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posted:
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5.4: A 5GHz CMOS Transceiver

for IEEE 802.11a Wireless LAN



David Su, Masoud Zargari, Patrick Yue,

Shahriar Rabii, David Weber, Brian Kaczynski,

Srenik Mehta, Kalwant Singh, Sunetra Mendis,

and Bruce Wooley1





Atheros Communications, Sunnyvale, California

1Stanford University, Stanford, California

Outline

❑ Introduction: 802.11a Wireless LAN

❑ Architecture

❑ Radio Design

• Transmitter

• Receiver

• Frequency Synthesizer

❑ Summary

IEEE 802.11a WLAN

s Frequency: 5 GHz UNII (Unlicensed National

Information Infrastructure)

200mW 800mW

40mW







5.15G 5.25G 5.35G 5.725G 5.825G



s Total UNII Bandwidth: 300 MHz (> IEEE 802.11b)

s Modulation: OFDM

(Orthogonal Frequency Division Multiplexing)

+ BPSK / QPSK / 16QAM / 64QAM

s Data Rate: 6 - 54 Mbps

Spectral-Efficient Modulation

s 64-QAM (Quadrature Amplitude Modulation)

— Large signal to noise ratio > 30dB

• Phase noise

• I/Q mismatch

s OFDM (Orthogonal Frequency Division Mux)

— Large peak to average power ratio of 52 or

17dB

• TX: large power backoff

• RX: large dynamic range

• Some signal clipping can be tolerated



Requires High Linearity

Architecture

Architecture + –

Direct - No off-chip IF filter - LO leakage

Conversion - Single synthesizer - LO pulling

- Quadrature LORF

- DC offset

Traditional - Low LO leakage - Off-chip IF filter

Superheterodyne - Weak LO pulling - Two synthesizers

- No quadrature LO

- Design flexibility



Dual conversion with 1GHz sliding IF

Radio Transceiver





Transmitter

Tx_in







Synthesizer Control

5GHz



Rx_out



Receiver

Dual Transmit Conversion



Freq(Hz)

dc 1G 4G 5G

LOIF LORF

s Radio Frequency (RF) ≠ Local Oscillator (LO)

• LO leakage is out of band

• LO pulling by power amplifier is reduced

LO RF

s Sliding Intermediate Frequency (IF): LO IF -

= --------------

4

• Single synthesizer

• Excellent 1 GHz quadrature for good transmit image

rejection

s Double Image-reject mixers

• Avoid IF filtering of sideband

Transmitter Block Diagram

LORF(I) LOIF(I)





TX_I



PA

RF_OUT LOIF(Q)

5 GHz



TX_Q



LORF(Q) LOIF(I)

Dual Receive Conversion

fIF fRF



Freq(Hz)

dc 1G 3G 4G 5G

LOIF LORF



s No external IF filtering

s Channel selection at Baseband with passive

LC filtering

s Very high IF of 1GHz

• 3GHz image is 2GHz away from 5GHz signal

• Inherent bandpass filtering of 3GHz: –23dBc

• RF mixer: 5-4 = 1GHz (IF) and 5+4 = 9GHz

• No image-reject mixers

Receiver Block Diagram

LORF LOIF (I)



PGA

off-chip RX_I

LC LPF

LNA

DAC Offset

RF_IN

DAC Control

5GHz



off-chip

LC LPF RX_Q

PGA



LOIF (Q)

Synthesizer

s Single synthesizer with sliding IF:

LO RF

LO IF = --------------

-

4

s Divide-by-four generates quadrature LOIF

• Excellent I/Q matching

s P+/N-well varactor

s Frequency Plan:

RF 5.160 to 5.340 GHz 10 MHz spacing

LORF 4.128 to 4.272 GHz 8 MHz spacing

LOIF 1.032 to 1.068 GHz 2 MHz spacing

Synthesizer Block Diagram





8MHz off-chip

PFD CP VCO

RC LPF



32 16/17 LORF

(4GHz)



Decoder 4 LOIF

(1GHz)



Channel Select

5GHz CMOS RF Design

s Advantages:

• Low-cost, high-yield

• Multi-layer interconnect makes decent inductors

• High-level of integration supports sophisticated

digital signal processing*



s Challenges:

