E2E0008-38-94
This version: Sep. 1998
¡ Semiconductor
¡ Semiconductor MSM5052
Previous version: Mar. 1996
MSM5052
Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM5052 is a low-power microcontroller manufactured in complementary metal-oxide
semiconductor technology. Integrated into a single chip are ROM, RAM, crystal oscillator, voltage
doubler, timer, LCD driver, input port, output port, and thermistor-based temperature measuring
circuit.
Using an on-chip ROM reduces power consumption.
The MSM5052 is widely used in electronic products requiring low-power operation, for
example, thermometer and clinical thermometer.
FEATURES
• Low power consumption
• Internal ROM : 1280 ¥ 14 bits
• Internal RAM : 62 ¥ 4 bits
• I/O port
Input port : 2 ports ¥ 4 bits
Output port : 1 port ¥ 4 bits
1 port ¥ 1 bit
• 4 ¥ 4 key matrix input is available by using K1 to K4 and M1 to M4
• 26 LCD drivers (1/2 duty, 1/2 bias, 52 segments)
• 42 instructions
• Minimum instruction execution time : 122.1 ms (Display instruction cycle: 244.2 ms)
• 1.5 V operating voltage (Built-in LCD drive voltage doubler)
• Buzzer function
• Built-in thermistor-based temperature measuring circuit
• Crystal oscillator : 32.768 kHz
• Package options:
56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM5052-¥¥¥GS-K)
56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM5052-¥¥¥GS-2K)
80-pin plastic QFP (QFP80-P-1420-0.80-BK): (Product name : MSM5052-¥¥¥GS-BK)
Chip (Chip size 4.77 mm ¥ 4.36 mm) : (Product name : MSM5052-¥¥¥)
¥¥¥ indicates a code number.
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¡ Semiconductor
BLOCK DIAGRAM
DIN0
to
DIN3 DATA RAM
BUZZER DOUT0 62 ¥ 4 bits
BD to
DRIVER MPX ACC DOUT3
A6 to A4 A3 to A0
MPX
C ALU P
OUTPUT REGISTER
LD PORT Z
OUTPUT MPX
M1 to M4 PORT DISPLAY SEGMENT
(M1-M4) LATCH OUT 1
to
and SEGMENT
INPUT DRIVER OUT 26
K1 to K4 PORT COM 1
(K1-K4)
COM 2
INPUT
S1 to S4 PORT DOUT13 to DOUT0 INSTRUC
PRO- -TION
(S1-S4) GRAM A0
MPX PROGRAM ROM DECODER
COUN- to
FMT TER A10 1280 ¥ 14 bits
REGISTER
COUNTER
XT
TIMING
GENERATOR RC
XT OSCILLATOR
MSM5052
OSC OSC OSC OSC VDD VSS1VSS2 VCP VCM RESET T1 T2 T3 T4 T5
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TH R C IN
¡ Semiconductor MSM5052
PIN CONFIGURATION (TOP VIEW)
53 COM1
56 SEG3
55 SEG2
54 SEG1
45 VSS2
44 VSS1
49 VDD
46 BD
43 NC
52 T3
51 T1
50 T2
48 T4
47 T5
SEG4 1 42 NC
SEG6 2 41 OSC TH
SEG8 3 40 OSC R
SEG9 4 39 OSC IN
SEG10 5 38 OSC C
SEG12 6 37 K4
SEG13 7 36 K3
SEG14 8 35 K2
SEG15 9 34 K1
SEG18 10 33 LD
SEG20 11 32 M4
SEG21 12 31 M3
SEG22 13 30 M2
SEG23 14 29 M1
SEG24 15
SEG25 16
COM2 17
XT 18
NC 19
XT 20
VDD 21
RESET 22
VCP 23
VCM 24
S1 25
S2 26
S3 27
S4 28
NC: No-connection pin
56-Pin Plastic QFP
Note: SEG5, SEG7, SEG11, SEG16, SEG17, SEG19, and SEG26 are not connected to package
pins.
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¡ Semiconductor MSM5052
PIN CONFIGURATION (TOP VIEW) (continued)
78 COM1
80 SEG2
79 SEG1
66 VSS2
65 VSS1
67 VDD
77 NC
76 NC
75 NC
72 NC
68 BD
74 T3
73 T1
71 T2
70 T4
69 T5
SEG3 1 64 NC
SEG4 2 63 NC
SEG5 3 62 OSC TH
SEG6 4 61 NC
SEG7 5 60 OSC R
SEG8 6 59 NC
SEG9 7 58 OSC IN
SEG10 8 57 NC
SEG11 9 56 OSC C
SEG12 10 55 K4
SEG13 11 54 NC
NC 12 53 K3
SEG14 13 52 K2
SEG15 14 51 NC
SEG16 15 50 K1
SEG17 16 49 LD
SEG18 17 48 M4
SEG19 18 47 M3
SEG20 19 46 M2
SEG21 20 45 NC
SEG22 21 44 M1
SEG23 22 43 NC
SEG24 23 42 NC
SEG25 24 41 S4
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
SEG26
COM2
XT
NC
XT
NC
NC
VDD
RESET
VCP
NC
VCM
NC
S1
S2
S3
NC: No-connection pin
80-Pin Plastic QFP
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¡ Semiconductor MSM5052
PAD CONFIGURATION
Pad Layout
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG24 SEG3
SEG25 SEG2
SEG26 SEG1
COM2 COM1
XT
NC
XT
T3
VDD T1
RESET T2
VCP T4
T5
VCM
S1 BD
VDD
S2 VSS2
S3 VSS1
S4
M1 M2 M3 M4 LD K1 K2 K3 K4 OSC OSC OSC OSC
C IN R TH
Chip size 4.77 ¥ 4.36 (mm)
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¡ Semiconductor MSM5052
PIN DESCRIPTIONS
Symbol Description
VDD Ground.
