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					                                                               TOPIC N. 26
                                                                 Mems
                                                      Presenting    Presenting
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                  Title of presentation             Author Family Author First                                 Coauthors Data
Abstract
                                                          name         name
   4772 CRACK AND DELAMINATION RISK                Auersperg      Jürgen       Auersperg, Juergen, Fraunhofer IZM, Berlin, Germany and AMIC GMBH,
        EVALUATION OF THIN SILICON BASED                                       Berlin, Germany Vogel, Dietmar, Fraunhofer IZM, Berlin, Germany Michel,
        MICROELECTRONICS DEVICES                                               Bernd, Fraunhofer IZM, Berlin, Germany
   5471 EFFECTS OF VARYING MEAN STRESS             Ballarini      Roberto      R., Ballarini,Case Western Reserve University Cleveland, OH 44106, USA
        AND STRESS AMPLITUDE ON THE                                            H., Kahn, Case Western Reserve University Cleveland, OH 44106, USA
        FATIGUE OF POLYSILICON                                                 A.H., Heuer, Case Western Reserve University Cleveland, OH 44106,
                                                                               USA
   5083 COHESIVE ZONE-BASED MODELLING              BERTHOLET      Yannick      Yannick BERTHOLET, UCL/MAPR/IMAP, place Sainte-Barbe 2, 1348
        OF Si/Si AND SiO2/ SiO2 INTERFACES IN                                  Louvain-la-Neuve, Belgium --------------------------- Jean-Pierre RASKIN,
        THE PRESENCE OF A DUCTILE                                              UCL/ELEC/EMIC, Place du Levant3, 1348 Louvain-la-Neuve, Belgium -----
        INTERLAYER.                                                            ---------------------- Thomas PARDOEN, UCL/MAPR/IMA
   4066 MATERIAL CHARACTERIZATION AT THE           Corigliano     Alberto      Fabrizio Cacchione, Department of Structural Engineering, Politecnico di
        MICRO SCALE THROUGH ON-CHIP                                            Milano, Milano, Italy Biagio De Masi, MEMS Business Unit,
        TESTS                                                                  STMicroelectronics, Cornaredo, Milano, Italy Alberto Corigliano,
                                                                               Department of Structural Engineering, Politecnico di Milano
   4503 MECHANICAL PROPERTIES OF MEMS              Dual           Jurg         Jurg,Dual,ETH Zurich,Zurich,Switzerland Gerd,Simons,ETH Zurich,
        STRUCTURES                                                             Zurich,Switzerland Jürgen,Villain,University of Applied Sciences,
                                                                               Augsburg, Germany Christine,Weippert,University of Applied
                                                                               Sciences,Augsburg, Germany
   4715 Simulations of nanoindentation in a non-   Falk           Michael      Yunfeng, Shi, University of Michigan, Ann Arbor, MI Falk, Michael,
        crystalline metal film                                                 University of Michigan, Ann Arbor, MI
   3169 CONTINUUM AND ATOMISTIC                    Gao            Huajian      Markus J. Buehler, Max Planck Institute for Metals Research,
        MODELING OF DYNAMIC FRACTURE AT                                        Heisenbergstrasse 3, 70569 Stuttgart, Germany, Farid F. Abraham, IBM
        NANOSCALE                                                              Almaden Research Center, 650 Harry Road, San Jose 91520, CA, USA.
                                                                               Huajian Gao, Max Planck Institute for Metals Research, Heis
   5133 NANODAC – A METHOD FOR FRACTURE            Keller         Jürgen       Jürgen, Keller, AMIC Angewandte Micro-Messtechnik GmbH,
        MECHANICAL CHARACTERIZATION ON                                         Volmerstrasse 9B, 12489 Berlin, Germany Dietmar, Vogel,2Fraunhofer
        THE NANOSCALE                                                          Institute for Reliability and Microintegration (IZM), Dept. Mechanical
                                                                               Reliability and Micro Materials, Gustav-Meyer-Allee 25, 13355


