Cleanroom Annual Report, 2006

Cleanroom Research Laboratory Cleanroom Annual Report, 2006 Mission Statement The UTD Cleanroom Research Laboratory, a facility with filtered, vertical laminar-flow air, is equipped with versatile semiconductor process research equipment assembled for the purpose of supporting university research in the fields of microelectronics, electronic materials, nanotechnology, MEMS, lithography, and optical devices requiring a particle-free environment. Letter from the Director Dear Colleagues: On behalf of the Cleanroom Research Laboratory staff, I am once again pleased to present our annual report describing the various activities in our facility. The preceding year has resulted in unprecedented improvements in research capability and a broader base of user activity as well. After more than a year of planning, we are also now poised to initiate the migration of the Cleanroom operations to the new Natural Science and Engineering Research Laboratory. This activity will start in early 2007 and will be complete by the summer. In addition to the very hard work of our cleanroom staff over the last year, I want to also acknowledge the outstanding support of our UTD partners in the Procurement Management, Facilities Management, Environmental Health and Safety, as well as Police departments. Their support has been critical to the success of the facility, and we look forward to enhancing this partnership in the coming year. A key mission of our facility is to enable research. We are eager to hear your comments on the state of the Cleanroom operations and your suggestions for further capabilities and improvements. Please do not hesitate to contact me or our Associate Director, Wallace Martin, with your thoughts and suggestions. Best Regards, Robert M.Wallace Cleanroom Research Laboratory Director Professor of Electrical Engineering and Physics rmwallace@utdallas.edu 972-883-6638 1 Cleanroom Research Laboratory Executive Summary This report presents the developments that the Cleanroom Research Laboratory has made over the last year (September 2005 – August 2006) in enabling research for our user base. The report provides an overview of cleanroom operational efforts and costs of operation, excluding facility expenses. Sections include an overview of the operational costs, capital improvements, organizational structure and personnel, new equipment and capabilities, and plans for the move to the new Natural Science and Engineering Research Laboratory (NSERL). Financial Overview The Cleanroom operation is currently subsidized by the office of the Provost and the Erik Johnson School of Engineering and Computer Science. Moreover, no faculty user fees are currently assessed for the facility. The following pie chart shows the Maintenance & Operations expenses for September 2005 through August 2006. Utility or personnel costs for the facility are not included in this analysis. The chart shows that facility consumables, equipment repairs and liquid N2 generate the largest Maintenance and Operations expenses, followed by expenses for parts and process chemicals. FY 2005-2006 M&O/Travel Expenses: Total = $204,080 Travel, $2,675 , 1% Chemicals, $21,130 , 10% Repairs, $45,162 , 22% Cleanroom Garments, $7,732 , 4% Consumables , $45,827 , 22% Parts, $20,478 , 10% Demurrage, $1,121 , 1% Facilities, $7,274 , 4% Liq N2, $38,267 , 19% Furniture/computers, $4,421 , 2% Gasses, $9,993 , 5% 2 Cleanroom Research Laboratory Capital Investments The following table summarizes the capital equipment expenditures for the Cleanroom in the last year. Also listed are expenditures associated with the new NSERL Cleanroom infrastructure and moving the existing tools to NSERL. These expenses were supported in part by “Project Emmitt” funding to enhance the research infrastructure for the facility. In addition to the process tools listed below, we expect to add another metal sputtering system and two rapid thermal process (RPT) systems for conducting research work on compound semiconductor material. These tools will likely arrive in the spring of 2007 and will increase our capital expenditure by $365K. Cost 64,000 73,000 9,000 599,000 574,000 908,600 20,000 10,800 104,400 32,000 6,500 1,400 309,600 2,500 58,000 22,500 162,300 18,600 5,500 58,300 402,700 80,300 145,200 13,100 36,400 2,600 73,500 75,000 3,868,800 Cleanroom Capital Investments Fiscal 2006 Leica INM 100 inspection microscope Confocal Accessory for Leica INM 200 Fluorescence Module for Leica INM 200 Unaxis Versaline ICP - plasma dielectric etcher Unaxis Versaline ICP - plasma metal etcher Leo Supra 40 SEM EDAX - Zyvex nanoprober - Nabity litho