ORGANIZING COMMITTEE Balandin Alex USA 4th INTERNATIONAL
Boulon Georges France
Kulyuk Leonid Chairman, IAP, Moldova Burzo Emil Romania CONFERENCE ON MATERIALS
Gitsu Dumitru Co-Chairman, IEEIT, Moldova Chiriac Horia Romania SCIENCE AND CONDENSED
Filippova Irina Conf. Secretary, IAP, Moldova Dashevsky Zinovi Israel MATTER PHYSICS
Balmush Ion TUM, Moldova Dekhtyar Yuri Latvia
Ciornea Viorel IAP, Moldova Diacon Ion Moldova
Conunov Galina IAP, Moldova Fomin Vladimir Belgium
Dorogan Valeriu TUM, Moldova Grozescu Ioan Romania
Gashin Petru MSU, Moldova Hartnagel Hans Germany
Gudima Constantin IAP, Moldova Khokhlov Dmitri Russia
Gutsanu Valeriu SUB, Moldova Kilin Sergey Belarus
Iovu Mihail IAP, Moldova Kopaev Yuri Russia
Khadji Piotr IAP, Moldova Kusmartsev Feo UK
Kulikova Olga IAP, Moldova Leon Maximo Spain
Railean Sergiu IEEIT, Moldova Lipkowski Janusz Poland
Rusu Emil IAP, Moldova Litovchenko Vladimir Ukraine
Shikimaka Olga IEEIT, Moldova Lux-Steiner Martha Germany
Simonov Yurii IAP, Moldova Melville Peter UK
Metin Arik Turkey
Moskalenko Sveatoslav Moldova SEPTEMBER 23-26, 2008
PROGRAM COMMITTEE Moskalenko Vsevolod Moldova CHISINAU, MOLDOVA
Neuman Manfred Germany
Kantser Valeriu Chairman, Chisinau, Moldova Pokotilov Evgenii Moldova
Tiginyanu Ion Co-Chairman, Chisinau, Moldova Scherrer Hubert France
Arushanov Ernest Chisinau, Moldova Sigov Alexandr Russia
Caraman Mihai Chisinau, Moldova Simashkevich Alexei Moldova ORGANIZED BY
Casian Anatolii Chisinau, Moldova Tsukerblat Boris Israel INSTITUTE OF APPLIED PHYSICS OF
Digor Dumitru Chisinau, Moldova Wixford Achim Germany ACADEMY OF SCIENCES OF MOLDOVA (IAP)
Gheorghiţă Eugen Chisinau, Moldova Zegrea Gheorghe Russia INSTITUTE OF ELECTRONIC ENGINEERING
Geru Ion Chisinau, Moldova AND INDUSTRIAL TECHNOLOGIES OF
Grabco Daria Chisinau, Moldova CONTACTS ACADEMY OF SCIENCES OF MOLDOVA (IEEIT)
Kravtsov Victor Chisinau, Moldova MOLDAVIAN PHYSICAL SOCIETY (MPS)
Nedeoglo Dmitrii Chisinau, Moldova Dr. Irina Filippova,
Nicolaeva Albina Chisinau, Moldova Conference Secretary, MSCMP-2008, WITH PARTICIPATION
Nicorici Andrei Chisinau, Moldova Institute of Applied Physics MOLDAVIAN STATE UNIVERSITY (MSU)
Shishianu Teodor Chisinau, Moldova 5 Academiei str., Chişinău MD-2028, TECHNICAL UNIVERSITY OF MOLDOVA (TUM)
Shontea Victor Chisinau, Moldova MOLDOVA STATE UNIVERSITY BALTI (SUB)
Sidorenko Anatolii Chisinau, Moldova Phone: +373 22 738129
Syrbu Nicolae Chisinau, Moldova Fax: +373 22 738149 SUPPORTED BY
Tsurkan Vladimir Chisinau, Moldova E-mail: mscmp2008@phys.asm.md and SCIENCE AND TECHNOLOGY DEVELOPMENT
Ursaki Veaceslav Chisinau, Moldova mscmp2008@mail.md COUNCIL OF ACADEMY OF SCIENCES OF MOLDOVA,
http://phys.asm.md/mscmp2008 EUROPEAN PHYSICAL SOCIETY,
INTERNATIONAL ADVISORY COMMITTEE First announcement and call for papers INSTITUTE OF PHYSICS, UK
Aifantis Elias Greece 4th INTERNATIONAL CONFERENCE ON
Andreev Alexandr Russia MATERIALS SCIENCE AND
Andriesh Andrei Moldova CONDENSED MATTER PHYSICS
methods of material and structure MSCMP 2008 PROCEEDINGS
The conference provides a forum for characterization; microscopy and spectroscopy;
presentations of research work across wide range structure and mechanical characterization; optical The invited and contributed papers will be
of condensed matter physics and materials properties; electrical, magnetic and published in the Moldavian Journal of Physical
science. superconductor properties, transport processes, Sciences after the conference. The authors should
MSCMP 2008 following MSCMP 2001, MSCMP non-linear phenomena, size and interface effects. present the manuscripts of the papers (6 pages for
2004 and MSCMP 2006 is organized by the the contributed and 8-10 pages for the invited
Physical Community of Moldova and will be held in Condensed matter theory (CMT) papers including figures and references) during the
the Institute of Applied Physics of the Academy of advances in condensed matter theory; theory of registration: 2 hard copies and electronic file in
