile



Pb Free

Assembly

Profile Feature Small Body



Average ramp-up rate

(TL to Tp) 3°C/sec max.



Preheat

– Temperature Min 150°C

(Tsmin) 200°C

– Temperature Max 60-180

(Tsmax) seconds Pkg. Volume Pkg. Volume Pkg Volume

– Time (min to max) (ts) Package 2000

Thickness mm3 2000 mm3

Tsmax to TL mm3

– Ramp-up Rate 3°C/sec max.

2.5 mm 250ºC 245ºC 245ºC

seconds



Peak Temperature See Right Table



Time within 5°C of actual Peak 20-40 seconds

Temperature (tp)



Ramp-down Rate 6°C /second max.



Time 25°C to Peak 8 minutes max

Temperature









21

Microchip

• Microchip choose 100% matte tin (Sn)

plating as its lead (Pb) free solution.

• Pb-free product is identified by adding a “G”

at the end of the part number, eg.

– 24LC01B-I/SN is SnPb plated

24LC01B-I/SNG is Pb-free

• Microchip’s Pb-free page:

– http://www.microchip.com/stellent/idcplg?IdcService=

SS_GET_PAGE&nodeId=675









22

Microchip

Pb-free time table



• January 2005: Microchip manufacturing will

convert to matte tin (Pb-free) plating.

• January - December 2005: Microchip product

shipments may contain either SnPb or Pb-free

plated devices as the SnPb inventories transition to

Pb-free devices.

• December 2005: SnPb-plated products are no

longer anticipated in standard product inventories;

Microchip standard product shipments and

inventories are expected to Pb-free.





23

Microchip

Where to get Pb-free product list?









Get the Pb-free

product list here









http://www.microchip.com/stellent/idcplg?IdcService=SS_GET_PAGE&nodeId=675



24

Murata

RoHS Compliant Product List









Download latest RoHS

Compliant parts from here!









http://www.murata.com/env/index.html



25

NJRC

• NJRC provides lead-free parts for all items.

• NJRC has no plan to stop the production of leaded

parts.

• All the parts of NJL series are lead-free.

• NJG, NJM, NJU series – both lead-free and leaded

part are available

• Lead-free part number = Normal part number-

#ZZZB; example: NJM2865F38-TE1-#ZZZB







26

Sefuse

PART NO. STATUS REMARK



SF-E Fully Complied RoHS Except SF109E



SF-Y Fully Complied RoHS Except SF109Y



SF-K Fully Complied RoHS Except SF109K



Only SM072, 082, 110, 137, 146 are

SM-A

RoHS compliant

Only SM082, 110, 137, 146 are

SM-B

RoHS compliant

Only SM110, 137, 146 are RoHS

SM-G

compliant







27

ST

• The ST ECOPACK Program is fully in line with

European RoHS. Therefore, once converted to Pb-

free, ST devices are RoHS compliant.

• Selected 3 lead free technologies: NiPdAu, Pure

Sn and SnAgCu Ball.

• Complete conversion to Lead-free production by

end of Q2-05.

• No part number differentiation between leaded

and lead-free parts.

• Lead free part can be identified by Ecopack

marking and labeling.



28

ST

Identification & Traceability





Marking Labeling









If space permits, lead free parts

are marked with the letter "E" e1 = SnAgCu

e2 = Sn alloys excluding SnAgCu

e3 = Sn

e4 = NiPdAu

e6 = SnBi 29

ST’s Conversion Roadmap

COMPLETION PERIOD

PACKAGE FAMILY

CDIP, Diodes, Metal Cans, PDIPs, QFN,

SMA/B/C, SOD/SOTs, SPAK,

SSOP,TO202, TO220 Full Pack, TO220

Switched

PWR, TO220 Triacs, TO247, TO92,

TOP3, LQFP Opto, TQFP Large, T & L

QFPs Small, TSSOPs, Watts, Zeropower

BGA Small Q2 '05

DPAK Q2 '05 / V-Reg switched

HiQuad Q2 '05

PLCCs ST : Q2 '05 / Sub : Q1 '05

PSO Q2 '05

SO Narrow * 0

ST : Q1’ 5 / Sub : Q2 '05

SO Wide Q1 -Q2 '05

TO220 D2PAK Q2 '05 (Clip** mounting: Q4 '04)

P & L QFPs Large ST : Switched / Sub : Q2 '05

TSOP Q1 - Q2 '05

Subsystems < Q4 '05

* Sub : OK in pure Tin waiting for NiPdAu in Q2'05

** Clip mounting: Triacs, SCRs

Sub = Subcontractor Revision 3.0

March 2005



30

Toshiba

How to distinguish lead free products?









Added code for MCU family is G





31

Vishay

• Vishay will change the part numbers for all

products that are converting to lead-free. Parts

that have been lead-free for several years will

maintain their current part numbers. Please

refer to lead free product family Excel file.

• Pb-free web page:

– http://www.vishay.com/how/leadfree







32

Vishay

Lead free product family Excel File









Download latest lead free Excel files for

ICs, capacitors, inductors, resistors.









http://www.vishay.com/how/leadfree



33

Detail RoHS info for most product line









http://www.willas-array.com/fbi/RoHS_Pb-free/









34

Other Useful Information









35


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