HERZAN vibration isolation platform for SEM Agilent high performance storage oscilloscope Denton Vacuum - thermal evaporator Nicolet FTIR Spectrometer System GATR Attachement for FTIR FT-80 Grazing Angle fixture for FTIR Heidelberg DWL 66 laser writer UPS for laser writer CDO (burn box) for cleanroom hazardous exh from LPCVD Micro Tech SRD (spin-rinse-dryer) Nanometrics (NanoSpec film thickness measurement) Samco UV03 cleaner RGA (residual gas analyzer) Tousimis Critical Point Dryer (CO2) Tystar 4 stack atmospheric furnace Veeco Dektak - profilometer CPK spin processors for spray develop and Chrome etch Tektronix oscilliscope for device characterization MARCH plasma asher Explosion proof refrigerator SDC gas cabinets for new process capabilities in NSERL Cleanroom furniture for NSERL Total Location ECSN ECSN ECSN NSERL NSERL ECSN ECSN ECSN ECSN ECSN ECSN ECSN ECSN ECSN NSERL ECSN ECSN ECSN ECSN ECSN NSERL ECSN ECSN ECSN ECSN ECSN NSERL NSERL $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ 3 Cleanroom Research Laboratory Total Capital Expenditures (Capital equipment, NSERL infrastructure fitout, cleanroom tool move and installation in NSERL) $3,868,800 – Capital Equipment $ 623,000 – New Infrastructure (provide utilities in NSERL cleanroom chase areas) $1,140,000 – Tool de-installation, move from ECSN / installation in NSERL $5,631,800 – Total FY 2005-06 Tool Donations In addition to the 2006 capital expenditures, the Cleanroom has recently received a very generous donation of process equipment from Texas Instruments. The equipment will arrive at UTD in November 2006 and will be installed in the new NSERL Cleanroom in the spring of 2007. The “market value” of the donated tools is $498,500. Manufacturer Plasmatherm-Batchtop STS Karl Suss MA6B Karl Suss Solitec CHA Industries CHA Industries Semitool Semitool Electronic Vision Prometrix Reichert-Jung Flexus Description PR undercut etcher Silicon trench etcher Contact Printer Backside Alignment Track coater E-beam evaporator Tri-gun super source e-gun Spin/rinse/dry Spin/rinse/dry Wafer bonder 4-point probe Optical microscope Stress measurement Market Value $ 25,000.00 178,000.00 65,000.00 20,000.00 18,500.00 30,000.00 15,000.00 3,500.00 3,500.00 90,000.00 12,000.00 13,000.00 25,000.00 4 Cleanroom Research Laboratory Current Research Support Activities Several faculty members have research activities in the cleanroom facility. At the end of FY0506, the total number of active users includes 51 graduate students, 9 undergraduates, 6 research scientists, and 5 postdocs. Current Faculty Research Projects Supported (alphabetical order) Prof. Bruce Gnade Flexible substrates/electronic textiles Organic semiconductor devices/circuits Prof. Gil Lee Nanotube and device research Assoc. Prof. Matt Goeckner LPCVD nitride and polysilicon thin film depositions. Assoc. Prof. J.B. Lee MEMS/NEMS fabrication LPCVD oxide thin film depositions Asst. Prof. Walter Hu Lithography and patterning Nano Imprint Lithograply Nano device research Prof. Larry Overzet Nanotube growth research Diamond-like Carbon films Assoc. Prof. Eric Vogel Electron device simulation Nano device research. Assoc. Prof. Jiyong Kim Atomic layer deposition Lithography and patterning Nano device research. Prof. Robert Wallace High-k Dielectrics High-mobility substrates Organic semiconductor devices Prof. Moon Kim CVD Deposition Nano device research Prof. Anvar Zakhidov OLED Development Organic Solar cell development External Users IMI Optical and E-Beam lithography Metal and insulator film deposition Thermal oxide growth, multiple film sputter deposition Metal and insulator plasma/wet etch Extensive physical metrology Special substrates 5 Cleanroom Research Laboratory Progress Report Personnel and Organizational Structure The management of the Cleanroom facility was transferred to the School of Engineering and Computer Science in the fall of 2004 by the Provost. The management structure is shown in the organizational chart below. Faculty users inform the Director of their research needs. External (non-UTD) users gain access to the facility through a formal UT system-approved agreement. The operations staff now includes the associate director, two process engineers, five equipment engineering technicians and an administrative assistant. Clean Room Management Structure D ean EJS Sr. As soc. D eanO ps /F inanc e E xternal Us er Advisory G roup C lean Room Director Fac ulty Us er Advisory G roup Adm in. As sist ant Ass oc . Clean R oom D irec tor Process En gineers Technic ians New Hires The Cleanroom added the position of Administrative Assistant II to the staff in 2006. Administrative Assistant II – Vickie Lincoln Staff Assignments (in alphabetical order) Mr. Keith Bradshaw, Equipment Engineering Technician – Cleanroom infrastructure, repair and maintenance of lithography, PVD, thermal, and metrology tools. Mr. Arnold Duenes, Equipment Engineering Technician – Cleanroom infrastructure, repair and maintenance of wet chemistry, PVD, and metrology tools. Responsible for tool installations. Mr. John Goodnight, Equipment Engineering Technician – Cleanroom infrastructure, repair and maintenance of contact print / Laser lithography, PVD, and metrology tools. 