Docstoc

PRODUCT SPECIFICATION A

Document Sample
PRODUCT SPECIFICATION A Powered By Docstoc
					                                PRODUCT SPECIFICATION


       TITLE :                       UNIVERSAL SERIAL BUS
                                  MICRO – USB RECEPTACLES

                                        TABLE OF CONTENTS


                             1.0 SCOPE

                             2.0 PRODUCT DESCRIPTION

                               2.1 DESIGN AND CONSTRUCTION

                               2.2 MATERIAL AND PLATING

                             3.0 APPLICABLE DOCUMENTS

                               3.1 RATING

                               3.2 PERFORMANCE AND TEST DESCRIPTION

                               3.3 TEST REQUIREMENTS AND PROCEDURES

                             4.0 TEST SEQUENCE

                             5.0 RE-FLOW CONDITION

                             6.0 WRENCHING CONDITION

                             7.0 PACKAGING




REVISION: ECR/ECN INFORMATION: TITLE:                                                           SHEET No.
                                             MICRO-USB RECEPTACLE
          EC No: SH2009-0286
  A                                              CONNECTORS                                        1 of 7
          DATE: 2008/08/15
DOCUMENT NUMBER:                 CREATED / REVISED BY:    CHECKED BY:                 APPROVED BY:
      PS-105017-001                      XJSONG             JTIAN                        HWWANG
                                                              TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
                                   PRODUCT SPECIFICATION


  1.0 SCOPE
       This specification defines the performance for the micro USB receptacle products.


  2.0 PRODUCT DESCRIPTION
       2.1 Design and Construction

           Construction and physical dimensions shall be specified on the applicable sales drawing.
           Connector consists of a metal shield, a plastic housing, 5 contacts.
           Solder components shall meet Lead-Free soldering requirements and the connectors shall be RoHS
           Compliant.
       2.2 Materials and Plating

           Refer to respective Molex sales drawings for information on materials, plating and marking


  3.0 APPLICABLE DOCUMENTS

       In the event of conflict between the requirements of this specification and the sales drawing,
       the sales drawing shall take precedence. In the event of conflict between the requirements
       of the specification and the referenced documents, this specification shall take precedence.

       EIA-STANDARD-364: ELECTRICAL CONNECTOR/SOCKET TEST PROCEDURES
                         INCLUDING ENVIRONMENTAL CLASSIFICATIONS

      3.1 Rating

                 Item                                                    Standard
          Rated Voltage (Max.)                100 V AC (rms)
                                              Signal (Pins 2,3,4) : 1.0A
         Rated Current (Max.)
                                              Power (Pins 1,5): 1.8 A
      Operating Temperature Range              -20 ℃ ~ +85 ℃ (Including Terminal Temperature Rise)
    Shipping and Storage Temperature
                                              -40 ℃ ~ +85 ℃
                 Range
       Ambient Temperature (Ta):              25 °C ±2 ℃


      3.2 Performance and Test Description

           The connectors shall be designed to meet the electrical, mechanical and environmental performance
      requirements specified in Para. 3.3




REVISION: ECR/ECN INFORMATION: TITLE:                                                                        SHEET No.
                                                    MICRO-USB RECEPTACLE
           EC No: SH2009-0286
  A                                                     CONNECTORS                                              2 of 7
           DATE: 2008/08/15
DOCUMENT NUMBER:                     CREATED / REVISED BY:            CHECKED BY:                  APPROVED BY:
      PS-105017-001                          XJSONG                      JTIAN                        HWWANG
                                                                           TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
                                 PRODUCT SPECIFICATION

      3.3 Test Requirements and Procedures

      3.3.1 Electrical Performances


            Item                  Requirement                            Test Condition
                                                         Mated plugs, measure by dry circuit, 20 mV DC
        Low Level
                                                         Max. open circuit,100mA Max.
     Contact Resistance           30 mΩ Max.             Except wire conductor resistance.
          (initial)                                      EIA - 364 -23
                                                         Mated plugs, apply 100V DC for 1 minute
    Insulation Resistance        1000 MΩ Min.            between adjacent terminal or ground.
                                                         EIA - 364 – 21
                                                         Mated plugs, apply 100V AC(rms) at 60 Hz for 1
         Dielectric
                                  No Breakdown           minute between adjacent terminal or ground.
    Withstanding Voltage                                 EIA - 364 -20
                                                         Mated plugs and measure the temperature rise of
                                                         contact when the maximum AC rated current is
      Temperature Rise             30 oC Max.            passed
                                                         EIA - 364 - 70
                                                         Measured between adjacent circuits of un-
    Contact Capacitance             2 pF Max.            mated connectors at 1kHz.
                                                         EIA - 364 – 30

      3.3.2 Mechanical Performances


          Item                    Requirement                            Test Condition
                                         35N (3.57kgf)
      Mating / un-        Mating force                     Mating / un-mating at a rate of 12.5
                                             Max.
      mating force                                         mm / min.
                          Un-mating       8N (1.02kgf)     EIA - 364 - 13
        (initial)
                             force            Min.
                            Contact     ΔR =10mΩ
                           Resistance        Max.
                                        35N (3.57 kgf)     When Mated / un-mated up to 10000 cycles
                          Mating force
       Durability                            Max.          repeatedly at Max. rate of 500 cycles / hr.
                          Un-mating      8N (0.82 kgf)     EIA - 364 - 09
                             force            Min.
                          Appearance    No breakdown