Sciences of Moldova, Chisinau, September 23-26, low dimensional systems; modelling of materials Microsoft Word format. The manuscripts for
2008. and structure properties; development of publishing will be prepared according to the
theoretical methods of solid-state characterization; "Guidelines for authors", available on the web
MSCMP 2008 PROGRAM phase transition; advanced quantum physics for page of the Moldavian Journal of Physical Sciences
nanosystems. – http://sfm.asm.md/moldphys/
MSCMP 2008 program will consist of invited The hard copies of papers should be printed in
and contributed (oral and poster sessions) papers. Solid-state device physics (SSDP) very good contrast conditions.
In oral sessions authors should use PowerPoint device modelling and simulation, device structures
presentations. The presentation should not exceed and elements; micro- and optoelectronics; MSCMP 2008 REGISTRATION FORM
15 minutes (contributed papers), respectively 30 photonics; microsensors and micro electro-
minutes (invited papers), discussion included. The mechanical systems; microsystems; degradation Title and Family name ……………………………………………
recommended format for posters is A0 portrait and reliability, solid-state device design. Given name and middle name ………………………………
(100 cm x 100 cm panel). …………………………………………………………………………………
The program will include three special Sessions OFFICIAL LANGUAGE: ENGLISH Affiliation …………………………………………………………………
dedicated to the 80th anniversaries of prominent …………………………………………………………………………………
Moldovan physicists Sveatoslav Moskalenko and Address for correspondence ……………………………………
Vsevolod Moskalenko as well as to the 75th …………………………………………………………………………………
anniversaries of famous Moldovan physicist Andrei …………………………………………………………………………………
Andriesh. A session in memory of prominent prof. DEADLINE FOR REGISTRATION AND …………………………………………………………………………………
Julia Boyarskaya, the founder of Laboratory of ABSTRACT SUBMISSION Phone: ……………………………… Fax: ……………………………
Mechanical Properties of Materials of IAP, will be June 30th, 2008 E-mail: ……………………………………………………………………
organized. Do you wish to submit a paper? (please check)
Yes No
TOPICS If yes, please indicate the tentative title of the
paper: ………………………………………………………………………
Materials and structure processing (MSP) ABSTRACTS TO BE SUBMITTED …………………………………………………………………………………
advanced materials and fabrication processes; …………………………………………………………………………………
methods of crystal growth, post-growth Contributed papers will be selected on the basis …………………………………………………………………………………
technological processes, doping and implantation, of one full page abstract (A4 size paper, “Times Topics (please mark one)
fabrication of solid state structures; defect New Roman” type font, 11 pt, one interval, with MSP CPPP CMT NNN SSDP
engineering, engineering of molecular assembly. 2.0 cm top, left, right and bottom margins and Presentation type: oral poster
non-colour figures. Type the title in capital letters, ________________________________________
Nanotechnology, nanostructures and bold font, centred. In the next lines type the
nanoelectronics (NNN) author’s name(s), affiliation (in italic) and address Please, e-mail this form with your Abstract to:
Methods of nanostructures and nanomaterials (in italic) with one line white below, followed by mscmp2008@phys.asm.md
fabrication and characterization; quantum wells the abstract. Use 1.5 intervals between the title
and superlattices; nanocomposite, nanowires and and the author’s name(s) and between the Alternatively, you may fax it to: +37322 738149,
nanodots; fullerenes and nanotubes, molecular author’s name(s) and the affiliation. or send a hard copy to:
materials, meso- and nanoelectronics. Abstracts should be submitted by E-mail to
Characterization, physical processes and mscmp2008@phys.asm.md as a *.doc or *.rtf file. MSCMP 2008, Institute of Applied Physics
properties (CPPP) 5 Academiei str., Chişinău MD-2028,
MOLDOVA