Pad LayoutsSoldering Process Pad LayoutsSoldering Process by dfgh4bnmu

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									                                                                       Pad Layouts/Soldering Process
                                                                                     Vishay General Semiconductor

                                  Pad Layouts/Soldering Process

VISHAY GENERAL SEMICONDUCTOR RECOMMENDED MINIMUM MOUNTING PAD LAYOUT
SIZES FOR THE SURFACE MOUNT RECTIFIER


                              DFS BRIDGE                                                         MBS BRIDGE

            0.047 MIN.                                                         0.023 MIN.
            (1.20 MIN.)                                                        (0.58 MIN.)




                                                                                                                      0.272 MAX.
                                                   0.404 MAX.
                                                                                                                      (6.91 MAX.)
                                                  (10.26 MAX.)                    0.030 MIN.
             0.060 MIN.                                                           (0.76 MIN.)
             (1.52 MIN.)




                                  0.205 (5.2)                                                         0.105(2.67)
                                  0.195 (5.0)                                                         0.095(2.41)




                                  DO-218                                                             TO-263
                                                                                                     0.42
                                                                                                           MIN.
                                                                                                   (10.66)
                                                             0.091 (2.3)
                                                             0.067 (1.7)
                                                                                                                     0.33
                                                             0.116 (3.0)                                                   MIN.
                                                                                                                    (8.38)
     0.413 (10.5)
                                                             0.093 (2.4)
     0.374 (9.5)
                                                                                     0.670 (17.02)
                                                                                     0.591 (15.00)

                                           0.150 (3.8)                                                                0.15
                          0.366 (9.3)                                                                                       MIN.
                                           0.126 (3.2)                                                               (3.81)
                          0.343 (8.7)                                              0.08
                                                                                          MIN.
                               0.606 (15.4)                                       (2.032)
                               0.583 (14.8)
                                                                                    0.105 (2.67)
                                                                                    0.095 (2.41)




                                                All dimensions in inches (millimeters)




Document Number 88854                                                                                                     www.vishay.com
24-Apr-07                                                                                                                              1
Pad Layouts/Soldering Process
Vishay General Semiconductor

                     DO-214AC/DO-214BA                                                      SMC/DO-214AB

                                                                                                    0.185 MAX.
          0.066 MIN.                         0.074 MAX.                                             (4.69 MAX.)
          (1.68 MIN.)                        (1.88 MAX.)
                                                                               0.126 MIN.
                                                                               (3.20 MIN.)

                                                                                                      0.060 MIN.
         0.060 MIN.
                                                                                                      (1.52 MIN.)
         (1.52 MIN.)
                                 0.208                                                              0.320 REF
                              (5.28) REF


                        SMB/DO-214AA                                                    DO-220AA (SMP)
                                                                                                                                0.030
                                                                                       0.105                                   (0.762)
                                            0.85 MAX                                                         0.025
                                                                                       (2.67)
                                           (2.159 MAX)                                                      (0.635)

          0.086 MIN
          (2.18 MIN)
                                                                   0.100                                                          0.050
                                                                   (2.54)                                                         (1.27)
         0.060 MIN
         (1.52 MIN)
                              0.220 REF



                        TO-277A (SMPC)                                                        MicroSMP
                          0.189
                                 MIN.
                          (4.80)                                                        0.079
                                                                                                                      0.032
                                                                                        (2.00)
                                                                                                                      (0.80)

                                          0.186                       0.043                                                    0.032
                                                 MIN.
            0.268                         (4.72)                      (1.10)                                                   (0.80)
            (6.80)
                                                                                                   0.020
                                           0.050                                                   (0.50)
                                                  MIN.
                                           (1.27)
                     0.041              0.055
                     (1.04)                    MIN.
                                        (1.40)


                       DO-215AA (SMBG)                                                  DO-215AB (SMCG)

                                                                                                 0.310 (7.87)
                               0.165 (4.19)

          0.85                                                           0.125
         (2.16)                                                          (3.17)

                              0.060 (1.52)
                                                                                              0.050 (1.27)

                                                   All dimensions in inches (millimeters)


www.vishay.com                                                                                                           Document Number 88854
2                                                                                                                                    24-Apr-07
                                                                                                                                 Pad Layouts/Soldering Process
                                                                                                                                                                      Vishay General Semiconductor


                                DO-213AA (GL34)/DO-213AB (GL-41)                                                                     DIMENSIONS in inches (millimeters)
                                                                                                                                                                                              DO-213AA                        DO-213AB
                                                                    C
                                                                                                                                                                                               (GL34)                          (GL41)
                                                                                                                                                                 A                      0.177 (4.5) REF                    0.236 (6.0) REF
                                         B
                                                                                                                                                                 B                      0.079 (2.0) MIN.                   0.118 (3.0) MIN.