REVISION: ECR/ECN INFORMATION: TITLE:                                                                   SHEET No.
                                                MICRO-USB RECEPTACLE
          EC No: SH2009-0286
  A                                                 CONNECTORS                                             3 of 7
          DATE: 2008/08/15
DOCUMENT NUMBER:                   CREATED / REVISED BY:         CHECKED BY:                  APPROVED BY:
      PS-105017-001                      XJSONG                     JTIAN                        HWWANG
                                                                      TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
                                 PRODUCT SPECIFICATION



 3.3.3 Environmental Performances


          Item                       Requirement                               Test Condition
                           Appearance            No Damage        Mate plugs and subject to the following
                                                ΔR =10mΩ          vibration conditions:
                        Contact Resistance                        Random Vibration
                                                    Max.
        Vibration                                                 3 mutually perpendicularly.
                                                                  10~2000Hz, 0.02G2/Hz
                                                1 microsecond
                          Discontinuity                           20 min per plane
                                                    Max.          EIA - 364 – 28

                           Appearance             No damage       Mate plugs and subject to the following
                                                                  shock conditions, 3 shocks shall be
                                                                  applied along 3 mutually perpendicular
                                                ΔR =10mΩ          axes, passing DC 100 mA current during
       Mechanical       Contact Resistance                        the test. (Total of 18 shocks)
        Shock                                      Max.
                                                                  Test Pulse : Half Sine
                                                                  Peak Value : 30G
                                                1 Microsecond     Duration : 11 ms
                          Discontinuity                           EIA - 364 - 27
                                                    Max.
                           Appearance            No damage        Mate plugs and expose to 85 +/- 2 ℃ for
                                                ΔR =10mΩ          120 hours, Upon completion of the
                        Contact Resistance                        exposure period, the test specimens shall
                                                   Max.
    Temperature Life                                              be conditioned at ambient room
                            Insulation
    (Heat Resistance)                          1000 MΩ Min.       conditions for 1 to 2 hours, after which
                            Resistance                            the specified measurements shall be
                                                                  performed
                        Dielectric Strength     No Breakdown       EIA - 364 -17B
                                              There shall be no
                           Appearance         remarkable          Test condition:
                                              corrosion           Cycle the mate connectors between
                                                                   25℃±3℃ at 80%±3% RH and
                                                 ΔR =10mΩ
                        Contact Resistance                        65℃±3℃ at 50%±3% RH.
                                                   Max.
    Cyclic Humidity                                               Ramp times should be 0.5 hour and
                                                                  dwell times should be 1.0 hour. Dwell
                        Dielectric Strength     No breakdown      times start when the temperature and
                                                                  humidity have stabilized within the
                                                                  specified levels.
                            Insulation                            Perform 24 cycles.
                                               1000 MΩ Min.       EIA-364-31
                            Resistance




REVISION: ECR/ECN INFORMATION: TITLE:                                                                    SHEET No.
                                                  MICRO-USB RECEPTACLE
          EC No: SH2009-0286
  A                                                   CONNECTORS                                            4 of 7
          DATE: 2008/08/15
DOCUMENT NUMBER:                   CREATED / REVISED BY:          CHECKED BY:                  APPROVED BY:
      PS-105017-001                       XJSONG                     JTIAN                        HWWANG
                                                                       TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
                                 PRODUCT SPECIFICATION

                                                                   Mate plugs and subject to the flowing
                           Appearance            No Damage         conditions for 5 cycles, Upon
                                                                   completion of the exposure period, the
                                                                   test specimens shall be conditioned at
                                               ΔR =10mΩ            ambient room conditions for 1 to 2
                        Contact resistance
     Thermal shock                                Max.             hours, after which the specified
     (Temperature                                                  measurements shall be performed.
                        Dielectric Strength    No breakdown        1 cycle
        cycling)
                                                                     a) -55 +/- 3 ℃ 30 minutes.
                            Insulation                               b) +85 +/- 2 ℃ 30 minutes.
                                               1000 MΩ Min.        EIA-364-32C
                            Resistance
                                                              Mate plugs and expose to the following
                                                              salt mist conditions. Upon completion of
                                                By visual     the exposure period, salt deposits shall
                           Appearance      inspection without be removed by a gentle wash or dip in
                                             noticeable rust. running water, after which the specified
                                                              measurements shall be performed.
        Salt spray                                            NaC1 solution
                                                              Concentration: 5 +/- 1 %
                        Contact Resistance ΔR =10mΩ Max. Spray time: 48 +/- 4 h
                                                              Ambient Temperature: 35 +/- 2 ℃
                                                              EIA - 364 -26
                                                                   Dip solder-tails in flux then immerse in
                                              95% of immersed
                                                                   solder bath at 245+/- 5 ℃ up to 0.5 mm
      Solder -ability     Solder Wetting      area must show no
                                                                   from the bottom of the housing for 4 ~ 5
                                              voids or pin holes   seconds (EIA - 364 -52 Category 2)
                                                                   For procedures other than specified
                                                                   below, refer to IEC PUB. 68-2-20. Test
                                                                   Tb Method 1A or 2