6 Cleanroom Research Laboratory Ms. Vickie Lincoln, Cleanroom Administrative Assistant II – Primarily responsible for cleanroom procurement, security access, and financial accounting. Mr. Wallace Martin, Associate Cleanroom Director – Oversight and supervision of the day-today operations and personnel of the Cleanroom facility. Mr. John Maynard, Equipment Engineering Technician – Cleanroom infrastructure, repair and maintenance of PVD, plasma ash and etch tools. Dr. Gordon Pollack, Process Integration Engineer – Primarily responsible for Thermal (atmospheric furnace), RTA (rapid thermal anneal), LPCVD, PECVD, and plasma etch. Develops standard operating procedures, defines process windows, process control, and user training. Dr. Pollack is currently defining and documenting the complete process flow for active CMOS device construction. Mr. Scott Riekena, Equipment Engineering Technician – Cleanroom infrastructure, repair and maintenance of PECVD, LPCVD, and plasma etch tools. Responsible for tool installations. Dr. Roger Robbins, Process Engineer and Safety Officer – Primarily responsible for E-beam, laser and contact print lithography, wet chemical processing, PVD, and EHS (environmental health and safety) for the Cleanroom. Develops standard operating procedures, defines process windows, process control, and user training. Dr. Robert Wallace, Cleanroom Director – Responsible for the overall supervision of the Cleanroom facility. Liaison with faculty and external users on behalf of the university. 1 2 3 4 Existing Cleanroom Configuration The layout of the EJS Cleanroom Research Laboratory is shown on the right. A total “white space” of 4256 sq. ft. is available in the facility. Bay 1 primarily contains a wide array of deposition and etch systems, in addition to plasma research apparatus. Bay 2 contains several characterization and inspection tools, as well as new deposition systems and the new solvent hood. Bay 3 contains lithography and wafer cleanup hoods, and Bay 4 constitutes the thermal process area. The NanoTech Institute has specialized organic deposition equipment in Bay 5. Bay 3 Bay 2 Bay 1 Gown Hallway 6 Nano 5 Bay 4 7 Cleanroom Research Laboratory New Equipment and Capabilities This year has seen the fruits of the new investment in equipment and safety improvements in the Cleanroom. We have received most of the tools we ordered early in the fiscal year, and these constitute a major upgrade of the UTD cleanroom toolset. These investments substantially enhance our standing in university cleanroom capabilities. The following sections describe a portion of this new upgraded toolset. Laser Pattern Generator The cornerstone of the facility is the lithography capability to create patterns that define device structures. In mid2006, we obtained and prepared for use a new Heidelberg DWL66 laser pattern generator to make masks and directwrite patterns onto wafer substrates. This tool replaces the nearly Thirtyyear-old Texas Instruments E-Beam lithography tool, EBM14. It sports four lenses to cover the resolution range from five microns to .7 microns. The speed ranges from quite slow on the high resolution lenses, taking fourteen hours or so to write a 4x4 inch pattern on a 5x5 Heidelberg DWL66 Laser Pattern Generator inch mask, to a reasonable speed for the low resolution lens, taking about an hour for large geometry patterns. Optical Microscopy A new Leica INM 100 Optical Microscope system was installed in February 2005. This instrument is newly designed as a universal reflective semiconductor inspection microscope with image capturing software. It also has a second illumination source for fluorescence microscopy. This enables researchers to examine dyed materials or detect photoresist on their wafers. The INM 100 has a video camera for real time display of images with extra magnification in the video chain for a maximum magnification of 2500X. It also has interference contrast optics to enable researchers to optimize the contrast in certain situations. The microscope is mounted on a vibration isolation