• 5 GHz: 0.25µm + narrowband with inductors

• No high-Q BPF: architecture + dynamic range

• Process/Temp Variation: DSP algorithms

• Noise/Power performance limitations



* J. Thomson et al, ISSCC 2002, Paper 7.2

Power Amplifier Design

s Large peak to average ratio (PAR) of 52 or 17dB

s Signal peaks are infrequent: 0.25dB SNR

degradation when PAR reduced to 6dB for

16-QAM*.

s Implications:

• Poor power efficiency

• With 6dB PAR, to obtain 40mW (16dBm) requires

Psat of ~22dBm or 160mW

• With 17dB PAR, to obtain 40mW (16dBm) requires

Psat of ~33dBm or 2W



*Van Nee & Prasad, OFDM for Wireless Multimedia Communications,

Artech House, 2000

Power Amplifier Topology

Vpa = 3.3V

s Class A operation

L2* L3 s Cascoded

Output • 3.3V supply voltage

C2 • Stability

s Capacitive Level-shift

• Metal-2,3,4,5 stacks

Input M2 M3 s Inductive loads

L4* s Differential

• Off-chip balun

Bias

* C.P. Yue and S.S. Wong, IEEE JSSC, May 1998

Power Amplifier Schematic

Vpa=3.3V



L3p L2p L1p L1n L2n L3n



C1p C1n

Vout+ C2p C2n Vout-









M3p M2p M2n M3n



L4p L4n

Bias Bias Bias Bias

Vin- Vin+



PSAT = 22 dBm

Measured BPSK OFDM Spectrum

16.25MHz









POFDM = 17.8 dBm

Measured Transmit Constellation









64QAM (300kHz) modulated signal

Measured Transmit Output Power

18

OFDM Output Power (dBm)





16





14

Carrier Leak –29dBc

12 Spectral Images –51dBc



10

6 9 12 18 24 36 48 54

Data Rate (Mbps)

LNA Schematic

Vdd



Vout



M3 M4



Vin+ M1 M2 Vin-

Lsp Lsn









Receiver NF: LNA to Baseband = 8dB

Programmable Baseband Amplifier

Vdd Vdd

Bias_p



Vout- Vout+

R2 R2



Vin+ R1 Vin-





Bias_n



Vos+ Vos-

Bias_n





offset control

Measured Receiver Performance



10

IF Mixer Output (dBm)







0

Max. Gain

-10

-20

-30

-40 Min. Gain

-50

-60

-90 -80 -70 -60 -50 -40 -30 -20 -10 0

RF Input (dBm)

Voltage Controlled Oscillator (VCO)









Vc



Control Control



M1 M2

Composite Phase Noise at 5GHz

Phase Noise (dBc/Hz) –80



–90



–100



–110



–120



–130

1k 10k 100k 1M 10M

Frequency (Hz)

Die Photograph





Tx





Rx









Logic

Synth





Bias

Measured Performance

TX Output Power Level 22 dBm

RX Chain Noise Figure 8 dB

Phase Noise (∆f=1MHz) –112 dBc/Hz

Supply Voltages 2.5 V & 3.3 V I/O

TX Chain Power Dissipation 790 mW

RX Chain Power Dissipation 250 mW

Synthesizer Power Dissipation 180 mW

Technology 0.25 µm 1P5M CMOS

Package 64-pin LPCC

Die Size 22 mm2

Conclusions

s IEEE 802.11a radio transceiver in 0.25 µm

standard digital CMOS for 5-GHz WLAN

s No external IF filter:

• TX: double image-reject mixers

• RX: very high IF of 1GHz

s Dual conversion with sliding IF: single

synthesizer

s Integration of:

• transmitter with 22dBm output power

• receiver with 8dB noise figure

• synthesizer with –112dBc/Hz (∆f=1MHz)

Acknowledgement

s Support of the Wireless Team at Atheros for

design, layout, and testing. In particular:

H. Dieh, J. Kung, R. Popescu, A. Ong,

J. Zheng, D. Nakahira, R. Subramanian,

J. Kuskin, A. Dao, D. Johnson, C. Lee, L. Thon,

P. Husted, W. McFarland, S. Wong, R. Bahr, T.

Meng

s Assistance of TSMC. In particular: S. C. Wong

and B. K. Liew.



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