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                                                             Presenting     Presenting
  ID
                      Title of presentation                Author Family Author First                                  Coauthors Data
Abstract
                                                                name          name
   4654    SENSITIVITY STUDY OF COMB-DRIVE                Krylov         Viacheslav     V. KRYLOV1, N. MOUSSAY2 AND Y. BERNSTEIN2
           ACTUATOR WITH FOLDED SUSPENSION                                              1 Department of Solid Mechanics Materials and Systems, Tel Aviv
                                                                                        University, Israel
                                                                                        2 Teraop Ltd., Israel
   4689    VOID GROWTH IN FCC AND BCC SINGLE Kysar                       Jeffrey        J.W. Kysar and Y.X. Gan
           CRYSTALS                                                                     Department of Mechanical Engineering, Columbia University, New York,
                                                                                        NY 10027
   4125    Fracture of CSL Boundaries in Cu and Al        McDowell       David          Douglas, Spearot, Georgia Institute of Technology, Atlanta, GA Karl,
                                                                                        Jacob, Georgia Institute of Technology, Atlanta, GA David, McDowell,
                                                                                        Georgia Institute of Technology, Atlanta, GA
   5721    FATIGUE DAMAGE ACCUMULATION AND Muhlstein                     Christopher L. C.L. Muhlstein Department of Materials Science and Engineering and the
           MITIGATION IN SILICON STRUCTURAL                                             Materials Research Institute, The Pennsylvania State University, USA
           FILMS
   3506    EMBEDDED ATOM METHOD                           Potirniche     Gabriel        Gabriel Potirniche, Center for Advanced Vehicular Systems, Mississippi
           SIMULATIONS OF SINGLE CRYSTAL                                                State University, Mississippi State, MS,USA Mark Horstemeyer,
           NICKEL DUCTILE FRACTURE                                                      Department of Mechanical Engineering, Mississippi State University,
                                                                                        Mississippi State, MS, USA Greg Wagner, Sandia Nationa
   5392    Crack Initiation in Ultra Thin Patterned Films Sottos         Nancy          Nancy R. Sottos1, S. Kandula2, and P.H. Geubelle2 - 1 Department of
                                                                                        Theoretical and Applied Mechanics, University of Illinois, Urbana, IL
                                                                                        61801, USA
                                                                                        2 Department of Aerospace engineering, University of Illinois, Urbana, IL
                                                                                        61801 USA
   4156    OPERATIONAL WEAR AND FRICTION IN Subhash                      Ghatu          G. SUBHASH1,2, A. D. CORWIN2 and M.P. DE BOER2
           MEMS DEVICES                                                                 1Michigan Technological University, Houghton, MI 49931
                                                                                        2Sandia National Laboratories, Albuquerque, NM 87185
   5627    Thermal Lap Shear Tests for MEMS Solder Vogel                 J.             J. Vogel, AMIC Angewandte Micro-Messtechnik GmbH Volmerstr. 9b,
           Interconnects                                                                12489 Berlin, Germany, W. Faust, R. Dudek, Fraunhofer Institute for
                                                                                        Reliability and Microintegration Chemnitz, Otto-Schmerbach-Str. 19,
                                                                                        09117 Chemnitz, Germany, B. Michel, Fraunhofer Micro Ma
   4768    FRACTURE AND FATIGUE BEHAVIOUR Walter                         Hans           H.Walter1, R.Dudek2 and B. Michel2
           OF MEMS RELATED MICRO MATERIALS                                              1AMIC GmbH Berlin, Germany
                                                                                        2Dept. Mechanical Reliability and Micromaterials, Fraunhofer IZM Berlin,
                                                                                        Germany
   5663    PROBABILISTIC APPROACHES FOR                   Winkler        Thomas         T. WINKLER1, B. MICHEL2, B. WUNDERLE2 1Chemnitzer
           FRACTURE AND RELIABILITY                                                     Werkstoffmechanik GmbH, 09117 Chemnitz, Germany 2Micro Materials


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                                             Presenting      Presenting
  ID
                Title of presentation       Author Family    Author First                                Coauthors Data
Abstract
                                                name            name
        ESTIMATIONS OF MICROSYSTEMS                                         Center (MMCB), Fraunhofer IZM, 13355 Berlin, Germany
   4428 A COMBINED SIMULATIVE AND          Wittler          Olaf            Olaf Wittler, Centre of Microperipheric Technologies, Technical University
        EXPERIMENTAL APPROACH TO                                            Berlin, Berlin, Germany Jürgen Keller, AMIC GmbH, Berlin, Germany
        RELIABILITY OPTIMIZATION OF MEMS                                    Dietmar Vogel, Dept. Mechanical Reliability and Micromaterials,
                                                                            Fraunhofer IZM, Berlin Germany Bernd Michel, Dept.




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posted:11/26/2011
language:English
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