table to remove any building vibration that might cause blurred vision. In general, this microscope serves a broad variety of users, especially users requiring high resolution planar lithography. Leica INM 100 8 Cleanroom Research Laboratory Spin-Rinse Dryer A new spin rinse dryer, Micro Tech Avenger Basic 8, improves process yield in the laboratory. With this tool, we can dry substrates (3” and 4” wafers) after wetprocessing without leaving water sediment spots on the substrates. This helps eliminate problems with adhesion or contamination in later process steps. Spin-rinse dryer tool FTIR Spectrometer The Fourier Transform Infra-Red Spectrometer (FTIR), Nicolet 4700, measures the absorption of infra-red light that is incident on a sample. The absorption produces spectral features that are unique for each compound and can be utilized to measure bulk chemical properties of substrates and determine the composition of a film on a substrate surface. A Grazing incidence attenuation total reflection (GATR) attachment is available for studies of extremely thin films. For example, a researcher can use the GATR substrate adapter to measure OH bond concentration on silicon as a function of various plasma treatments. We are actively building a library of common FTIR Spectrometer substances found in the Cleanroom to help identify contamination, etc., to solve future problems. Thermal Evaporator This thermal evaporator, Denton Explorer 14, uses a metal boat containing specific deposition material and uses electrical current to heat the boat directly. The material then evaporates and creates a vapor in the vacuum bell jar. The vapor condenses on the substrate, creating a thin film of whatever material evaporated. Time and temperature determine the thickness and quality of the film. This tool can evaporate both metallic and non-metallic substances. It can also deposit two different materials (codeposit) both simultaneously and sequentially. Denton Thermal Evaporator 9 Cleanroom Research Laboratory Wet Hoods We have installed all of the newly purchased chemical hoods manufactured by Leatherwood Plastics pictured below. These are specified to conform to all the modern fire and life safety standards. Both of the acid hoods contain acid neutralization systems, which reduce the hazard exposure to the users by allowing them to dispose of waste solutions in the sink instead of capturing the waste in containers for disposal. In addition to this safety operational advance, the solvent hoods also allow disposal of common solvents in special sinks whose drains lead to a capture vessel under the deck. This capture vessel has an electronic sensor that prevents overfilling and spills by controlling the sink’s drain valve. Cleanroom staff disposes of the waste solvents when the vessel is full. Both solvent hoods contain modern fire suppression systems that are connected to the building alarm to evacuate the building if a flash fire occurs. Acid Hood “RCA” Cleanup Hood Base Hood Solvent Bench Solvent Bench 10 Cleanroom Research Laboratory DekTak Profilometer One of the more heavily used new tools we have just installed is the DekTak Profilometer, (Dektak 8). This tool measures the vertical profile of developed or etched patterns by lightly dragging a sharp stylus across the surface and detecting its vertical movement; thereby, allowing users to determine resist thickness, etch depth, and general step height distances. Vertical sensitivity is in the fractions of an Angstrom (0.01 nano-meters). The tool uses a general purpose stylus with a 12.5 micron radius. This system is highly automated but quite user friendly, and it can measure features anywhere on a substrate up to an eight-inch diameter wafer. DekTak Profilometer NanoSpec Film Thickness Analyzer A new NanoSpec 6100 film thickness measurement system was installed in March 2006. The 6100 uses non-contact spectroscopic reflectometry to measure sites as small as 25 µm in diameter on reflecting substrates. The tool measures film thicknesses in the range of 200 Å – 20 µm with the visible light source and 25 Å – 20 µm with the UV light source. Substrates up to 200 mm in diameter can be measured on the system. The instrument uses a computerized sample stage and an auto focus system to rapidly generate 2D and 3D film thickness uniformity maps and statistics. These capabilities are very useful for optimizing the uniformity of thin film deposition and etch processes. The tool is also capable of measuring multiple layers if the optical constants of the materials are known. NanoSpec Film Thickness Gauge Wire Bonders The Cleanoom has purchased new wire bonders (manufactured by Kulicke and Soffa) to enable electrical connection between microcircuits and external electronics. In order to cover the wide diversity of requirements from our research staff, we have purchased both a ball bonder and a wedge bonder. The K&S 4524 is a Ball Bonder designed for general purpose wire bonding used for connecting device substrates to packages. This tool works by creating a molten “ball” at the end of a Gold bonding wire and then mashing it onto the device pad. The K&S 4523 Wedge bonder works by “rubbing” or “wedging” the end of a gold wire onto the bonding pad of a device. This technique works better on deep cavity mounts where tight control over the wire tail length is important and where smaller, more delicate bonding pads are used. 11 Cleanroom Research Laboratory K&S Wedge Bonder (Left) and Ball Bonder (Right) Hotplate Hoods To assure personal chemical safety, we have designed and built small independent exhaust hoods to capture solvent fumes emanating from substrates heating on our open hotplates. Each hood consists of a hinged lid with exhaust slots in its edges allowing fresh air flow on three sides. The air curtain contains and exhausts fumes from substrates. This process prevents dangerous vapors from contaminating room air and solves the problem of not being able to place the non-explosion proof hotplates in a solvent hood. Mini-Hoods for open hotplates SamCo UV Ozone Stripper We have obtained an UltraViolet Ozone Stripper to remove thin films of organic contaminants from the surface of substrates. This tool has an ozone generator using Oxygen and a high voltage exciting cell to introduce concentrated ozone into a chamber containing ultra violet light so that both the UV and ozone working together produces a high rate of organics removal. The process will remove thin remnants of organic films from surfaces prior to etching to eliminate etch delays and non-uniform etch profiles. SamCo UV Ozone Stripper 12 Cleanroom Research Laboratory Zeiss Leo Supra-40 Scanning Electron Microscope We have purchased a high capability Scanning Electron Microscope (SEM), the LEO GEMINI Supra 40, and added a number of detectors to make it a highly versatile tool for examining, analyzing, manipulating, and probing nano-scale devices. The resolution of this third generation Gemini electron column Schottky thermal field emission tool is on the order of 10 Angstroms. This (level of) resolution is sufficient to define features on carbon nano-tubes, which are at the forefront of current advanced device research. In addition to the high resolution imaging capability, we have also added detection systems to analyze materials and their characteristics. Scanning Electron Microscope with nano-Lithography and probing capability The first detector is an EDAX Genesis system that detects X-rays from atoms emitted by the interaction with the incident electron beam and produces atomic spectral information identifying the material under inspection. This capability is highly useful in performing failure analysis during device fabrication. A second detector, the Electron Back Scatter Diffraction (EBSD) system, detects backscattered electron emission patterns that can be converted to crystal orientation measurements. The methods, called Orientation Imaging Microscopy (OIM), is used in examining polycrystalline materials, among other applications. We also have installed a Scanning Transmission Electron Microscope detector (STEM) whereby electrons from the scanning beam pass all the way through (thin) samples and impinge on the STEM detector positioned underneath the sample. This feature produces a very high resolution image with additional information unavailable to the top detection methods. The tool not only has an Everhart-Thornley secondary electron detector for standard SEM imaging, but also an In-Lens detector that enhances the image signal for high resolution close-up images. 13 Cleanroom Research Laboratory The versatility of the system is considerably enhanced by the Zyvex Nano-Manipulator Stage and Probe Station System. The system enables the researcher to view such sub-microscopic devices such as carbon nano-tube structures, manipulate them physically by contacting them with extremely sharp tungsten probes, and then measure their electrical characteristics with the probe station electronics. This system includes a low-noise capability. Capping off the extraordinary capabilities of the SEM is a Nabity Electron Beam Lithography system. This adjunct software and hardware system commands the electron beam column and allows the researcher to pattern circuit elements small