VSS1 Power source (–1.5 V).
VSS2 Power source for LCD driver (–3.0 V). This pin is connected to the VDD pin through a 0.1 mF
capacitor.
VCP, VCM Booster capacitor connection pins. VCP pin is connected to the VCM pin through a 0.1 mF capacitor.
XT, XT Input and output pins of oscillator inverter. A 32.768 kHz crystal is connected to these pins.
Pins to test internal logic. T1, T2, T4, and T5 are pulled down to VSS1. T3 is the output. Test pins
T1 to T5
are normally open.
Pin to clear internal logic, pulled down to VSS1. After power is turned on, the MSM5052
RESET
can be reset by this pin.
BD Buzzer output.
OSC TH, OSC R, Pins to RC oscillation circuit for temperature detection. These are the fundamental resistor,
OSC C, OSC IN thermistor, and capacitor connection pins.
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¡ Semiconductor MSM5052
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Condition Rating Unit
Power Supply Voltage VSS1-VDD Ta = 25°C –2.0 to +0.3 V
Input Voltage VIN Ta = 25°C VSS1 – 0.3 to +0.3 V
Storage Temperature TSTG — –55 to +125 °C
Operating Temperature Top — –20 to +75 °C
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 0 V, VSS1 = –1.55 V, VSS2 = –3.0 V, C1 = 30 pF, Ta = 25°C)
Parameter Symbol Condition Min. Typ. Max. Unit
VSS1 Operating Voltage VSS1 VSS1 pin –1.65 –1.55 –1.25 V
Temperature sampling off
Power Supply Current 1 IDD1 — 3.0 *1 — mA
(Refer to measuring circuit)
Temperature sampling on
Power Supply Current 2 IDD2 — 100 *2 — mA
(Refer to measuring circuit)
Within 10 seconds, VSS1 pin
Oscillation Start Voltage VOSC — — –1.45 V
(Refer to measuring circuit)
IOH1 VOH1 = –0.2 V — — –4
Output Current 1
IOM1 VOM1 = VSS1 ±0.2 V –4 — +4 mA
COM
IOL1 VOL1 = –2.8 V 4 — —
Output Current 2 IOH2 VOH2 = –0.2 V — — –0.4
mA
SEGMENT IOL2 VOL2 = –2.8 V 0.4 — —
Output Current 3 IOH3 VOH3 = –0.4 V — — –400
mA
C, R, TH IOL3 VOL3 = –1.15 V 400 — —
Output Current 4 IOH4 VOH4 = –0.4 V — — –100
mA
M1-M4, LD IOL4 VOL4 = –1.15 V 10 — —
Output Current 5 IOH5 VOH5 = –0.4 V –200 — –50
mA
BD IOL5 VOL5 = –1.15 V 3 — —
Input Current IIH VIN = 0 V 3 — 30
mA
S1-S4, K1-K4 IIL VIN = –1.55 V –0.2 — —
Built-in CD Capacitance CD — — 25 — pF
*1 The typ. value varies depending on the application program.
*2 The typ. value varies depending on the application program and RC thermistor to be used.
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¡ Semiconductor MSM5052
Measuring circuit
VCP
OSC IN C2
C4 VCM
OSC C
OSC R MSM5052 XT
R1 Crystal
OSC TH 32.768 kHz
R2 XT
C1 C1 : 20 pF
C2, C3 : 0.1 mF
VDD VSS1 VSS2 C4 : 3000 pF
R1, R2 : 10 kW
C3
A V
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¡ Semiconductor MSM5052
APPLICATION CIRCUIT
LCD
TH COM2 SEGMENTS COM1
OSC TH M1 HI
Alarm output
OSC R M2 LO
R1
OSC IN M4 Data
R2 Serial data
C1 LD Latch
OSC C
MSM5052 BD
XT VSS1
C2 (CD = 25 pF)
32.768 kHz XT VDD Piezo
VCP
C3 RESET
VCM R1 : 33 kW
*1
VSS2 S4 S2 S1 S4 K2 K3 K1 R2 : 20 kW
TH : 40BT-5
40 kW ±10% at 25°C
B = 3550 ±2%
C4
*2 C1 : 680 pF
C2 : 5 to 35 pF
C/F S2 S1 C3 : 0.1 mF
1 2 3 4 5 C4 : 0.1 mF
*1 Inner switch or pad on PCB 1 Thermometer one-second sampling
*2 Bonding option 2 Thermometer 10-second sampling
3 The highest temperature alarm
4 The lowest temperature alarm
5 Clock
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¡ Semiconductor MSM5052
PACKAGE DIMENSIONS
(Unit : mm)
QFP56-P-910-0.65-K
Mirror finish
Package material Epoxy resin
Lead frame material 42 alloy
Pin treatment Solder plating
Solder plate thickness 5 mm or more
Package weight (g) 0.36 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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¡ Semiconductor MSM5052
(Unit : mm)
QFP56-P-910-0.65-2K
Mirror finish
Package material Epoxy resin
Lead frame material 42 alloy
Pin treatment Solder plating
Solder plate thickness 5 mm or more
Package weight (g) 0.43 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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¡ Semiconductor MSM5052
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material Epoxy resin
Lead frame material 42 alloy
Pin treatment Solder plating
Solder plate thickness 5 mm or more
Package weight (g) 1.27 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
12/12