                        Without any deformation of case or         Solder bath method
                        excessive looseness of the terminals       Solder temperature: 260 +/- 5 ℃
                        (pins).                                    Immersion time: 10 +/- 1 second
      Resistance to                                                Thickness of PCB: 0.8 mm
                        Electrical characteristics shall be
      soldering heat
                        satisfied.                                 Solder iron method
                                                                   Solder temperature: 350 +/- 10 ℃
                                                                   Immersion time: 3 +/- 1 second

                                                                   However, excessive pressure shall not be
                                                                   applied to the terminal
                        No any damage after reflow
                                                                   Reference reflow condition at Para. 5.0




REVISION: ECR/ECN INFORMATION: TITLE:                                                                     SHEET No.
                                                 MICRO-USB RECEPTACLE
           EC No: SH2009-0286
  A                                                  CONNECTORS                                              5 of 7
           DATE: 2008/08/15
DOCUMENT NUMBER:                   CREATED / REVISED BY:           CHECKED BY:                  APPROVED BY:
      PS-105017-001                        XJSONG                     JTIAN                        HWWANG
                                                                        TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
                                    PRODUCT SPECIFICATION

  4.0 TEST SEQUENCE
   All samples have to be soldered on PCB and reflow two times total before measuring and testing.

                     Item             A       B       C       D       E         F      G       H
                      Contact
              1                     ①④      ②⑥      ①⑥      ①③      ②④
                    Resistance
                     Insulation
              2                                     ②⑦
                    Resistance
                     Dielectric
              3                                     ③⑧
                      Strength
                      Contact
              4                              ③
                    capacitance
              5      Durability              ④

              6      Vibration       ③
                   Mechanical
              7                      ②
                     Shock
                   Temperature
              8                                                      ③
                      Life
              9      Humidity                        ④

                      Thermal
             10                                      ⑤
                       shock
             11      Salt spray                              ②
                   Temperature
             12                                                                ①
                      Rise
                   Mating / un-                                      ①
             13                             ①⑤
                   mating force                                      ⑤
             14    Solder-ability                                                      ①
                Resistance to
             15                                                                                ①
                soldering heat
             Number of sample         5       5       5       5       5         5       5      5




  5.0 RE-FLOW CONDITION

    Reflow soldering profile for soldering heat resistance testing
    The reflow profile specified in this section describes expected maximum heat exposure of components during
    the reflow process of MP product PWBs. Temperature is measured on top of component. All components have
    to tolerate at least this profile three times (3x) without affecting electrical performance, mechanical
    performance or reliability.


REVISION: ECR/ECN INFORMATION: TITLE:                                                                       SHEET No.
                                                  MICRO-USB RECEPTACLE
           EC No: SH2009-0286
  A                                                   CONNECTORS                                               6 of 7
           DATE: 2008/08/15
DOCUMENT NUMBER:                    CREATED / REVISED BY:          CHECKED BY:                     APPROVED BY:
      PS-105017-001                        XJSONG                     JTIAN                          HWWANG
                                                                          TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
                                    PRODUCT SPECIFICATION


                 Pb-free reflow profile requirements for soldering heat resistance
                 Parameter                         Reference         Specification
                 Average        temperature                          2.5°C/s
                                gradient
                 in preheating
                 Soak time                         tsoak             2-3 minutes
                 Time above 217°C                  t1                Max 60 s
                 Time above 230°C                  t2                Max 50 s
                 Time above 250°C                  t3                Max 10 s
                 Peak temperature in               Tpeak             255°C (–0/+5°C)
                                reflow
                 Temperature gradient in                             Max -5°C/s
                  cooling


                                                          Not to scale, for reference only
                                Temperature
                                Temperatur

                        Tpeak
                         peak
                         T33

                         T2
                          2

                         T1
                          1




                                                                     t3
                                                                      t3            Time
                                              tsoak                    t2
                                                                    t2
                                                                    t1


                                  Reflow profile for soldering heat resistance testing.




 7.0 PACKAGING
    Parts shall be packaged to protect against damage during handling, transit and storage.
    Receptacles will be supplied in tape and reel.




REVISION: ECR/ECN INFORMATION: TITLE:                                                                          SHEET No.
                                                      MICRO-USB RECEPTACLE
           EC No: SH2009-0286
  A                                                       CONNECTORS                                              7 of 7
           DATE: 2008/08/15
DOCUMENT NUMBER:                      CREATED / REVISED BY:           CHECKED BY:                    APPROVED BY:
      PS-105017-001                            XJSONG                       JTIAN                       HWWANG
                                                                             TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC

				
DOCUMENT INFO
Shared By:
Categories:
Tags:
Stats:
views:1
posted:10/21/2011
language:English
pages:7