enough to interface with nano-world devices. Zyvex Nanoprobe CPK Spin Developer - Solvent We have received a new spin developer for solvent-based photolithography processing. This will replace most of our “dip” photoresist developer processes that inherently contaminate devices with particles and sedimentation water spots. The new tool is a dynamic spin process developer that throws off the particles and continuously refreshes the wafer surface with clean liquid developer and rinse, thus resulting in particle and spot free wafers. Spin processing will make a large improvement in device “yield.” The developer chemicals are contained in pressurized canisters and administered onto the wafer through spray nozzles in the spinner’s domed chamber. CPK Solvent spin developer CPK Spin Developer/Etcher – Base/Acid We have also installed the second of two new spin developer tools. This tool develops optical resist on various substrates from wafers to optical photomasks. It also has the capability of developing photomask resist and then continuing the process to etch chrome to complete the process for a full photomask. The remaining resist can either be stripped in the solvent spin developer or ashed off in the March plasma asher. In any case, the spin process produces a much cleaner product than the current manual developer or etch processes. Develop and Etch (left)spinner 14 Cleanroom Research Laboratory Plasma Asher This new tool, March PX250, is a highly versatile plasma etcher. It will produce three distinctly different plasma conditions: 1) Standard plasma etch, 2) Reactive Ion Etch, and 3) Downstream Plasma Etch. It achieves this via a system of removable and reversible electrode shelves whereby the substrates to be etched can be placed on a grounded or powered or neutral shelf, thus producing the various plasma etch conditions. We have initially assigned this tool for Oxygen plasma ashing of organic films – mainly photoresist. March Asher Tool New Process Developments Lot Traveler System As new process recipes are developed and incorporated into process flows of increasing complexity, the need to store this knowledge base in a form accessible to present and future cleanroom users becomes increasingly important. To this end, we have created a database of process recipes and flows using MS Access. We also provide a user interface to allow viewing, editing, and printing of the process flows. Below is an example of a typical page from a lot traveler. Note that a wafer line is provided in the traveler to allow the user to create wafer splits within a process flow. 15 Cleanroom Research Laboratory Process/Device Simulation An important part of the process/device development methodology is the ability to accurately simulate complex semiconductor process sequences and determine their effect on electron device characteristics, and now the Cleanroom user has available a full suite of advanced process and device simulation tools from Synopsys Corp. This new capability is being used by the process engineering staff to develop a baseline MOS transistor process flow. Simulation examples for a baseline 2µ NMOS transistor process are shown below. Transistor Fabrication With the tool upgrades described in this report, the UTD Cleanroom now has the capability to fabricate a wide range of silicon-based devices. One example of this enhanced process capability is the development by cleanroom engineering staff of a baseline 2µ NMOS transistor flow. Faculty researchers have requested this capability to allow students to fabricate transistors and test structures for use in their advanced device and materials research projects. NMOS Transistor with 2µ Channel 16 Cleanroom Research Laboratory New Capabilities Scheduled for Installation in NSERL Unaxis Etch Tools Two new Unaxis plasma etch tools have been ordered for delivery in November 2006 for installation in NSREL. One tool will be configured to run fluorine-based chemistries for use in etching non-metallic films such as silicon dioxide, silicon nitride, and polysilicon. This tool will also be able to perform deep silicon etching that is used in the fabrication of Micro-Electro-Mechanical Systems (MEMS). The second tool will be configured for etching metallic films using chlorine based chemistries. Both tools will be equipped with vacuum load-locks to prevent potentially toxic etch byproducts from venting to the Cleanroom during sample load and unload. Tystar Atmospheric Furnaces A four-stack Tystar atmospheric furnace system has been ordered for delivery in November 2006. The system will provide the basic oxidation and annealing capability needed for