                                                                                                                                                                 C                     0.079 (2.0) MAX.                    0.138 (3.5) MAX.
                                                      D
                                                                                                                                                                 D                     0.050 (1.25) MIN.                   0.050 (1.25) MIN.
                                                                  A


VISHAY GENERAL SEMICONDUCTOR RECOMMENDED SOLDERING PROCESS FOR SURFACE
MOUNTED AND AXIAL-LEADED COMPONENTS
Wave soldering has the highest solder temperature and heat                                                                       Wave Soldering Notes
transfer rates that are imposed by small resin molded parts
                                                                                                                                 The profile illustrated above depends ultimately on the type
like transistors, integrated circuits and surface mount
                                                                                                                                 of flux used with the solder paste. The peak temperature for
components. The profile has a short dwell time in the solder
                                                                                                                                 this process should not exceed 265 °C for PC-board
pot and a preheat to minimize thermal shock for ceramic
                                                                                                                                 mounting.
components and temperature problems with resin molded
parts. A typical temperature profile using 63/67 alloy solder
is shown below.
Fig. 1 - Sn-Pb Wave Soldering Profile                                                                                            Fig. 2 - Lead (Pb)-free Wave Soldering Profile
                                 235 °C - 260 °C Wave Temperature
                    250                                                                                                                              300                               10 s                          Full line: typical
                                                                                         Maximum temperature                                                                                                       Dotted line: process limits
                                                          Second Wave
                                                                                         can not exceed 265 °C
                               First Wave                                                for PC-board mounting                                       250           235 °C ~ 260 °C                  Second wave
                    200
 TEMPERATURE (°C)




                                                                                                                                  TEMPERATURE (°C)




                                                             - 5 °C/s                                                                                200                                               ca. 5 K/s
                              + 200 °C/s                                                                                                                                  First wave
                    150                                                                                                                                         < 105 °C
                                                                                                                                                               to 165 °C                                       ca. 2 K/s
                                                                                                                                                                      ca. 2 K/s
                                                                                                                                                     150

                    100                                                                                                                                           100 °C ~ 130 °C
                              + 2 °C/s                                                                                                                                                  forced
                                                                                                                                                     100                                cooling
                                                                                     - 2 °C/s
                                             Preheat Zone
                    50                                                                                                                                                          2 K/s
                                                                                                                                                     50
                                                                                                                                                                                              Activation
                              27 °C                                                                                                                                                           of Flux

                      0                                                                                                                               0
                          0                     60                120                            180             240                                       0               50                 100              150             200               250
                                                                 TIME (s)                                                                                                                           TIME (s)


REFLOW PROFILE
                                                                                                See Table 1 and Table 2                                    tp
                                                                                TP                                                                                              Critical Zone
                                                                                                                                                                                  TL to TP
                                                                                                                           Ramp-up


                                                                                TL
                                                                                                                                                                 tL
                                                                                      Ts max
                                                                  TEMPERATURE




                                                                                       Ts min

                                                                                                          ts
                                                                                                       Preheat
                                                                                                                                  Ramp-down


                                                                                25
                                                                                                       t 25 °C to Peak
                                                                                                                          TIME


Document Number 88854                                                                                                                                                                                                         www.vishay.com
24-Apr-07                                                                                                                                                                                                                                  3
Pad Layouts/Soldering Process
Vishay General Semiconductor


  CLASSIFICATION REFLOW PROFILE
  PROFILE FEATURE                                        Sn-Pb EUTECTIC ASSEMBLY                        LEAD (Pb)-FREE ASSEMBLY
  Average ramp-up rate (Ts max to TP)                         3 °C/second maximum                            3 °C/second maximum
  Preheat
  - Temperature Minimum (Tsmin)                                          100 °C                                        150 °C
  - Temperature Maximum (Tsmax)                                          150 °C                                        200 °C
  - Time (min to max) (ts)                                         60 - 120 seconds                              60 - 180 seconds
  Time maintained above:
  - Temperature (TL)                                                     183 °C                                        217 °C
  - Time (tL)                                                      60 - 150 seconds                              60 - 150 seconds
  Peak Temperature                                                    (Table 1)                                     (Table 2)
  Time within 5 °C to actual peak temperature (tp)                 10 - 30 seconds                               20 - 40 seconds
  Ramp-down rate                                              6 °C/second maximum                            6 °C/second maximum
  Time 25 °C to peak temperature                                  6 minutes maximum                           8 minutes maximum
Note:
All temperatures refer to topside of the package, measured on the package body surface


TABLE 1 - Sn-Pb EUTECTIC PROCESS                                            TABLE 2 - LEAD (Pb)-FREE PROCESS
PACKAGE PEAK REFLOW TEMPERATURES                                            PACKAGE CLASSIFICATION REFLOW
                                                                            TEMPERATURE
  PACKAGE                 VOLUME mm3            VOLUME mm3                    PACKAGE             VOLUME mm3 VOLUME mm3 VOLUME
  THICKNESS                  < 350                 ≥ 350                      THICKNESS              < 350    350 - 2000 mm3 > 2000
  < 2.5 mm                 240 + 0/- 5 °C        225 + 0/- 5 °C               < 1.6 mm             260 + 0 °C*      260 + 0 °C*     260 + 0 °C*
  ≥ 2.5 mm                 225 + 0/- 5 °C        225 + 0/- 5 °C               < 1.6 mm - 2.5 mm    260 + 0 °C*      250 + 0 °C*     245 + 0 °C*
                                                                              ≥ 2.5 mm             250 + 0 °C*      245 + 0 °C*     245 + 0 °C*
                                                                            * Tolerance: The device manufacturer/supplierer shall assure
                                                                            process compatibility up to and including the stated classification
                                                                            temperature at the rated MSL level.
Notes:
1. Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks.
2. The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow
processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages
may still exist.




www.vishay.com                                                                                                        Document Number 88854
4                                                                                                                                 24-Apr-07

								
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