silicon transistor and MEMS fabrication. The system will be configured with two oxidation tubes and two tubes for solid-source dopant diffusion and annealing. The furnaces are fully computer-controlled with automated load/ unload stations and will accept wafers up to 150 mm in diameter. Life Safety enhancements New Fire Suppression systems As new equipment has been installed in the current Cleanroom, we have continued to implement and upgrade OSHA approved fire suppression systems. In addition to new chemical hood system installation described above, fire alarm pull stations were upgraded from exposed “push buttons” to regulation fire pull stations and relocated from inaccessible positions to approved locations next to the exits Life Safety Program This marks the second year of intensive implementation of the focused training and safety rules established in 2005 to improve our safety performance. As we gain experience in this effort, we 17 Cleanroom Research Laboratory are continuously improving our sensitivity to problems and upgrading the rules to in response to our new safety awareness. In the coming year, as we move into the new Natural Science and Engineering Laboratory Building, we will need to revamp our documentation and safety rules to include specific safety issues in the new environment. Safety Training The WEB based safety training courses from SemiZone (entirely subsidized by the EJS) that were first implemented last year have been well received and are continuing to be given to every new user requesting use of the Cleanroom. We now have a well-defined approval procedure whereby new users are given a live Safety Class by CR staff during a tour of the Cleanroom; they are then required to view the on-line material, which includes a quiz. These steps are signed off by staff and management as the final step qualifying users to enter the cleanroom. In addition, before they are allowed to use any equipment, users must undergo specific training by the staff on the tools they intend to use. Chemical labeling Systems (NFPA, HMIS, Pipe Labeling System) The chemical labeling systems implemented last year in the current clean room will be implemented in the new cleanroom also. This will keep us in compliance with the general OSHA rules of safety in and industrial environment. CERT Rescue Training for Staff The University of Texas at Dallas, is upgrading its Environmental, Health and Safety Department. One of the programs in doing so is to train qualified staff as emergency responders across campus in handling sudden emergency situations. To this end, most of the CR staff has completed Community Emergency Response Team (CERT) training with the UTD Police Department. This will give us an important resource connection to the campus first responders and enable us to be a trained support team in the event of an overwhelming emergency situation. We intend to involve all qualified CR staff over the coming years. 18 Cleanroom Research Laboratory WEB Site: http://www.utdallas.edu/research/cleanroom/ The UTD Cleanroom web continues to expand its information about the facility. The site was restructured to better describe the facility and its capabilities, as well as to provide the cleanroom user with operating manuals, safety information, and tool operational status for cleanroom tools. The site also provides links to faculty and staff web sites where additional information relating to the UTD Cleanroom can be obtained. 19 Cleanroom Research Laboratory Future Plans NSERL Clean Room The new Natural Science and Engineering Research Laboratory, NSERL, will include a new cleanroom facility equipped with a modern life-safety and security infrastructure. The facility will be approximately 5000 sq. ft. of class 10,000 space with five clean bays dedicated to the various process modules requiring cleaner conditions. The Cleanroom will move to its new location during the first quarter of 2007. NSERL Tool Migration The Cleanroom management has developed the logistical plans for tool migration to the new Natural Science and Engineering Research Laboratory over the last 18 months. Virtually all Cleanroom process tools will move to the NSERL facility in the first quarter of 2007. Plans are being made for a rapid, but orderly transition. The map below shows the new NSERL cleanroom layout. The condensed schedule of the overall task below reflects our goal of bringing the Cleanroom up to speed with the current processing capabilities by the end of April 2007. New process tools and capabilities are scheduled to be brought on line in early June 2007. 20 Cleanroom Research Laboratory NSERL Cleanroom Layout 21